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1. SMIC completed placement, raising 2.55 billion Hong Kong dollars;
SMIC announces that pursuant to the terms and conditions of the Placing Agreement, the Company allotted and issued 241.4 million placing shares to not less than six independent placees at the price of HK $ 10.65 per placing share, representing the entire issued share capital of the Company The enlarged issued share capital of the Company was approximately 4.92%. The above placing was completed on December 6.
The gross proceeds from the Placing is approximately HK $ 2.57 billion and the net proceeds from the Placing is approximately HK $ 2.55 billion.
2. SMIC and SMIC to restructure the framework agreement concerning the supply of goods;
Set micro-mesh news, SMIC announced that as December 6, 2017, the company and the joint venture company SMIC North on the supply of goods, provide or accept services, asset rental, asset transfer, providing technology Authorized and may guarantee and repurchase the framework agreement for a period of three years from January 1, 2018 until December 31, 2020.
It is reported that the annual caps for the framework agreement as of 2018, 2019 and 2020 will be 2.5 billion U.S. dollars, 2.75 billion U.S. dollars and 3.2 billion U.S. dollars respectively.
National IC Fund, through its wholly-owned subsidiary Xinxin (Hong Kong), holds approximately 15.06% equity interest in the Company and is therefore a connected person of the Company at the issuer level pursuant to the Listing Rules. The Group and National Integrated Circuit Fund hold respectively The north has a registered capital of about 51% and 32%, therefore, CSIC North is the Company's affiliated subsidiary and is a related party of the Company.
As one or more of the applicable percentage ratios of 5% or more but less than 25% of the annual caps of the Continuing Connected Transactions constitute non-exempt continuing connected transactions under Chapter 14A of the Listing Rules, The Framework Agreement and the Specific Non-Exempt Continuing Connected Transactions are required to comply with the reporting, announcement and independent shareholders' approval requirements under Chapter 14A of the Listing Rules.
3 global IC packaging and testing industry has been set three camp how to 'internally and externally'?
Recently, the Ministry of Commerce issued a public notice restricting the conditions of the form approved ASE's stake in silicon acquisitions, which makes the global leader in the closure of the closure of the fourth largest packaging and testing plant was officially completed. The completion also shows that the integration of the global IC packaging and testing industry has entered a new phase of giant integration, and in the future, IC packaging and testing plants in mainland China will face even more intense competitive pressures.
Silicon will be a joint industrial holding company
In August 2015, ASE launched a public offer of silicon products, followed by silicon products fight back all the way, including the desire to form an equity swap agreement with Hon Hai, for the private placement of allotment of shares and other shares of violet , Until June 30, 2016, the two sides formally reached an agreement to form a holding company.After the agreement is reached, ASE to proceed to the antitrust authorities to apply for and on November 16, 2016 and May 2017 15 Were respectively granted the "Fair Trade Fair" in Taiwan of China and the permission of the U.S. Federal Trade Commission to obtain the conditional approval of the Ministry of Commerce on November 24, 2017. As of this date, the Nikos Group Industrial Holding Company was started.
According to Taiwan's media reports, both companies are expected to convene an extraordinary shareholders' meeting in February next year, and the company, which may be named as ASE Holdings Holdings, is expected to be formally established by the end of May. In this regard, ASE pointed out that a joint holding company It can promote healthy competition, enhance R & D capabilities and provide better quality and customized service for all customers. It has important and positive significance not only for China Taiwan but also for the development of semiconductor packaging and testing technologies in Mainland China and the world.
To deal with the scale of competition
According to research institutions released in 2016 the world's top ten closed beta factory operating income rankings show that ASE is the world's semiconductor packaging and testing outsourcing industry sales ranked No. 1 company, and silicon products ranked fourth. After the merger of the two, will have a Ultra large-scale packaging and testing giant, the two companies operating income of 75.12 billion US dollars, the scale of operation far exceeds the number two secure and the third of the long-term technology.
