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1. A total investment of 22 billion yuan, Silan micro-12-inch production line settled in Xiamen Haicang;
Xiamen Municipal Committee, Haicang Taiwanese investment zone party committee secretary, district secretary Lin Wensheng, Hangzhou Silan Microelectronics Co., Ltd. Chen Xiangdong, vice chairman Fan Weihong, Xiamen Semiconductor Group General Manager Wang Hui, and other related responsible People attended the signing ceremony.
The Xiamen Haicang and Silan Microelectronics cooperation, combined with the two sides in the location, policy, technology, market and the comprehensive advantages of industrial ecology, according to the signing of the agreement, Silan Microelectronics and Xiamen Semiconductor Investment Group Co., Ltd. intends to jointly invest a total of 22 billion Yuan, Haicang District, in line with the construction of national IC industry development plan, Xiamen IC Industry Development Plan 12-inch feature wafer fabrication project and advanced compound semiconductor wafer manufacturing project.
Among them, 12-inch 90-65nm feature process wafer manufacturing project plans to invest 17 billion yuan, product positioning for the MEMS, power semiconductor devices and related products.Planning a project to build a 12-inch process technology features production capacity of 80,000 planning / Month, take phased implementation, the initial planning capacity 40,000 / month Advanced Compound Semiconductor wafer manufacturing project plans to invest 5 billion yuan to build a 4/6 inch compatible advanced compound semiconductor wafer production line, the main products include the next generation of optical modules Chip, 5G and RF-related modules, high-end LED chips.
The cooperation between Silan Microelectronics and Haicang District in Xiamen is of great significance to the development of "surpassing Moore" characteristic process and the new generation of compound semiconductors in China and will bring about an innovative breakthrough in the cooperation mode of the domestic integrated circuit manufacturing industry. Silan micro-after 20 years of development and accumulation of important strategic choices, but also to further improve the industrial chain in the southeastern coast of China, Xiamen and Fujian even enhance the IC industry in the layout of the national strategic layout and status, enhance the core competitiveness of China's IC industry , Open up our country in the field of international integrated circuits market segments, with milestone significance.
2. National IC industry 'core' breakthrough, Silan Microelectronics Project settled in Haicang;
Xiamen Reuters (Reporter Huang Long Teng) On the afternoon of December 18, Xiamen Haicang District Government and Hangzhou Silan Microelectronics Co., Ltd. jointly signed a strategic cooperation framework agreement in Xiamen. According to the agreement, the total investment of the project is 22 billion yuan. The planning Construction of two 12-inch feature process wafer production lines and an advanced compound semiconductor device production line.This is the second pass since the rich microelectronics projects, Haicang integrated industry project another qualitative leap.
Xiamen Municipal Committee, Haicang Taiwanese investment zone party committee secretary, district secretary Lin Wensheng and the relevant departments of municipal leaders attended the signing ceremony. Hangzhou Silan Microelectronics Co., Ltd. Chairman Chen Xiangdong, Vice Chairman Fan Weihong and company executives Attending signing ceremony.
In accordance with the agreement signed, Silan Microelectronics and Xiamen Semiconductor Investment Group Co., Ltd. intends to jointly invest a total of 22 billion yuan in Haicang District in line with the national IC industry development plan, Xiamen IC Industry Development Plan 12-inch feature wafer Project and advanced compound semiconductor project, of which, 12-inch 90-65nm wafer processing project with a feature of planned production of 17 billion yuan is expected to be positioned as MEMS, power semiconductor devices and related products. The first 12-inch process line features planned production capacity 80,000 / month, to take a phased implementation, the initial planning capacity of 40,000 / month Advanced Compound Semiconductor project plans to invest 5 billion yuan to build a 4/6-inch compatible advanced compound semiconductor device production line, the main products include the next generation of optical communications Module chip, 5G and RF related modules, high-end LED chips.
