Equipped with full screen panel to become the new trend of smart mobile phones in the 2018, OLED panel capacity by the leading brand under the situation under the package, Android camp, such as mainland brand mobile phone manufacturers are also actively import TFT-LCD full screen small and medium-sized panels, and be able to take all OLED, LCD driver IC sealed COF Thin film cladding) process application is more extensive, COF process used for large size panels, but with the development of handheld devices, COF gradually entered the past cog (glass-coated crystal packaging) process Shang, and therefore, drive IC duo Qi, South Mao, cof substrate manufacturers Yi-hua Electronics, materials agent access machine, such as supply system, 2018 synchronous look Wang small size panel drive IC seal to COF process. Familiar with the seal test manufacturer, the package type of the driver IC can be distinguished as TCP (Tape Carrier Package), COF (Chip on Film) and COG (Chip on Glass) and other 3 categories, The original mainstream packaging technology is TCP, because technology development has been high density, cof to the wafer bonding mode, so that the chip and soft substrate can be extremely high density phase, the sealing technology towards the wafer particle continuous miniaturization and fine spacing (Fine Pitch) process trends. COF package does not need to form a component hole, directly connected to the tape on the strength of the pin is relatively good, can achieve better than TCP fine spacing results, encapsulation use of two-layer soft base material, flexible, can also reduce the adhesion agent. However, the cost of COF materials is relatively high. Generally speaking, the current COF packaging process is widely used in large size panels, small and medium-sized cog for the mainstream, but with the advent of flexible panels, cog is not suitable for soft displays, COF can take all oled/higher-order LCD camp, Related manufacturers have been the first to see the COF process gradually into the handheld Device panel driver IC seal test field. and to observe the end products of the hot applications, including resolution 4K LCD TV panel, small and medium size OLED panel, using LTPs (low-temperature polycrystalline silicon) process high-level TFT-LCD panel, in fact, the need to adopt COF package, COF substrate demand, terminal applications including television, mobile phones, wear devices and so on , COF substrate Manufacturers Yi-hua electric deep layer of COF products (2-metal COF), but also to grab the application of flexible panels of higher-order intelligent mobile phone and wear device market. Familiar with the seal test manufacturer said, Yi Hua Electric power is expected to be the end of 2017 double COF capacity into the machine, the fastest in the next half 2018 years can provide higher-order OLED driver IC use, Yi Hua single layer cof substrate can already be provided to the medium-order OLED panels. Market expectations, as Apple follows the OLED panel, the future handheld devices for OLED demand is expected to increase, the mainland panel plant in the OLED production line of investment is also quite positive, the current friends, group creators for OLED panels relatively conservative, although the technical threshold is a big problem, but the LCD camp is looking forward to the micro LED Backlight LCD panel can be produced as soon as possible to catch up with market opportunities, I am afraid it remains to be seen. The global COF Factory has about 5, in addition to the predecessor of the Taiwan Live mine electronic electronics, including Han Stemco, lgit, Taiwan Factory qi state's Xin Bao, as well as the Japanese factory flexceed. And the global OLED panel 90% almost all in the hands of Han factory, Apple uses OLED panel business opportunities, Taiwan is currently less inking, but the market is still bullish on the mainland actively invest in OLED panel situation, OLED penetration rate has an opportunity to upgrade, and strive for a very narrow border, no border or even the whole screen design trend, It also makes the COF process more suitable for higher-order LCD panels.
