Renesas / Dibotics Partner to Develop Embedded Light Processing Solutions

Renesas Electronics and Dibotics today announced the joint development of automotive-grade embedded optical processing solutions for advanced driver assistance systems (ADAS) and autonomous driving applications. The solutions jointly developed by both parties will allow system builders to develop A real-time 3D Mappin system with high-grade functional safety (FuSa) and low power consumption.

Jean-Francois Chouteau, vice president of Renesas Global ADAS Center, said the company's seamless integration with Dibotics enables high-grade FuSa-capable, real-time, and high-performance solutions for advanced photonics data processing. For driverless applications, Renesas is working to optimize the end-to-end Renesas autonomy platform by working with innovative market partners. Dibotics is providing the market with state-of-the-art technology that changes game rules and is pleased to announce that Their cooperation started.

Today's optical processing, the need to combine high-performance processing platform and advanced embedded software.By combining Renesas high-performance image processing capabilities and low power consumption characteristics of the car with R-Car SoC, simultaneous positioning with Dibotics And Simultaneous Localization And Mapping (3D SLAM) technologies, the two companies together deliver a solution for SLAM on Chip that enables 3D SLAM processing on a single SoC that has traditionally had to be borrowed This is achieved with a high-performance PC, which also enables 3D imaging of optical data alone, eliminating the need for IMU and GPS data, Real-time 3D image system with low power consumption and high level functional safety in automotive system can be realized.

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