Even more noteworthy is that the integration between the IC packaging and testing plant mostly occurred between large enterprises and small businesses or the IDM under the jurisdiction of the IC packaging and testing plant acquisitions, such as the acquisition of Motorola in 1999, China's Chungli in Taiwan and South Korea Paju Acquisition of NEC's packaging and testing plant in Yamagata, Japan in 2008, the acquisition of Aiwa Electronics Co., Ltd., Shandong Weihai, which was invested by Hanchang in 2008, the acquisition of Yangding Technology in 2012 and the acquisition and testing of Wuxi Toshiba in 2013 Factory and so on.
However, in recent years, mergers and acquisitions have occurred in the packaging and testing manufacturers.According to the data released by the Taiwan Institute of Economic Research, the current top ten packaging and testing plant in the world through the acquisition of integration is showing three camp structures, including ASE Silicon products, the two in the global IC packaging and testing outsourcing market share in the industry first, now ranked No. 2 (Amkor) company completed the original sixth in the world's packaging and testing plant J-Devices acquisition, 2016 China IC packaging and testing plant in mainland China completed the acquisition of Starbucks, the fourth-largest company in the industry, and became the third largest IC packaging and testing outsourcing company in the world.
In this regard, the semiconductor specialist Mo Taikang that the merger between manufacturers mainly in order to expand the scale and reduce operating costs of enterprises in a collectivized form to cope with competition from other competitors through mergers to reduce competition in the industry intensified in the overall market Under the circumstances it is possible to obtain greater scale advantage.
In addition, the global IC packaging technology by leaps and bounds, the entire industrial chain technology to the high-end areas of development.Size integration between large companies for the development of new technologies also plays an important role.According to the China Semiconductor Industry Association IC branch vice president and secretary general, In the IC packaging and testing industry chain technology innovation strategic alliance introduced by the Secretary-General in the Xie Kang: '3C electronic market in the next decade to promote high-density, high-performance chips, ultra-miniaturized, multi-pin variety of BGA, CSP, WLP , MCM and SiP advanced packaging products and packaging and testing technology rapid development; automotive electronics, power electronics, smart grid, industrial process control and new energy electronics market and the country's large aircraft, aerospace projects, but also need to be more reliable and higher Performance, more diverse packaging and testing of BGA, PGA, CSP, QFN products and packaging and testing technology; emerging IoT and medical electronics also need more integrated, more flexible, more abundant package of packaging and testing technology and New RF packaging, MEMS and bio-electronics packaging, and system-in-package (SiP) product offerings.
Connotation is the key to enterprise development
IC packaging and testing industry as an integral part of the semiconductor industry chain in an important part of the increasingly prominent position in the semiconductor industry.Especially with the semiconductor technology in accordance with the size and other features to further reduce the size of the development of silicon CMOS technology in speed, , Integration, cost and many other aspects are subject to a series of basic physical characteristics, investment restrictions, packaging has become one of the important ways to solve these bottlenecks.While the integration between the sealing and testing companies, but also reflects the closure Measuring the actions taken by enterprises in response to this trend.Award mergers and reorganizations to improve industrial concentration, will further evolve.In the future, China's IC packaging and testing industry will usher in a greater competitive challenge.
Yu Xiekang said: 'To further promote the development of the IC packaging and testing industry, mergers and acquisitions is one of the important means by fostering industry consolidation efforts to cultivate one or two internationally competitive large enterprises is to revitalize IC packaging and testing industry as soon as possible For integrated circuit packaging and testing industry, by promoting the merger and reorganization of enterprises, can extend and perfect the industrial chain, increase industrial concentration, and promote large-scale, intensive management, the formation of one or two in the industry to play a leading role in large enterprises Group, is conducive to adjusting and optimizing the industrial structure, promote sustainable and healthy development of the industry.
Prior to China's IC packaging and testing companies have also launched a number of international mergers and acquisitions, including the acquisition of Starcom by Longchang Technology, the acquisition of Micronesia Microelectronics Suzhou (AMD) and Penang Malaysia factory, Huatian Technology 42 million US dollars Acquisition of the United States such as FCI.
In this regard, Mo Taikang also pointed out that China does not agree with blindly mergers and acquisitions to do a large-scale mergers and acquisitions. 'Enterprise development, content is the key. And what is the connotation? Is the technology research and development and innovation.' Mok Taikang said. Especially the Chinese packaging companies After a series of mergers and acquisitions, deep mergers and acquisitions should be the focus of the future.
