First, the overall requirements
(A) guiding ideology
In-depth study and implementation of the19th CPC National Congress spirit, with Xi Jinping a new era of socialism with Chinese characteristics as a guide, in-depth implementation of President Xi Jinping twice inspections of Beijing's important speech and work in Beijing a series of important instructions, unswervingly implement new Development concept and firmly grasp the strategic positioning of the capital city. With the main line of carrying the national strategy of the integrated circuit industry, laying new frontiers and supporting the transformation and upgrading, the Company concentrated its resources and focused its investment on the breakthrough strategy of "core enterprises - key areas - key products" , Continue to improve the level of IC industry development, to speed up the construction of highly sophisticated economic structure to provide strong support.
(B) the basic principles
Adhere to focus on development.Collection of central resources, focus on supporting industry leaders, targeting key areas of core products to increase investment, accelerate talent pooling and technological breakthroughs.
Adhere to innovation and development, support the building of innovative capabilities of enterprises and research institutes in Beijing, and guide enterprises to increase R & D investment and achieve high-end technology development.
Adhere to open cooperation and encourage international and domestic integrated circuit enterprises and trade organizations to set up R & D centers and operation centers in Beijing and carry out international exchange activities, and support exchanges and cooperation between enterprises and research institutes in Beijing and overseas institutions in technology and personnel exchanges.
Adhere to the green development.Industry integrated circuit manufacturing industry to support the use of international advanced water-saving, energy saving, pollutant disposal process, building the country's highest level of green factory.
(C) the overall goal
By 2020, it will build a technological innovation base of integrated circuit industry with international influence, promote the continuous improvement of industrial scale, continuous optimization of industrial structure and continual breakthrough of key technologies. The key areas of IC design technology have reached the international advanced level. Chip support capabilities to further enhance the mass production of domestic core equipment significantly enhance the international competitiveness of a group of key enterprises to grow into the industry leader in talent introduction and training system to meet the basic needs of the development of the industry.
Second, the main task
(A) to strengthen the construction of innovative platform
1. Mission Objectives: To integrate domestic high-quality innovative resources and build a world-class innovation platform for state-level integrated circuits, to break through the strategic bottleneck faced by China's IC industry, to improve the distribution of systematic intellectual property rights, and to change our country's technological upgrading and dependence on the introduction and control of others The situation.
2. Implementation Contents Support the construction of IC Innovation Research Institute and aim at the frontier integrated circuit technology in the world to carry out R & D to promote the transformation of innovation achievements. Support backbone chip manufacturers to jointly build Tsinghua University, Peking University and other integrated circuit engineering innovation centers in Beijing , Carry out R & D of process technology of featured products, development and construction of intellectual property libraries, R & D and verification of domestic equipment and materials, support innovation platform and all-round cooperation with industry and enterprises, promote application of advanced technologies and incubation of products, and enhance service capabilities for industrial technology development.
(B) to achieve a breakthrough in core design and technology innovation
1. Mission Objectives To enhance the scale and level of the integrated circuit design industry in the city, the key enterprise chip design capability will reach 7 to 10 nanometers, and 3 to 5 enterprises will grow into international advanced enterprises or domestic leading enterprises. And technology innovation service platform to achieve key technological breakthroughs in high-end general purpose core products, industrial control and emerging frontier fields, focusing on the forward-looking layout of the core chips in the fields of IoT, artificial intelligence, cloud computing, mobile communications and automotive electronics.
2. Implementation Contents Each year, 3 to 5 backbone design enterprises are encouraged to increase R & D investment in innovative technologies and encourage enterprises to actively participate in national science and technology plans and major projects. Key enterprises are encouraged to set up overseas R & D bases to carry out more cooperation with overseas enterprises or R & D institutions Level cooperation to support key enterprises to set up special funds in emerging areas, and industry alliances, upstream and downstream industry chain enterprises to participate in the investment in emerging technologies to seize the commanding height of the future development. The establishment of integrated circuit design industry service system, and continuously improve the Zhongguancun IC Design Park Public service platform function Supports the development of integrated circuit industry intellectual property alliance, technical service platform and other industry support platform.
(III) Promote coordinated development of the entire industrial chain with advanced manufacturing as the core
1. Mission Objectives: The backbone design enterprises and manufacturing enterprises should strengthen their strategic cooperation, the proportion of Chinese-made OEM customers should be raised, and the dependence on the IC industry should be effectively improved.
