Wu Yingjie, LEDinside research manager, said the Infrared Laser Projector consists of three main components: infrared laser (VCSEL surface-emitting laser or EEL edge-emitting laser), WLO wafer-level optical lens, and DOE optics Diffractive components, the product cost price falls between 3.5-6.0 dollars.As manufacturers and technology supply chain strategic cooperation matures, it is expected that the future cost of infrared laser projectors will gradually decline, helping to promote market demand.
At present, the 3D sensing solution for mobile terminals includes structured light and fly-range sensing (ToF). The Apple iPhone X uses a patented structured light technology, which uses a dot matrix projector to project more than 30,000 light spots on the user's face , And then scatter the projection on the face to identify, and received by the infrared camera to produce 3D face recognition map.
In addition to 3D facial sensing, mobile phone brand manufacturers are also actively developing 3D sensing combined with augmented reality (AR) capabilities, so LEDinside expects future 3D sensing technology to expand from the previous lens to the back lens. May use fly-range sensing, the advantages of a larger sensing range, data processing capabilities faster, at the same time meet the supplier's patent layout.
From the perspective of the supply chain, 3D sensing is the most important key to the development of algorithms, light pattern and patent layout.LEDinside has sorted out the current supply chain from upstream to downstream, and the manufacturers of infrared laser epitaxial wafers include IQE, II-VI, Epistar, VVL, Winbond, AcerJieke, most have been expanded; infrared laser manufacturers such as Lumentum, Finisar, Princeton Optronics, NeoPhotonics, Philips Photonics, OSRAM OS; structured light algorithm vendors include PrimeSense, Mantis Vision , Qualcomm and Amazing King, Intel; flying time ranging algorithm manufacturers STMicroelectronics, Infineon together with pmd, MicroVision, Orbbec, etc .; mobile phone brand manufacturers in addition to Apple, Samsung, Asus, the Chinese brands such as millet, Lenovo, Huawei and OPPO also plans Introducing models with 3D sensing capabilities.
Looking forward to the key factors in the long-term market development, all mobile phone brand camps have started supply chain alliance and cooperation. However, how to break through the patent barrier of algorithms, the future development of third-party applications, and the improvement of the price / performance ratio of 3D sensor modules will affect the 3D The key to sensing the future growth of the market.