Since 2016, Xiamen municipal party committee and municipal government have promulgated the 10-year plan for the development of the integrated circuit industry and strive to achieve the strategic goal of exceeding 100 billion in the scale of the integrated circuit industry and boosting the scale of the electronic information technology industry by 300 billion by 2025. Haicang District, A game of chess, differentiated layout, dislocation development 'train of thought, combined with its own industrial restructuring and development needs of the transition, clearly the integrated circuit industry as a strategic leading industry to plan, to create integrated circuit agglomeration, and this year promulgated the "Xiamen City, integrated Circuit Industry Development Plan Haicang District Implementation Plan "and supporting industrial support policies and personnel policy June 26 this year, through the rich Microelectronics Co., Ltd. and Haicang District Government signed a contract to build integrated circuit IC packaging and testing production line Strategic cooperation agreement On August 21, Tong Fu Microelectronics Project in Haicang information consumer industrial park foundation for the integrated circuit industry in Xiamen make up a key part of the Silan Microelectronics project settled in Haicang, Haicang Nearly 30 billion IC projects were signed in just one year, making it the region with the highest concentration of domestic and international industries One.
Silan Microelectronics and Haicang District government cooperation projects to speed up the layout of the country's first 12-inch feature process wafer manufacturing lines and next-generation compound 4/6-inch production line, both Silan Microelectronics 20 years of development and accumulation of the results, But also for enhancing the core competitiveness of China's IC technology areas, explore the development model of China's IC industry, and further improve the industrial chain in the southeast coastal areas in China, Xiamen and Fujian even enhance the integrated circuit industry in the national strategic layout of the pattern and status, with The significance of the milestone.
In the report of the 19th NPC, it is necessary to speed up the process of building a powerful nation, speeding up the development of advanced manufacturing industry, deepening the integration of the Internet, big data, artificial intelligence and the real economy, and promoting the industry in our country to a mid- and high-end of the global value chain and cultivating a number of world-class Advanced manufacturing cluster.Parties of the Tenth Plenary Session of the Tenth Congress to speed up industrial restructuring and upgrading, innovation drive to achieve greater breakthroughs, struggling to achieve the goal of catching up.At present, Xiamen City is studying the spirit of the party's Nineteenth, conscientiously implement Xi Jinping's socialism with Chinese characteristics in a new era should follow the instructions of General Party Central Committee and General Secretary Xi Jinping and try its best to implement the strategy of catching up and surpassing and strive to be the vanguard of socialism with Chinese characteristics in a new era.
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Hangzhou Silan Microelectronics Co., Ltd. Chen Xiangdong chairman:
Xiamen has a unique advantage, the introduction of the national IC industry development program, Xiamen City and Haicang District have developed a corresponding policy, and strive to create a new high-tech integrated circuit industry in this industrial atmosphere, Xiamen invited a professional Of the technical team, the appropriate investment and foreign investment, given the industrial policy, very suitable for our business such as the ground floor, so we choose Xiamen, Haicang.
Haicang District Standing Committee, executive vice mayor Zhang Chunjie:
Under the correct guidance of the municipal party committee and government of Xiamen City, Haicang actively develops the integrated circuit industry according to its own characteristics. According to statistics, China's annual chip import value exceeds 200 billion U.S. dollars. Therefore, we must strengthen the related national industrial development and introduce Hangzhou Silan Microelectronics Co., Electronic companies feature technology projects to fill the relevant gaps in the domestic characteristics of the process so that our country in this area to achieve corner overtaking, but also enhance Xiamen and even Fujian, in the IC industry status.
Wang Hui, general manager of Xiamen Semiconductor Investment Group Union:
Haicang first plan after the move will move into the lock in the process of differential development, give full consideration to the development trend of IC industry at home and abroad, through the introduction of professional team and the introduction of industrial resources combined with innovative forms, out of quite distinctive The road to development has achieved remarkable results.
3. Great chip high-end equipment toward a new journey;
28nm ion implanter in the SMIC 12-inch production line site
200mmCMP equipment into SMIC production line for process validation
PERC high efficiency photovoltaic cell intelligent manufacturing production line of core smart equipment localization rate of 91.8%
Recently, China Electronics Technology Group Co., Ltd. (hereinafter referred to as electrical equipment) came good news, independent research and development of China's first beam ion implantation machine in the SMIC production line stable film more than 2 million, the first 200mmCMP Equipment sales achieved.This is the epitome of the major achievements made by the electric equipment company in undertaking the major project of "Very Large Scale Integrated Circuit Manufacturing Equipment and Complete Technology" (hereinafter referred to as the "02 Special Project").
In the past nine years, EEE equipment has undertaken a total of 02 special '90 -65nm large-angle ion implanter R & D and industrialization ',' Key components and core technology of packaging equipment ', '45 -22nm low energy large beam ion implanter R & D and industrialization' 28-14nm polishing equipment and complete sets of technology, material industrialization '300mm thin wafer polishing machine R & D and industrialization' and other projects.
