Conventional chip packages are usually soldered, soldered or glued to the card antenna, but with the CoM package, the chip module can communicate with the card antenna using radio frequency (RF), eliminating the need for complicated mechanical designs and making the card itself more Sturdy, production costs can be reduced.
The CoM package has been used in a variety of payment cards and electronic identity cards with both contact and non-contact (dual interface) functions. CoM technology also offers tremendous advantages for pure non-contact electronic identity cards and passports such as thickness Modules of only 125μm provide flexible card configurations for better card design and reduced passport hardness, and the electrocardio-card antenna connection eliminates the vulnerability and thus provides a longer document life span of up to ten years.
Trading with contactless cards is usually faster than having to insert contactless cards with a card reader, and multiple applications can create new business models by combining multiple application functions on a single card, for example in banks in Africa and Latin America In areas where the infrastructure is lagging behind, the demand for multi-function electronic identity cards and passports is extremely high. People can thus make financial transactions through their identity cards.
Powerful, versatile, with up to 700KB of memory, Integrity Guard and advanced silicon architecture, this security chip provides a solid foundation for a complete new contactless card solution.