Global IC packaging and testing industry three camp has been set | How to domestic enterprises | 'internal and external'?

Recently, the Ministry of Commerce issued a public notice restricting the terms of the form approved ASE's stake in silicon acquisitions, which makes the global leader in the closure of the closure of the fourth largest packaging and testing plant was officially launched. The completion also shows that the integration of the global IC packaging and testing industry has entered a new phase of giant integration, and in the future, IC packaging and testing plants in mainland China will face even more intense competitive pressures.

Silicon will be a joint industrial holding company

In August 2015, ASE launched a public offer of silicon products, followed by silicon products fight back all the way, including the desire to form an equity swap agreement with Hon Hai, for the private placement of allotment of shares and other shares of violet , Until June 30, 2016, the two sides formally reached an agreement to form a holding company.After the agreement is reached, ASE to proceed to the antitrust authorities to apply for and on November 16, 2016 and May 2017 15 Were respectively granted the "Fair Trade Fair" in Taiwan of China and the permission of the U.S. Federal Trade Commission to obtain the conditional approval of the Ministry of Commerce on November 24, 2017. As of this date, the Nikos Group Industrial Holding Company was started.

According to Taiwan's media reports, both companies are expected to convene an extraordinary shareholders' meeting in February next year, and the company, which may be named as ASE Holdings Holdings, is expected to be formally established by the end of May. In this regard, ASE pointed out that a joint holding company It can promote healthy competition, enhance R & D capabilities and provide better quality and customized service for all customers. It has important and positive significance not only for China Taiwan but also for the development of semiconductor packaging and testing technologies in Mainland China and the world.

To deal with the scale of competition

According to research institutions released in 2016 the world's top ten closed beta factory operating income rankings show that ASE is the world's semiconductor packaging and testing outsourcing industry sales ranked No. 1 company, and silicon products ranked fourth. After the merger of the two, will have a Ultra large-scale packaging and testing giant, the two companies operating income of 75.12 billion US dollars, the scale of operation far exceeds the number two secure and the third of the long-term technology.

Even more noteworthy is that the integration between the IC packaging and testing plant took place between large and small enterprises or the IDM under the jurisdiction of the IC packaging and testing plant acquisitions, such as the acquisition of Motorola in 1999, China's Chungli in Taiwan and South Korea Paju Acquisition of NEC's packaging and testing plant in Yamagata, Japan in 2008, the acquisition of Aiwa Electronics Co., Ltd., Shandong Weihai, which was invested by Hankou in 2008, the acquisition of Yangding Technology in 2012 and the acquisition and testing of Wuxi Toshiba in 2013 Factory and so on.

However, in recent years, mergers and acquisitions have occurred in the packaging and testing manufacturers.According to the data released by Taiwan's National Institute of Economic Research, the world's top ten IC packaging and testing plants through integration are showing three camp structures, including ASE and Silicon products, the two in the global IC packaging and testing outsourcing market share in the industry, the current ranked No. 2 (Amkor) company completed the original sixth in the world's packaging and testing plant J-Devices acquisition, 2016 China IC packaging and testing plant in mainland China completed the acquisition of Starbucks, the fourth-largest company in the industry, and became the third largest IC packaging and testing outsourcing company in the world.

In this regard, the semiconductor specialist Mo Taikang that the merger between manufacturers mainly in order to expand the scale and reduce operating costs of enterprises in a collectivized form to cope with competition from other competitors through mergers to reduce competition in the industry intensified in the overall market Under the circumstances it is possible to obtain greater scale advantage.

In addition, the global IC packaging technology by leaps and bounds, the entire industrial chain technology to the high-end areas of development.Size integration between large companies for the development of new technologies also plays an important role.According to the China Semiconductor Industry Association IC branch vice president and secretary general, In the IC packaging and testing industry chain technology innovation strategic alliance introduced by the Secretary-General in the Xie Kang: '3C electronics market in the next decade to promote high-density, high-performance chips, ultra-miniaturized, multi-pin variety of BGA, CSP, WLP , MCM and SiP advanced packaging products and packaging and testing technology rapid development; automotive electronics, power electronics, smart grid, industrial process control and new energy electronics market and the country's large aircraft, aerospace projects, but also need to be more reliable and higher Performance, more diverse packaging and testing of BGA, PGA, CSP, QFN products and packaging and testing technology; emerging IoT and medical electronics also need more integrated, more flexible, more abundant package of packaging and testing technology and New RF packaging, MEMS and bio-electronics packaging, and system-in-package (SiP) product offerings.

Connotation is the key to enterprise development

IC packaging and testing industry as an integral part of the semiconductor industry chain in an important part of the increasingly prominent position in the semiconductor industry.Especially with the semiconductor technology in accordance with the size and other features to further reduce the size of the development of silicon CMOS technology in speed, , Integration, cost and many other aspects are subject to a series of basic physical characteristics, investment restrictions, packaging has become one of the important ways to solve these bottlenecks.While the integration between the sealing and testing companies, but also reflects the closure Measuring the actions taken by enterprises in response to this trend.Award mergers and reorganizations to improve industrial concentration, will further evolve.In the future, China's IC packaging and testing industry will usher in a greater competitive challenge.

Yu Xiekang said: 'To further promote the development of the IC packaging and testing industry, mergers and acquisitions is one of the important means by fostering industry consolidation efforts to cultivate one or two internationally competitive large enterprises is to revitalize IC packaging and testing industry as soon as possible For integrated circuit packaging and testing industry, by promoting the merger and reorganization of enterprises, can extend and perfect the industrial chain, increase industrial concentration, and promote large-scale, intensive management, the formation of one or two in the industry to play a leading role in large enterprises Group, is conducive to adjusting and optimizing the industrial structure, promote sustainable and healthy development of the industry.

Prior to China's IC packaging and testing companies have also launched a number of international mergers and acquisitions, including the acquisition of Starcom by Longchang Technology, the acquisition of Micronesia Microelectronics Suzhou (AMD) and Penang Malaysia factory, Huatian Technology 42 million US dollars Acquisition of the United States such as FCI.

In this regard, Mo Taikang also pointed out that China does not agree with the packaging industry blindly mergers and acquisitions to do large-scale. 'Enterprise development, content is the key. And what is the connotation? Is the technology research and development and innovation.' Mo Taikang said. Especially the Chinese packaging companies After a series of mergers and acquisitions, deep mergers and acquisitions should be the focus of the future.

Liu Ming, senior vice president of Long Power Technology, said in an interview earlier, the acquisition of Starcom Jinpeng to make long-term technology, SiP and Fan-out technology and Fan-in packaging technology breakthrough has great help, especially in high-end customers , The merger of Star Science and Technology Co., Ltd. Jinpeng great help to the development of science and technology. Previous international high-end customers for the packaging plant in China is difficult to get contact through mergers and acquisitions can get more opportunities for contact.

2016 GoodChinaBrand | ICP: 12011751 | China Exports