Over the past 9 years, with the support of Special Project 02, the electric equipment has successively broken through the core technologies of key integrated circuits such as ion implanters and chemical mechanical polishing equipments (CMPs), which have made great efforts to tackle key issues and have won the invention patent authorization , Won 22 awards above the provincial and ministerial levels; built in line with SEMI standard ion implanter batch manufacturing platform, the establishment of post-doctoral research station; CMP R & D platform was approved, "Beijing Chemical Mechanical Flattening Process Equipment Engineering Research Center" Domestic first ion implanter, 200mmCMP equipment into the SMIC's large production line, advanced packaging equipment with integrated service capabilities, access to advanced packaging leading enterprises ......
Diligently describe the responsibility and responsibility of the foundation stone
Integrated circuit chips are the core cornerstone of the information age. Integrated circuit manufacturing technology represents the highest level of ultra-precision manufacturing in the world today. The integrated circuit industry has become a strategic industry that affects social security, economy and national defense security and overall competitiveness.
However, due to the capital-intensive, technology-intensive and talent-intensive IC industries, for a long time, the IC industry in China has been subject to various restrictions in the advanced manufacturing equipment, materials and processes in the West. The high-end chips mainly rely on imports. China's annual output of integrated circuit products for many years more than 200 billion U.S. dollars, more than oil to become the largest imported products.
In order to realize the independent innovation and development, in 2008, the state started the special project of 02 and focused on the independent innovation of equipment, process and materials.
Zhang Beixu, director of Beijing Economic Commission, said that high-end equipment and materials have filled the industrial chain from scratch, and that the manufacturing process and package integration have been gradually changing from weak to strong to participate in international competition. This shows that the national science and technology major project is creating an innovation system for integrated circuit manufacturing In recent years, the vigorous development of China's IC industry, major projects have played a significant role in innovation and technical support.
In 02 special high-end equipment research, electrical equipment has played a pivotal role.
E-Tech is a wholly-owned subsidiary of China Electronics Technology Group Corporation (hereinafter referred to as China Electonics), established in 2013 by the integration of two E-Techco, Forty-five and Forty-eight and its 11 holding companies , Across Beijing, Taiyuan, Changsha, Shanghai and other six provinces and eight parks.
Since the founding of the establishment, the electrical equipment held high the flag of the national team of electronic manufacturing equipment, carry forward the hardships, stresses dedication, willing to adhere to the 'decade grinding sword' equipment, according to 'key breakthroughs, platform support, partial package, integrated services' Development ideas, adhere to innovation and development, adhere to the integration of civil and military, adhere to the equipment to serve the country, overcome the integrated circuit manufacturing key equipment ion implanter, chemical mechanical polishing equipment and other key technologies to solve a group of China's military electronic components to control the development of self- Card neck 'problem, supporting the rapid development of semiconductor and emerging electronic components industry, to express the responsibility and responsibility of the Great Power Equipment.
Relying on the accumulation of technology in the field of integrated circuit core equipment for many years and the scientific research and production technology of military industry, the electric equipment has formed a local complete set and integrated service capability of high-end display, new energy sources of photovoltaic, power semiconductor materials and other pan-semiconductor equipment, and greatly improved the equipment localization rate. At present, it is the major integrated circuit equipment, the largest high-end display equipment, photovoltaic manufacturing equipment, power battery material manufacturing equipment suppliers, with the integrated circuit of local complete sets and system integration capabilities, with a complete photovoltaic industry chain and turnkey capacity of the entire line.
Break the monopoly forging ion implantation machine made brand
Breakthrough in key technologies, made 101 invention patents, 2 international patents, has achieved a series of products and used in SMIC 90nm, 55nm, 40nm, 28nm process line ... ... This is the electrical equipment to undertake 02 special two ion implantation machine research and development Some achievements made by the project.
Ion implanters are the core equipment of integrated circuit manufacturing - mainly injecting particles into the semiconductor material to control the conductivity of the semiconductor material to form the basic unit of the integrated circuit device such as the PN junction.
As the only one that integrates R & D, manufacturing and service in one ion implanter, after having undertaken the 02 special project, the electrical equipment has taken a new step in the R & D of ion implanter.
