December 19, 2017, Taoyuan, Taiwan - Manz Yazhi, a market leader in wet process leading equipment, announces that it is entering the semiconductor space with a variety of manufacturing equipment solutions for panel-level fan-out packages (FOPLPs) To help semiconductor manufacturers to increase production with significant cost advantage .Manz Yazhi GM and director of display business Lin Junsheng said: 'This is our cooperation with the well-known semiconductor equipment factory Colorado Lam Research (Lam Research) to set up a joint venture Thai Further steps in the semiconductor industry after Talus Manufacturing Ltd. marks Manz's milestone in accelerating the penetration into the semiconductor space for core technology applications.
Based on many years of experience in wet process equipment for flat panel displays and printed circuit boards and process technology, Manz Technology provides manufacturing solutions for wet-process, coating and laser applications in the panel-level fanout package for the semiconductor industry. Manz Automated integration system to meet customer needs of customized specifications to help customers shorten the product development schedule and the establishment of proprietary process parameters so that products can be sent to the sample as soon as possible and then mass production.
• Chemical Wet Process Equipment: Carrier Cleaner, Photoresist, Copper-Titan Etch and Photoresist • Coating Equipment: The slit nozzle coating technology has been used Widely used in TFT-LCD and touch panel industry, the material utilization rate can reach more than 95%, with appropriate photoresist material, coating uniformity up to 1.5%. • Laser related equipment: Manz and many German laser projectors Sources and optical lens manufacturers to provide equipment including laser drilling, laser cutting and laser de-bounding, and to develop and manufacture the special needs of customers in combination with the system and process integration capabilities.
In recent years, smartphones have taken on the important growth momentum of electronic end products and have been the driving force behind the entire product supply chain, such as the application processors that are introduced into smartphones by using fan-out packaging technology. Traditionally, flip-chip stacks for mobile application processors (Flip Chip Package on Package) Logic chip and memory chip stack, if the switch to fan-out package technology, because the underlying logic chip without carrier, the overall package can save more than 20% of the thickness of the thickness, in line with smart phones Thinning trend .Fan out of the package according to the process of different carriers, can be divided into fan-out wafer-level package and the recently discussed fan-out panel-level package.In accelerating the production cycle and reduce costs, Fan-out panel-level packaging offers significant cost and performance benefits (wafer-level package process area utilization is low <85%, 面板制程面积使用率>95%), also began to attract market attention, packaging manufacturers such as South Korea's Samsung Electronics, ASE, LICP and silicon products, in the direction of technology development has been wafer-level process to panel-level packaging process.
Manz has a strong development team and has been providing wet process solutions for panel-level applications such as the display and printed circuit board industries for many years and has accumulated many successes in a variety of process functions and automation integrations. Stage fan-out package manufacturing process, the board Alice area is almost all related equipment will be faced with the problem, but also related to capacity and process yield. Manz Yazhi technology to provide Conveyor type wet process equipment, unique Carribot embossed design, to ensure that the carrier plate in the transmission process to maintain a smooth and reduce the fragmentation rate through a special nozzle configuration and nozzle swing mechanism to achieve precise chemical flow and temperature control, with online real-time concentration monitoring system, the new chemical The addition of liquid, the maintenance of process stability and the prolonged service life of chemicals while reducing chemical consumption not only ensure a high standard of process uniformity, but also reduce costs.
Manz Production Equipment Solutions Specific Benefits: • Customized Products: Panel-level fan-out packaging is a new requirement in the industry with no common standards for equipment specifications such as panel size, process conditions, etc. Manz offers the most suitable customization to meet customer needs Machine design • Automated integration: with robotic arm or automated lifting platform Transfer panel in and out of process tank for fully automatic production flow • In-Line system design: Conveyor belt conveyor with process condition adjustment panel Output and output capacity better than other types of batch machines. • Patented mechanical press design: For panel-level fan-out package, thanks to Manz unique loading area, Alice board area problem, the transmission process to maintain the formation of panels to achieve the best process results.
Manz Yazhi, general manager and director of monitor business, said: "For decades, Manz Asia-Pacific technology in the display industry production equipment solutions has won deep customer trust, equipment sales in 2017 has more than 3,000 units of the total To prove our strength.The introduction of production equipment solutions for the panel-level fan-out package, Manz formally entered the field of semiconductor manufacturing, in 2018 in the new field can have new gains, to help customers to optimize The production efficiency and reduce the production cost effectively.