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1.iPhone x Import 3D Sensing Drive the market over the next 3 years to double growth;
Set of micro-network message, set Bang Advisory led Research Center (ledinside) The latest "2018 Infrared Sensing application Market report shows that as Apple iphone x imports 3D sensing features, attracting a number of non-Apple handset manufacturers to put 3D sensing product layout, Ledinside estimated 2017 Mobile terminal 3D sensing infrared Laser Projector market output of about 246 million U.S. dollars, 2020 is expected to grow to 1.953 billion U.S. dollars.
At present, the 3D sensing scheme of mobile terminals includes structured light and time-of-flight ranging sensing (ToF), Apple iphone x uses the structure of the patented technology, with the dot-matrix projector in the user's face projected more than 30,000 points of light, and then the scattering method of projection on the face to identify, and by the infrared camera to receive, making a face identification map.
In addition to 3D facial sensing, mobile phone brands are also actively developing a combination of ledinside and augmented Reality (AR) capabilities, so it is expected that the future of the imaging technique may be amplified to the rear lens. After the lens is more likely to use the flying time ranging sensing, the advantages of a larger range of sensing, data processing capacity is faster, at the same time to meet the supplier's patent layout.
From the supply chain observation, the 3D sensing algorithm, the optical pattern, the patent layout is the most important development key. Ledinside sorted out the current supply chain from upstream to downstream, infrared laser lei crystal chip manufacturers include IQE,-, crystal electricity, Holley Jie, stabilisation, Honteco, most of them have been expanding operations; Infrared laser manufacturers such as Lumentum, Finisar, Princeton Optronics, Neophotonics, Philips Photonics, OSRAM OS; Structured light algorithm manufacturers include PrimeSense, Mantis Vision, Qualcomm and wonders, Intel; Flying time Ranging algorithm manufacturers STMicroelectronics, Infineon work together PMD, MicroVision, Orbbec and so on; Handset brand manufacturers in addition to Apple, Samsung, Asus, Chinese brands such as Millet, Lenovo, Huawei and Oppo also plans to launch a 3D sensing function of the machine species.
2.3D Sensing Unit Lumentum 3rd 15%! Shipments to China are expected to increase 3 times times;
Fiber component supplier Lumentum Holdings INC. Supply of laser diode (vertical-cavity surface-emitting laser diode, VCSEL) primarily for the 3D sensing module of iphone X The past two weeks have been a big increase in shipments led to pressure on the price of the market, the decline in the impact of market share prices plunged more than 20%, but analysts believe that lumentum in the 3D sensing vcsel markets, the leadership of the increasingly stable, investors can bargain cheap.
Lumentum 11th, jumped 7.86%, received 53.5 U.S. dollars, a November 30 since the close of high, the past three trading days total soared 15%; The company's share price fell as much as 23% from November 27 onwards to December 6.
On the other hand, optical components business Finisar 11th also rose 8.43%, received 19.81 U.S. dollars, a November 30 since the close of high; In the past three trading days the total soared 13%. Finisar announced last week that his vcsel had been on a long delay after a few days.
Barron ' s.com, Benzinga, theyfly.com and other foreign reports, Northland analyst Tim Savageaux 11th published a study that the global 3D sensing supply chain is now expanding to $25 billion trillion, Much more than the estimated $12 billion in June, and Lumentum's share of the overall market shrank from 20% in June to less than 10%. The securities believe that lumentum in addition to the current core customers, more smart machines will also adopt 3D sensing module, is expected to drive revenue significantly growth.
Rosenblatt analyst June Zhang published a study that says Lumentum shipments to Chinese OEMs are expected to increase by three times times in the year (2018). Not only that, Vcsel laser competitors, whether good or quality, are behind Lumentum. Zhang estimates that the lumentum will continue to hold the lead position in the next 2-3 months, when Apple starts Vcsel orders for 2018-19.
Barron on September 13 reported that the IPhone X-front lens Truedepth's key 0 components "vcsel", ordered by Lumentum and Finisar food. Piper Jaffray Troy Jensen Extremely optimistic Lumentum, direct call the company is the layout of 3D sensing the best choice. Jensen said Vcsel has two types, Low-power Vcsel also known as reflective sensor components (Flood illuminator), high-power Vcsel also known as lattice projector (dot projector). The former is used to unlock the face, which can be superimposed on the user's face to send a personalized message. Finisar High-power Vcsel problem resolution, Lumentum will take all two Vcsel 100% orders. He estimates that the IPhone X's 3D sensing component is worth about 4~4.5 dollars.
Barron ' s.com March 20 two reports, JPMorgan analyst Narci Chang and other people reported that this year with a 3D-sensing iphone, may be limited to higher-order OLED panels, the use of LCD panel of the iphone will not be used. The estimated 3D Sensing module will be located next to the self portrait lens for face recognition.