Liu Ming, senior vice president of Long Power Technology, said in an interview earlier, the acquisition of Starcom Jinpeng to make long power technology in SiP and Fan-out and Fan-in packaging technology breakthrough has great help, especially in high-end customers The merger of Star Science Jinpeng is very helpful to the development of science and technology of Changjiang Power.It is hard for international high-end customers to get contact with packaging factories in mainland China and get more contacts through M & A. China Electronics News
4. North Hua Chong integrated circuit ALD equipment stationed in Shanghai IC R & D center;
On December 5, 2017, the first 12-inch Atomic Layer Deposition (ALD) equipment researched and developed independently by North China CRE Microelectronics Co., Ltd., a subsidiary of North China Subcontract, entered Shanghai IC R & D Center. North China CRE Microelectronics Co., Ltd. High-end equipment in the application of advanced integrated circuit chip production line add rookie.
ALD device is an indispensable thin film deposition device in the advanced integrated circuit manufacturing process. ALD process has the advantages of low process temperature, precise thickness control and high step coverage rate. After the characteristic line width of the integrated circuit reaches 28nm node, ALD process Has been widely used since its inception in 2014. Northern China Microelectronics has been planning the development of an ALD device since 2014 and lasted for four years and successfully launched the first mass production single-chip ALD device in China, the PolarisA630, for deposition integration Circuit devices in the high dielectric constant and metal gate film materials, equipment, core technical indicators have reached the international advanced level.
The North China CRE Microelectronics PolarisA630ALD equipment to participate in the open bidding, successfully entered the Shanghai IC R & D Center Co., Ltd., while winning the product and the North China Microelectronics integrated circuit AlPad process eVictorA1030 physical vapor deposition system.Today, North China invasive microelectronics has silicon etching machine, single annealing equipment, HardmaskPVD, AlPadPVD, single chip washing machine, vertical furnace, ALD and other integrated circuit devices used in 28-14 nm process technology, expanding the domestic high-end equipment in Integrated circuit advanced process supporting the scope of application.
Securities Daily
5. Air Products Company Nanjing new factory was put into operation to supply gas to Pukou Economic Development Zone
(BUSINESS WIRE) - Air Products, a leading global supplier of industrial gases, announced today that the company's new facility in Nanjing's Pukou Economic Development Zone has been successfully put into operation to supply high-purity gases to its customers in the park. It also supplied liquid nitrogen to Nanjing and the surrounding market, and the company announced the new capacity investment project last year.
Pukou Economic Development Zone is a provincial-level high-tech park in Jiangsu province, and is home to a high-end manufacturing industry that includes integrated circuits, new materials, biomedicine, etc. The park is only 35 km away from Nanjing Chemical Industrial Park Over the past decade, he has established a leading market position in Nanjing Chemical Industry Park with three large air separation units serving hundreds of customers in the park and throughout Nanjing via pipelines and other modes of supply.
Yu Feng, Vice President of China Gas Division, Air Products Company, said: "We are very pleased that this strategic milestone project can be successfully put into operation in a short period of time to serve our global customers in Pukou Economic Development Zone and to meet the growing market in Nanjing Of the gas demand.Air Products Company has established strong and reliable integrated supply capacity in Nanjing and East China.Under the goals of "Made in China 2025" and "13th Five-Year Plan" high-tech manufacturing industry, China's semiconductor industry We are rapidly developing and we will continue to invest in contributing to the development of this industry. '
Since the promulgation and implementation of the "Outline of National IC Industry Development" promulgated by the State Council in 2014, the IC industry in China has been developing rapidly under the promotion of a large fund of 100 billion yuan. A number of IC industry clusters in China have emerged to create high-quality industrial gases Huge demand
Air Products, Inc., a leading integrated industrial gas supplier to the global electronics industry for over 40 years, has been serving many of the world's leading semiconductor manufacturers in China supporting the next generation of consumer electronics products such as smartphones, tablets and digital cameras In addition to Nanjing, the company is currently building new plants in Quanzhou, Hefei and Tianjin to support the development of major local integrated circuit projects.