Each car inside up to hundreds of IC chips, become Germany's semiconductor industry, the perfect role, the world's second-largest wafer foundry GlobalFoundries (GF) is located in Germany Dresden (Dresden) 12-inch plant, playing 28 nm polysion/ HKMG and the development of 22 NM FD-SOI technology, will be locked in the future of the automotive electronic full layout, has been with the Auto Electronics 0 component supplier Bosch Strategy cooperation. GF Dresden Factory predecessor is Ultra Micro (AMD) wafer factory (1996-2009 years), has now developed to 5 wafer factory, is Europe's largest 12-inch wafer factory. Turn over in recent years GF Process technology Blueprint, starting from 28 nm POLYSION/HKMG process, respectively for different application market, towards 22 and 12 nm fd-soi process, 14LPP/12LP/7LP FinFET process layout. GF Dresden 22 NM Fd-soi technology has been a small amount of production, is expected to 2018 the second half 22 and 28 nm yield of gold cross, driving 22 nm Fd-soi technology to quickly import the application end. In recent years, the semiconductor in the product application and technology trend of a major change, smart phone access Bar pc era, the current growth is also beginning to show weakness, prompting the semiconductor manufacturers actively looking for other applications, including automotive electronics, Internet of Things (IoT), 5G and so on. GF Vice President Thomas Morgenstern analysis, Moore's Law all the way from 90, 65, 40 nm development so far, 28 nm generation is a key watershed, because of the lower cost efficiency of further reduction significantly, down 20, 16/14 nm is technically feasible, But the cost of transistors slows down dramatically, so fd-soi technology is another way to continue Moore's law. GF Technical Blueprint in two directions layout, FINFET process focused on high-speed computing technology, applications include sensors, drawing cards, high-end mobile phone processor (AP), Netcom, high-end car adas, etc. Fd-soi Technology specializes in wireless communications, including medium and Low level AP, IoT, automotive electronics, mobile camera, etc., featuring low power consumption, high cost performance, RF efficiency, and embedded memory technology. Morgenstern has previously worked at Infineon and Qimonda Dresden, and has been in charge of the semiconductor and sensor plant in Bosch, and is quite familiar with the manufacturing of automotive 0 components, joining GF Dresden in 2017. It is expected that the future of the plant in the automotive electronic semiconductor chip production strategy and customer partnership will enter a new milestone. GF believes that 22 nm fd-soi process efficiency is equivalent to 14 nm, but the cost and 28 nm equivalent to 28 NM process application of the continuation, and 12 nm process efficiency is equivalent to 10 nm, the cost and 16 nm process equivalent. At present, GF's Fd-soi process town is Dresden, 2018 began to transfer to the mainland Chengdu 12-inch factory, the future both sides will produce fd-soi process, but also based on customer demand for decentralized production sites, Dresden positioning bias Automotive electronic chips, support for European customer demand, Chengdu Plant is focused on the mainland things networking, 5G and other related technologies. GF Chengdu Factory is a joint venture with the mainland Chengdu municipal Government, the first phase into the Singapore plant 0.18/0.13 micron Process, 2019 years the second half began to transfer 22 NM FD-SOI process technology, planning annual production capacity of 1 million, and investment in 100 million U.S. dollars to set up FDX fd-soi Design Service Center, The establishment of EDA/IP ecosystem supply chain, is expected to recruit 500 engineering staff.
