iPhone X Accelerate 3D Sensing Applications, Soitec Launches Next Generation Dedicated SOI Substrate

According to Yole's recently released "3D Imaging and Sensing - Version 2017" report, 3D imaging and sensing devices have seen significant commercial growth in 2016 with a market size of more than $ 1.3 billion. With the recent success of the iPhone X, Is showing an accelerating trend and a large number of 3D imaging and sensing products are expected to be available in the mobile and computing fields by 2018. In the next five years, the CAGR of the 3D imaging and sensing devices market is expected to reach 37.7% annually in 2022 The scale will reach 9 billion U.S. dollars.

System Plus Consulting, a wholly-owned subsidiary of Yole, recently demonstrated the use of TrueTepth modules for 3D sensing in iPhone X. The near-infrared (NIR) image sensor incorporates Soitec's SoI wafers, STMicroelectronics has developed a near-infrared image sensor sensitivity plays a key role.Apple uses STMicroelectronics near infrared image sensor, a symbol of SOI in the large-scale production of image sensors began, Soitec and other SOI wafer manufacturing Merchants bring huge market opportunities.

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Soitec recently introduced a groundbreaking new generation silicon-on-insulator (SOI) substrate, the latest generation of its Imager-SOI product line, designed for advanced near-infrared near-infrared Image sensing applications and design.

Soitec is now able to offer this proven SOI wafer on a large scale to meet customers' growing 3D in AR / VR (augmented reality / virtual reality), face recognition security systems, advanced human-computer interaction and other emerging applications Sensing and Imaging Needs SOitec's new SOI substrate easily extends the high-resolution operating range of silicon-based CMOS image sensors into the near-infrared range. This optimized SOI substrate greatly improves the performance of image sensors in the near infrared Band signal to noise ratio.

'Our latest Imager-SOI substrate represents a significant new company achievement in the SOI field and is an intelligent choice to effectively enhance the sensing performance in the NIR band, accelerating the growth of new applications in the growing 3D imaging and sensing market , "Said Christophe Maleville, executive vice president, Digital Electronics Business Unit, Soitec." Innovative sensor designs can be implemented on SOI using our advanced proprietary technology and extensive manufacturing experience in thin material layer transfer. "

Soitec's Smart Cut technology gives it the world's best SOI wafer manufacturing capability. Other SOI wafer suppliers in the world, such as SunEdison (MEMC) and Shin-Etsu SEH, also benefit from Soitec's Smart Cut technology Authorized.

Smart Cut technology was jointly developed by Soitec and CEA-Leti (Electronic and Information Technology Laboratory of the French Atomic Energy Commission, one of the world's foremost microelectronics research labs.) Soitec has successfully commercialized this technology for mass production. The technology is now tightly protected by more than 3,000 patents owned by Soitec, and today most of the industry-leading SOI wafers for chip manufacturing are manufactured by wafer suppliers using Smart Cut technology.