Yu Dinglu, vice president of Applied Materials Group and president of Taiwan Region, said that in the future, smart cities, smart factories, smart cars, smart planes and social networks will have a daily burst of data processing, storage and computing as well as interconnection. One hundred billion of data, one can imagine the need to propose innovative solutions to solve the problem of computing.
Yu Dinglu said that huge amounts of data bring more innovation to the cloud and terminal devices. In order to meet the demand of high-speed computing, the semiconductor manufacturing process has become more complicated. In order to maintain the high performance and keep the chip size continuously shrinking, the semiconductor materials are expected to evolve.
It is reported that when the semiconductor metal deposition process into the following 7-nanometer technology node, the link chip billions of transistor wire circuit will gradually become a technical bottleneck. The reason is that, on the one hand to expand the number of transistors on the chip, and on the one hand But also the pursuit of system integration chip package to reduce the wire and thus increase the transistor density.
However, reducing the cross-sectional area of the wire leads to a reduction in the volume of the conductive area, which results in increased resistance, which in turn hinders the best performance. The bottleneck of this hysteresis is dependent on the barrier layer and on the inner liner microforming process More innovations to improve conductive properties in narrower spaces have made it possible to replace "cobalt" with traditional copper materials.
On the other hand, when the process of the chip reaches below 10 nanometers, the very thin film in the wire must be kept in a well-controlled environment.Therefore, instead of using copper instead of copper as a new material for the wire and lowering the resistance, Through its metallization system, Endura platform, it is also deposited on key barriers and seed layers to promote advanced process technology.
At the same time, the system also has a multi-functional modular layout capabilities that can support up to eight process chamber to facilitate the semiconductor plant can be physical vapor deposition, chemical vapor deposition and atomic layer deposition process technology simultaneously on the same platform, the use of a single integration Program to create a complex thin film stack structure.
To sum up, the semiconductor manufacturing process is becoming more and more complicated due to the rise of big data and AI. Therefore, the innovation of material engineering is very important.It is pointed out that the company not only continued to improve the metal deposition process, but also used innovative materials to accelerate the realization of semiconductors Advanced manufacturing process and low-power computing efficiency goals.