In 2014, the 12-inch medium beam ion implanter passed the acceptance test organized by the State 02 Special Implementation Management Office with excellent level. In 2015, SMIC completed successively the process verification of 55nm, 45nm and 40nm small-batch products, Flow ion implantation rate of the first to achieve the mass production of wafers over a million in 2016, introduced to meet the new high-end technology of the new model 45-22nm low-energy large beam ion implanter, beam, low-energy large beam products batch applications IC Line In 2017, the ion implanter mass production conditions factory and process laboratory put into use, with the meet the SEMI standard industrial platform, with an annual capacity of 50 units, and the application of information management systems to achieve mass production of ion implanter mass production And trace back.
'Accumulation thick device, for the equipment manufacturing industry, not only concerned about the development of a single device, within a certain range of supply, the formation of a platform for the production capacity is even more important.' Chairman Liu Jidong, party secretary stressed that the electrical equipment Independent research and development of ion implanters broke the monopoly of the high-end market by the United States and Japan, creating a domestic brand ion implanter.
Zero breakthrough domestic 200mmCMP enter SMIC production line validation
On November 21, 200MW CNC commercial machine independently developed by EDB equipment was tested internally and sent to SMIC Tianjin Company for on-line verification, which is the first time that a homemade 200mm CPM device has entered the large integrated circuit production line, effectively solving the problem of restricting the autonomy of China's IC industry Controllable bottlenecks of development.
CMP is one of the seven key devices in integrated circuit fabrication for planarization and copper interconnect processes.
Electrical Branch equipment difficulties, both ends of the force in the commitment of 'Twelve Five' 02 special '28 -14nm polishing equipment and complete sets of technology, materials industrialization 'project at the same time, facing the urgent needs of the domestic market, independent research and development 200mmCMP commercial equipment, the formation of 300mm, 200mm equipment R & D go hand in hand, mutual support situation.
Beginning in January 2015, the R & D team of CMP equipment in the Electric Equipment Group has spent countless sleepless nights pouring out the CMP equipment industrialization: breakthrough of more than 10 key technologies, completed more than 50 technical improvements and finally in 2017 In August of this year, it successfully developed the first 200mm CMP commercial machine with completely independent intellectual property rights in China and succeeded in breaking the monopoly of foreign technology blockade. The rigorous 10,000-piece marathon test is comparable to similar international equipment.
It is reported that in the next 6 months, 200mm CMP equipment to formally accept the test of large-scale production, equipment reliability and consistency will be subjected to rigorous examination.
Complete sets of advanced packaging supply key equipment batch applied to the leading enterprises
Packaging equipment sales of more than 2,000 sets, has been used in batches Changdian Technology, Tong Fu Microelectronics, Suzhou Jing Fang and other well-known domestic packaging and testing companies - in the field of high-end packaging equipment, electrical equipment has formed a partial supply of local capabilities.
Since the 11th Five-year Plan period, with the support of 02 special project, the electric equipment has undertaken 300mm ultra-thin wafer thinning and polishing machine and packaging equipment key components and core technologies and product development projects.
Today, the development of electrical equipment, flip chip bonding machine, automatic wafer thinning machine, automatic precision scribing machine to reach the leading domestic and international advanced level; and independent research and development of equipment to build the advanced integrated circuit packaging equipment for the local process Verify the line, in order to continuously improve the stability and reliability of domestic integrated circuit packaging equipment provide a good platform.
'At the time of equipment development, we need to design and manufacture equipment based on process requirements, and continuously verify the process,' said Liu Jidong.
At present, the packaging equipment technology verification line has three major functions: First, verify the equipment, verify the process, the thinning, cutting, flip-chip, wire bonding and other equipment in the verification line stability, reliability, process adaptability Assessment and verification; the second is to verify the batch production of equipment to enhance the ability of batch delivery of equipment; the third is to strengthen the ability of local into a line, to provide the overall solution to gain experience.
Responsibility call to play, the mission lead the future.
As a national team in the field of electronic manufacturing equipment, electrical equipment will uphold the important task of providing equipment to serve the country and create a high-end electronic equipment that will be the cornerstone of the country. In the future, focusing on the key technologies for manufacturing integrated core equipment, Adhere to scientific and technological innovation and industry into a two-wheel-drive, sustained force around the equipment and equipment industry under the support of related industries, efforts to enhance the level of industrialization, through the whole outreach, gathering resources, construction of Beijing integrated circuit equipment innovation center and industrialization Base, China E-Techco (Shanxi) Electronic Information Technology Innovation Industrial Park and Changsha Photovoltaic Equipment Industrial Park to serve the national and local development; at the same time, cultivate the ability to intelligently create electronic subdivision industry standard formulation, intelligent equipment manufacturing and intelligent manufacturing system solutions It has become one of the mainstream smart manufacturing backbone enterprises and intelligent manufacturing system solution providers in China.
