Third Military Electronics New Materials and Devices Forum

annex:

First, the main content of the meeting

1, military electronic polymer materials and devices;

2, military and civilian dual energy storage materials and energy storage devices;

3, Aerospace electronic superconducting materials and devices;

4, military electronic magnetic materials and devices;

5, film materials and devices;

6, military electronics and ceramics;

7, graphene electronic materials and devices;

8, military advanced semiconductor materials and devices;

9, electronic packaging materials and applications;

10, military electronics with high conductivity materials, high thermal materials;

11, military applications and the need to use (to) seeking;

12, Metamaterials and other advanced electronic materials and devices;

Second, the participants object

Research, production or application of advanced electronic materials, components of all state-owned enterprises, private enterprises, military units, research institutes, institutions of higher learning and interested units.

three, Value-added services

The participants will be free to send a corporate information in the Association's public number 'New Materials Society' free enterprise information released in association with the 'military and civilian new materials network' free of charge.

Fourth, the conference fee designated account

Please refer to the registration form for charges, members of the association, please contact the Secretariat (For membership units, please request letter.) Conference fee please remit the designated account within one week.

Account Name: China National Science Park (Beijing ) New Materials Research Institute

Bank: Agricultural Bank of China branch in Beijing Xuanwu Branch

Bank account: 1117 1101 0400 08202

Fifth, the meeting Organizing Committee Secretariat contact information

Dong Ling Yang: cell phone / micro-signal 13718204214; Tel / Fax: 010 -68669738;

E_mail: donglingyang2008@163.com

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