The quality of materials has a direct impact on the quality of integrated circuit products, the stable supply of materials and the progress of production, and even the decisive impact on the market price of integrated circuit products. In the past two years, the shortage of silicon wafers, The major manufacturers and packaging, testing and materials companies keep a close relationship is evident.
Of course, in the integrated circuit manufacturing process, not only need such a silicon wafer manufacturing materials, packaging materials also need.
'The consumer electronics and smart wearable sectors are moving toward miniaturization and highly integrated products with ever-increasing demands for packaging materials,' said Brunner, Head of Worldwide Sales, Heraeus Electronics. However, in the fields of automotive electronics and industrial control, how to deal with the material and technical challenges brought by the high-temperature and high-heat-effectiveness? Recently, at the CISES forum in Shanghai, Brunner shared the future semiconductor packaging materials Different areas of development trends.
Towards the material system integration solutions provider
In the field of semiconductor materials, maybe you do not know that Heraeus Electronics can be regarded as an old friend in China. In the second generation of ID cards used by more than 1 billion people in China, the Heraeus electronic composite metal frame is used to install identity information Chips in 2016. Heraeus Electronics has 45% revenue from Greater China in 2016, accounting for the largest share of the consumer electronics and automotive sectors.
Regarding the future direction of semiconductor materials, Mr. Brunner said he is optimistic about the development of advanced packaging and power electronics. Heraeus Electronics will fully solve the technical problems in these two fields.
As the size of semiconductor products becomes smaller, the integration becomes higher and higher, the contact points of the circuit become more subtle, how to connect with these small contact points?
Mr. Brunner said to Jiguo Wang that advanced packaging will play an increasingly important role in the semiconductor industry.Hericos Electronics uses Welco® technology to reduce the particle size of solder powder from the traditional 15-25μm to 5μm, In this series, Heraeus Electronics introduced the WS5112 series of innovative water-soluble solder pastes this year, which can effectively prevent spatter and improve the life and reliability of the product, thereby leading to miniaturization in the advanced system-in-package SiP Fine pitch printing performance to meet the harsh requirements of a variety of processes and applications.
Not only innovative in materials, Heraeus Electronics has also done a great job of achieving performance and reducing costs. '' Gold wire is generally preferred for use with bond wires, but Heraeus Electronics has developed a gold-plated silver Line, not only meeting customer requirements in terms of performance, but also reducing costs, making it ideal for memory chips and LEDs. "Brunner said of the micro-grid.
'If advanced packaging is signal processing, then the biggest difference in power electronics applications is voltage, current and power.' 'Brunner continued,' At present in the field of power electronics applications such as electric vehicles, trains, there are Its dedicated chip products, backplane and connection technology, Heraeus Electronics offers a full range of material solutions. We have thick film and DCB two technologies to meet different customer needs to ensure product cooling and long-term reliability. Different applications require different materials performance.In the field of automotive electronics infrastructure, electric vehicles need to charge 500 kilometers after driving, the charging station needs a complete set of equipment to meet the demand, Heraeus Electronics can provide a full range of material solutions 'Heilongjiang Electronics Innovation and Development Director Dr. Wang Dongyi added.
In terms of customer coverage in the Chinese market, leading companies such as Jiangyin Changyin, ASE, Infineon, ST, NXP and others are all Heraeus electronics partners, and as of now, Heraeus Electronics can provide seven major types of material products, Including bonding wire, sintered silver, chip solder, solder paste, thick film material, ceramic CCL, composite metal frame, etc., can be said that, in addition to all the packaging materials outside the chip, connecting materials and substrates have corresponding Heraeus At the same time, in China and Germany, Heraeus Electronics also offers a complete test system to meet the test of some small customers with no ability to solve test problems.
Mr. Brunner said that in the future it is possible to do OEM for customers, and in conclusion, Heraeus Electronics is not only a material product provider, but also is accelerating toward the material system integration solutions provider.
Help China make its development progress
In June of this year, Dr. Frank Stietz, President of Heraeus' Electronic Global Business Unit, disclosed to Microelectronics that it plans to establish the first Heraeus overseas design center in Shanghai and also the only design and application center in Asia for Localized customer program testing, verification and service, better close to the Chinese customer needs and market trends, shorten the time to market.
It is reported that in 2016, Heraeus Electronics in Shanghai and Changshu R & D team developed for the Chinese market, electronic packaging and assembly materials products, the Chinese market in the global strategy of Heraeus Electronics's position is more and more important. Set micro-grid reporter said that the current Shanghai Design Application Center is in the process of preparation is expected early next year into the product testing phase, the future will have more materials products and solutions from the Shanghai team.
The "chip" has long been a short board made in China, and the State Council promulgated the "Made in China 2025" program of action in 2015 with intelligent manufacturing as the main direction of attack. After the promulgation of the "Outline for the Development of the National Integrated Circuit Industry", the "chip" IC industry's rapid layout.
Brunner pointed out that Germany's tradition is to value innovation, Herae Electronics has been engaged in innovative work in China from the establishment of a design application center in Shanghai point of view, Heraeus Electronics attaches great importance to the Chinese market, hope In this round of development from 'Made in China' to 'Chi-making in China', the rapid development of China's semiconductor industry is promoted.
For example, the products in the advanced packaging industry were originally put in Taiwan, South Korea, Thailand and Malaysia and gradually migrated to the Chinese market in recent years.Mr Brunner said that in the past two years, the output capacity and sales revenue of Chinese packaging enterprises have been kept fast Growth, occupy a certain proportion of advanced packaging products market such as BGA, CSP, WLP, FC, BUMP, SiP, etc., Changjiang Electronics Technology leapt to the third in the world and the No.1 domestic market position. The introduction of products into China, such as solder paste WS5112 is actually a product of Singapore, there are already Chinese customers are being tested.
In addition, Heraeus Electronics is also very concerned about the rapid development of Chinese manufacturers, Huawei products from the quality improvement and pre-research capabilities to see the growth and expansion of Huawei, Chinese manufacturers are no longer followers, but walk in the creation of the most cutting edge.
Finally, Mr. Brunner also revealed plans for the product in 2018. Three of Heraeus's product lines, including cermet, sintered silver, and COB used in the LED market, will introduce more and better Products. In the narrow pitch solder paste series will also have new products available.