Science and Technology Daily
4. Former Lenovo Group Vice President Ma Daojie joined Violet as senior vice president;
December 18, according to sources disclosed that the original Lenovo MBG China Business Vice President Ma Daojie has formally joined the Purple Group, served as senior vice president in early December this year, Ma Daojie for personal reasons to leave from the association, but , Some people call Madoff because of the views of the top executives do not agree to leave.
In March of this year, Yang Yuanqing, Chairman and CEO of Lenovo Group, announced that Ma Daojie, the former general manager of China Telecom Terminal Company, will serve as vice president of Lenovo Group and executive vice president of MBG China Business Group, directly to senior vice president of Lenovo Group and co-president of mobile group Joe Health Report, to help lead MBG's business in China to achieve strategic transformation and business breakthroughs. After joining Lenovo, Madao promoted the successful listing of 'Qingyou' products.
Prior to joining Lenovo, Ma Daojie served as general manager of China Telecom Terminal Company and later served as vice chairman of China Telecom Group Trade Union. During his time as general manager, Ma Daojie led the planning and implementation of the CDMA terminal strategy, also joined hands Samsung created the heart of the world such as ultra-high-end mobile phone brand.
According to the statistics, Ziguang Group is a high-tech enterprise under Tsinghua University and has formed a high-tech industry ecological chain dominated by integrated circuits, from core to cloud. Currently, it is the largest integrated integrated circuit enterprise in China. The three major mobile phone chip companies in the field of enterprise-class IT services ranked China first, second in the world as to Ma Dao Jie after joining the purple group which is specifically responsible for the business, the current group and its own purple are not specifically disclosed.
5. North China record: high barriers to promote high-tech semiconductor equipment investment
Event: Recently, the company issued a public notice on December 13, 2017 received Zhongguancun Science Park Management Committee transferred to the field of integrated circuits 300mm alloy furnace equipment research and development projects' subsidy of 10.16 million yuan. High-tech semiconductor equipment barriers Driven by high R & D investment, according to statistics, in 2016 alone, the company received subsidies of up to 612 million, on the other hand reflects the strong determination of high barriers to semiconductor core equipment and the national will.
Comments:
The domestic semiconductor industry ushered in the golden period of development, the average annual investment reached more than 100 billion yuan.According to SEMI estimates, 2017-2020 the next four years, there will be 62 12-inch new wafer fabs in the world, of which 26 new fabs located Mainland China, accounting for 42% share, the United States 10, Taiwan 9. According to public information consolidation, there are currently a total of 15 12-inch wafer fab under construction in China with a total investment of 446.7 billion yuan, an average annual investment of 100 billion yuan , North China's 28nm high-density plasma etching machine and other integrated circuits before the road equipment to achieve volume sales, equipment coverage accounted for more than half of the total equipment, is a well-deserved leader in domestic equipment.
High R & D investment under the background, the government level to give strong support.According to statistics, in 2016 the company received subsidies as high as 612 million in May 2017, North China CRE and its subsidiaries received 14nm stereoscopic plasma etching machine R & D and industrialization "part of the national science and technology major part of the three projects funded part of the three projects of the central and local grants total 1.47 billion, accounting for 60% of the project funding, on the other hand reflects the semiconductor core equipment of high barriers And strong determination of the national will.
Forging ahead, import substitution is expected to be the first to break out. North China's 28nm etching machine and other key equipment to achieve mass sales, research and development technology node at 14nm, technical strength and product performance to meet the requirements of first-tier manufacturers. In 2016 to achieve volume sales China-made 12-inch wafer manufacturing equipment, especially North China's largest product range, including 28nm high-density plasma etching machine, and other six kinds of equipment, the import substitution is expected to be the first to break through.
Investment advice and rating: The company expects net profit of 2017 to 2019 to 122 million, 245 million and 357 million yuan, EPS 0.27 yuan, 0.54 yuan, 0.78 yuan, corresponding to the price-earnings ratio of 149 times, 74 times, 51 times Give 'overweight' rating.
Risk Warning: The domestic semiconductor industry is less than expected.
Northeast Securities