Pan Jiancheng: Next year 3D NAND into the 96 floor | The group is ready.

This year, the global NAND flash industry successfully converted to the 64/72-tier 3D NAND specification, with the process conversion completed, the global shortage problem also gradually eased, group chairman Pan Jiancheng pointed out that at the end of 2018 will enter the 96-tier 3D NAND technology generation, drive a single chip capacity to upgrade to 256gb/ 512GB, SSD control chip technology is also fully upgraded to a new level, the group of key technology has been ready, showing a ready-made posture! This year's NAND flash industry by technology conversion is not smooth, data center for storage capacity of the rapid rise in demand, leading to the imbalance in the supply and demand, chip prices have been high, but such a situation stay too long, resulting in the end product demand is suppressed, not a healthy industrial phenomenon. Pan Jiancheng pointed out that the NAND Flash industry's supply and demand situation in the past two quarters has gradually become more balanced, is expected to drive 2018 years of solid State hard disk (SSD) Mainstream specifications capacity to further improve, because the chip price is not high, SSDs mainstream specifications have been stuck in 128GB, The future is expected to climb further. The industry also believes that the Lok see NAND flash supply and demand after the ease, so that the high price of SSDs to restore the reasonable water level, can lead to buy gas warming, on the one hand, the market, on the other hand for higher storage capacity of the product paving, the entire NAND flash industry gradually into a positive cycle, Pan Jian to point out a 2018-year 3D NAND industry another trend, that is, the end of 2018 will enter the 96-tier 3D NAND technology generation, with the upgrading of technology level, but also drive a single chip capacity to pull up to 256GB/512GB, at the same time, SSD control chip technology must be fully prepared! Pan Jian into further analysis, the technical blueprint of the integrated SSD control chip is the evolution of the NAND flash technology process, all the 2018 related new products are now ready, including the core processing optimizer, error-correcting capability technology upgrade, multi-channel high-speed architecture, And to reduce the current low power design, of course, is essential to the higher capacity of storage technology planning. High-volume NAND flash storage technology, for the electronic competitive notebook computer players is a necessary requirement. In this market area, the mainland is the focus of contest, the group in the mainland market and Shadow Technology (GALAXY Microsystems) formed a strategic alliance, the film into the electric competition business time has been up to 9 years, but also feel that the power of the competition to increase the demand for SSDs high efficiency, and talk about the effectiveness of the issue, SSD control chips play a key role! The PS3112/PS5012 series of high-end SSD control chip product line, also selected in the electric race events ' 2017 Nineth session of the ride competition Carnival official appearance. 2017 's ' Ninth Ride competition Carnival ' is a grand hold in Wuhan Optics Valley, attracting more than thousands of players, live games is to attract the vast number of users on the mainland. In the meeting, Pan Jian became chairman of the NAND Flash industry's technical development blueprint analysis, the group Association has PS3112 and PS5012 series of products in the next quarter official debut, will be the world's fastest, largest capacity of the consumption of SSD control chip, Featuring SATA-compliant ps3112-s12, as well as PCI g3x4 specifications Ps5012-e12, these two new products are expected to start sales in the 1th quarter of 2018, with 3D NAND chips with a maximum capacity of up to 8TB, It is entirely tailored for the high capacity memory of the competing players.

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