Set micro-grid launch micro-channel IC WeChat public number: 'Daily IC', real-time release of major news, every day IC, every day micro-grid, micro-micro!
1. Samsung S9 + sub-spot exposure Snapdragon 845 multi-core performance almost equal to A11;
News (Luo Ming / text) Recently on the new generation of Samsung S9 flagship news began to increase a lot, from the beginning of the appearance of the protective cover, to today's equipped with Snapdragon 845 processor version of the Samsung S9 + Sub-exposure, it is easy to see from the release date of a new generation of flagship Samsung not far away.
Recently a model for the Samsung SM-G965U1 equipment exposure on GeekBench4, Samsung devices from the previous name, it should be equipped with 6GB RAM Samsung S9 +, GeenkBench4 recognition of the chip module SDM845, is easy to see that is Qualcomm's flagship Snapdragon 845 chip.
From run to score, Snapdragon 845 single-core run points 2422, of course, far more than Snapdragon 835, Kirin 970, and Orion 8895, and finally catch up with Apple's A9 processor.
In the multi-core run points, the Snapdragon 845 finally be proud of a, 8351 score directly beyond the A9X / A10, performance almost equal to Apple's A11. Maybe in the next generation of processors, we may be able to see Qualcomm and Apple in the multi-core Performance is equal.
Carry such a powerful performance Qualcomm Snapdragon 845 processor with the Samsung brand appeal, next year's Samsung S9 is really looking forward to.
2. Silicon next year, capital expenditure 1/4 for Jinjiang set up factories;
Set micro-network news, silicon products with Fujian Jinjiang set up factories and advanced capacity measurement and expansion plan, the Board of Directors yesterday (20) through capital expenditures next year will reach 19.2 billion Taiwan dollars, has always been the largest capital expenditure; On February 12 next year, ASEM held the extraordinary shareholders' meeting in synchronicity, taking an important step for the integration of Japan and Silicon.
Silicon products said that next year the substantial increase in capital expenditures, mainly due to many new purchase land and plant, the amount of equipment to be paid next year, coupled with advanced manufacturing processes including wafer-level size package (WLCSP), fan-out package ), 2.5D and 3D IC, such as advanced IC packaging and testing equipment and capacity expansion, require large expenditures.
Silicon goods stressed that of the 19.2 billion yuan, an estimated one-fourth will be used as a new construction project in Jinjiang, Fujian Province. Excluding this investment case, capital expenditures for use next year in Taiwan will be similar to previous years.
Silicon products Fujian Jinjiang plant, located in Jinjiang City, Fujian Province IC Industrial Park land, the amount of land alone that is up to 470 million yuan, the plan mainly with UMC Jinhua investment case,
Plant is also located near Jinhua, silicon products set to invest 45 million US dollars (nearly NT 1.4 billion), the future will be based on memory and logic chip packaging and testing business, and the current plant in Suzhou plant will not conflict with each other.
In addition, the cooperation with the ASE Holding Company was approved by the Mainland's Ministry of Commerce at the end of last month. The Silicon Board of Directors held a shareholders' interim meeting with Sun and Moon on February 12 of the next year to discuss the 'common conversion of shares' agreement signed by both parties. The agreement on the addition of shares and the resolution on share conversion represent a significant step toward meeting the requirements of the Company.
Japan silicon group holding company case, the end of last month by the mainland's Ministry of Commerce conditional release, including the maintenance of ASE and silicon as an independent competitor legal status unchanged in two years, the two sides can only operate independently, and the reasonable price, no intervention Customers choose other suppliers, etc .. Failure to fulfill their obligations, the Mainland Ministry of Commerce will be based on the relevant provisions of the anti-monopoly law to deal with.
3. UMC introduced 40-nanometer SST embedded flash memory process Toshiba's MCU will be used;
UMC today announced that it has introduced a 40nm process platform that combines Silicon Storage Technology (SST) embedded SuperFlash non-volatile memory with the new 40nm Nano SST embedded flash memory, yielding 55nm Cell size reduction of more than 20%, and the overall memory area reduced by 20-30% Toshiba Electronic Components & Storage Products Company has begun to assess the applicability of its microprocessor (MCU) chip UMC 40nm SST technology platform.
Matsui Jun, vice president of mixed signal chip division of Toshiba Electronic Components & Storage Products Company, added: "We look forward to using UMC's 40nm SST technology to help improve the performance of our MCU products. Through cooperation with UMC, through stable manufacturing and cooperation with us The flexible production capacity of our production needs will also allow us to maintain a strong Business Continuity Plan (BCP). "
More than 20 customers and products are in production at various stages of UMC's 55nm SST embedded Flash process, including SIM cards, financial transactions, automotive, Internet of Things, MCUs and other applications.
Ding Wenqi, Associate, UMC Electronics Specialist, said: "We have been receiving customer's attention since the 55nm SST embedded flash memory became the mainstream technology in 2015. The low power consumption, high reliability, Excellent data retention and high endurance features for use in automotive, industrial, consumer and IoT applications We are pleased to bring these products into mass production and are working hard to expand this embedded flash solution to 40 nanoseconds Meter technology platform and is looking forward to bringing the high speed and high reliability benefits of SST to Toshiba and other wafer foundry customers. "
UMC's discrete gate memory cell SST process can be stored for more than 10 years at a temperature of 85 ° C and an operating temperature range of -40 ° C to 125 ° C according to the specifications set by JEDEC.
4. To enhance capacity utilization UMC: the slowdown in the next two years to expand production pace
UMC general manager Jane Shan Jie said on the 19th that UMC will not aggressively expand production in the next two years. The top priority is to strengthen the financial structure and increase capacity utilization. The market is optimistic that UMC's profit performance will gradually increase, which will help the future operational performance.
Jian-Jie Jian pointed out that the next two years, UMC's development will focus on improving the financial structure, so the expansion pace will slow down until the improvement is completed, will start to consider expanding production capacity.
Jian Shan Jie stressed that although UMC slowdown in expansion, but many manufacturers in Taiwan will continue to expand, so the perspective of UMC, can not help but worry about the stability of the power supply or not, I hope the government can have all the power policy considerations.
As for the layout of the DRAM industry, Jian Shan Jie believes that UMC only for the development of DRAM technology in mainland China Jinhua, and no plans to cross into the DRAM industry.
In addition, UMC's board of directors has passed the implementation of capital budget of NT $ 18.99 billion and will simultaneously expand the production capacity of wafer fabs in both Taiwan and mainland China. This year, the overall capital expenditure is estimated at 1.7 billion U.S. dollars, down from 2.2 billion U.S. dollars last year. Has been easing.
Business Times