Recently, TMHW got a copy of Intel's annual review document, which appeared in a magical new SSD.
In the picture, Intel introduced the first generation of 1TB 3D flash SSDs in 2016 on the far left, the second generation in the middle and the third generation on the right next year. Obviously, they represent 2.5 "SATA3, M.2 and BGA packages respectively.
Due to the larger size than the middle of the Intel 600P flash memory chips, foreign media analysis This is a MCP (multi-chip package) SSD, the volume of 1620 (16mmx20mm), 2024, 2228, 2828 four.
Previously, Toshiba had done 1620 BGA package BG3 SSD, fixed on the M.2 interface PCB, take the PCIe 3.0 x2 channel.
The current multi-chip independent packaging, mass production integration is the largest Toshiba 64-layer, but the Die capacity 256Gb (32GB), 16 Die, a total of 512GB, so Intel's Die upgrade to a more ideal 512Gb.
In addition, from the cost and convenience considerations, Intel's new 1TB BGA SSD should also use Host Memory Buffer (HMB) technology, which is not integrated DRAM buffer pool, after all, there is no DRAM factory Intel.
If possible, two weeks later on CES 2018, we have a chance to learn more about the details of this SSD.