2. Implementation Contents Take advantage of the leading edge of the advanced manufacturing process of integrated circuits in the city, support the construction of intellectual property repositories for manufacturing enterprises and improve the service capability of domestic design enterprises, promote the scale-up of production capacity of 12-inch wafer production lines and accelerate the development of advanced and featured technology platforms Construction, and strive to meet the local design business foundry needs support 8-inch wafer production line, 8-inch micro-electromechanical systems (MEMS) production line and the second and third generation semiconductor production line. Adhere to the market demand and technology development combine to promote memory , Image sensors and other segments of the process of research and development and industrialization of the characteristics of sub-areas to support the vertical integration manufacturing (IDM) project to play a third-party public service agency role to build docking platform for supply and demand to create conducive to the upstream and downstream industry chain in-depth cooperation environment of.
(D) improve the self-supporting equipment and materials capabilities
1. Mission Objectives: Localized supporting capabilities and market share of domestically-made integrated circuit equipment, components and key materials have been significantly improved, focusing on fostering world-class enterprises in the field of integrated circuit equipment.
2. Implementation Contents To organize the implementation of major national science and technology as the starting point, and strive to complete the key enterprises in Beijing to complete the development of key technologies, core equipment products into the production line applications, reached the international advanced level. Support for lithography optical systems, light sources, Core components R & D and industrialization, the development of the domestic lithography machine to provide support to support the backbone enterprises mergers and acquisitions to reorganize the relevant domestic and international enterprises to enhance the overall strength of China's integrated circuit equipment industry in support of manufacturing enterprises based on advanced equipment in the pilot line , production line.
Third, safeguards
(A) to strengthen organizational leadership. The establishment of the city integrated circuit industry development joint conference, responsible for the integrated circuit industry major projects, the overall coordination of key work to study and solve the industrial difficulties in the process of promoting key issues. Municipal Development and Reform Commission, Municipal Commission of Education, Municipal Science and Technology Commission, Municipal Economic and Information Technology Commission, Municipal Finance Bureau, Municipal Bureau of Human Resources and Social Security, Municipal Planning Commission, Municipal Environmental Protection Bureau, Municipal Water Affairs Bureau, Municipal SASAC, Municipal Intellectual Property Bureau, Zhongguancun Administrative Committee, Haidian District Government, Shunyi District Government, Beijing Economic and Technological Development Zone as a member of the CMC, the Joint Meeting Office is located in the Municipal Economic Information Commission.
(B) increase capital investment .Coordinate the use of government investment guide funds, government investment platform to attract national industrial investment funds and social capital investment in key integrated circuit industry projects .Further increase financial and financial support efforts to fully support the national science and technology major projects in Beijing Landing to protect the construction of major municipal projects.
(C) improve the mechanism of personnel training to support the relevant institutions of higher learning in Beijing to increase integrated circuit discipline construction and personnel training efforts to establish and improve integrated circuit professionals training and training system, focusing on training complex leading talent development of talent introduction support policies to attract Outstanding talents at home and abroad in the field of integrated circuits are coming to Beijing to speed up the construction of incentive mechanisms for state-owned integrated circuit enterprises.
(D) to optimize the industrial layout. Promote the intensive development of integrated circuit industry to support the key layout in Haidian District, IC design and innovation platform, in Beijing Economic and Technological Development Zone, the focus of layout technology and manufacturing innovation platform and integrated circuit manufacturing, equipment Industry, advanced packaging and packaging industry, integrated circuit design industry, the layout of the third generation semiconductor industry in Shunyi District, support the integrated circuit materials industry and general packaging manufacturing industry in Hebei Province, the formation of complementary advantages and common development pattern of Beijing, Tianjin and Hebei.
(V) Strengthen Intellectual Property Protection Strengthen the layout of patents in key frontier and emerging fields and promote the early-warning mechanism and public service platform for intellectual property in key industries, support enterprises to develop, evaluate and test standards based on their own intellectual property rights and promote independent standards To become an international standard Support intellectual property operators to carry out IPR operations in the field of integrated circuits, give full play to the role of China (Beijing) IPR Protection Center, realize the rapid acquisition, confirmation and safeguard of patents in the field of integrated circuits, establish joint protection, risk sharing, Open sharing of industry intellectual property synergies mechanism.