The report says the 3D Sensing module contains a light source (laser or far-infrared LED), an image sensor that detects light reflection, and a picture processing IC. JP Morgan speculated that the supply chain could be produced by the Italian semiconductor IC, AMS to produce the image sensor under the heptagon lens, lumentum supplied by a laser diode (laser diode) of the 3105 Foundry. The 3D sensing module may be given to LG Innotek Assembly, the average price and the gross margin are comparable to the smart camera module. Solid News
3. The Intel 2017 performance is robust to anticipate GPU, data center, IoT is next year center of gravity;
Intel's 2017 earnings performance was robust, adding to a 23% growth this year, in addition to the original PC market, which was aggressively expanding the data center market. Experts believe that 2018 will be a turnaround time for Intel, perhaps not the most fertile year, but optimistic expectations will be at least as good as 2017 growth performance. According to the Motley fool, Intel is the world's largest GPU manufacturer, thanks largely to the high market share of the lower-order integrated graphics solutions markets. As for the high-end independent GPU (discrete GPU) market by NVIDIA and Super Micro expansion card (Add-in-board; AIB) led. Intel has recently teamed up with the Ultra Micro Radeon graphics processor in the latest x86 chipset, creating a new core and Visual Operations Division (core and Visual Computing Group), by the Ultra Micro former Radeon owner Raja Koduri as department general manager and GPU chief architect and senior VP. Intel's move will pose a threat to nvidia and hyper-micro. In addition, although Intel's Xeon processor currently takes up 99% of the ultra-high market in the data center marketplace, nvidia is catching up. The latter claims that its Tesla GPU can outperform Xeon Phi in some highly efficient computing (HPC) applications, so it is possible for corporate customers to postpone updating the CPU's history to wait for new GPU purchases, hurting the growth of Intel's data center business. In response to Nvidia's challenge, Intel plans to launch a new Xeon Phi Chip (Knights Mill) and integrates the recently acquired Altera Programmable logic gate Array (FPGA) to significantly improve the effectiveness of deep learning (deep learning). Although Intel's ability to block Nvidia's foray into the HPC market is unknown, it is expected to be a strategic focus for Intel in 2018. In addition, Intel 2017 's most bright-growing department is the internet of Things (IoT), memory and programmable chips are up to 2-digit growth rates, so it is expected that Intel will continue to focus on these high-growth businesses in the future, including the introduction of customized chipsets for wearable devices, drones and other IoT devices, and the acquisition of Automotive, IoT and computer Vision (computer vision) technology. Analysts say it is worth continuing to observe the performance of Intel's Movidius computer vision chip, which is now being used in a variety of cameras and drones, as well as an unmanned platform developed by Intel's subsidiary Mobileye. Mobileye recently announced with Fiat Chrysler and BMW work together. Another concern is the new 3D NAND and 3D xpoint memory, developed by Intel and microns, which should help Intel strengthen its non-volatile memory business. Given the increasing difficulty of following Moore's law (Moore's laws), Intel formally changed the original chip development model in 2016, from 2 to 2 stages for a period of ' tock ' pendulum strategy, extended to 30-month 3-stage ' process (s), Architecture ( Architecture), optimizes (optimization) ' loops. In the 14 nm process, Intel's previous generation Broadwell chip was released in 2014, and the current generation of the first chip Skylake was released in 2015, followed by Kaby Lake, Kaby Lake R and Coffee Lake in 2017. 2018 Intel is expected to publish a 10-nanometer skylake chip cannonlake. The comments suggest that the release of the latest generation of Cannonlake chips will help Intel pull off the gap with its competitors ' Ultra Micro (AMD). The latter launched in early 2017 to compare the efficiency of Kaby Lake but more affordable Ryzen chip. Digitimes
4. The number of settlements reached between Toshiba and West will be withdrawn and invested in
Sina U.S. stock News, 12th, Kyodo News, 11th, according to Toshiba related to the sale of Toshiba's semiconductor subsidiary, Toshiba Memory (Tokyo), Toshiba has been a partner for more than half a year of litigation disputes with the United States Western Data Company (WD) actually reached a settlement. A final adjustment to the wording of the agreement document is under way, which will be announced as soon as 12th if completed. This will clear up the sale of Toshiba's storage and drive the company to restructure its business.
The West agreed to rescind the lawsuit filed at the International Court of Arbitration to suspend the sale. Toshiba allowed the west to participate in additional investments in the Sanchong County Siji plant. The details of the South Korean semiconductor giant SK Sea, which is involved in acquiring Toshiba memory, have set limits to prevent the impact of collaboration. New factories in Yanshou County North will also be jointly invested by both sides.
Toshiba announced 5th that a total of about 600 billion trillion yen (about 35 billion yuan) of third-party directional replenishment has completed payment, which paved the way for its exit from insolvency to maintain the listing. The reasons for the rush to sell Toshiba's storage ceased to exist, giving Toshiba the upper hand in negotiations with the West. Under the influence of antitrust scrutiny, Toshiba could be delisted if it could not rush to sell Toshiba storage by the end of next March.
Toshiba put pressure on the west to exclude additional investment from the sixth plant under construction at Srs, forcing the west to dismiss the lawsuit. If the West does not participate in the investment, under the contract will not be able to sell the most advanced flash memory. Taking into account the negative impact on business, the West has to choose to accept the situation without changing the conditions of cooperation.
The West is the giant hard drive device that records computer data, and last year acquired the American company that worked with Toshiba. While Toshiba has been in crisis over the US nuclear power business, the West has brought Toshiba to court to block the sale of the talks in order to nationalize Toshiba's memory. Toshiba decided in September this year to sell Toshiba memory to the U.S. investment fund Bain Capital-led ' Japan-US-South Korea complex.