Zhang Lijun said that with the implementation of this project to raise funds, the company will be able to effectively enhance production capacity, and capacity expansion supporting the market development plan will also be effective .1, deep plowing strategic customers, enhance customer market share through the embedded Technology development and further participate in the research and development of key strategic customers, expanding the Company's leading technology and production advantages to other product families to further enhance its market share. Meanwhile, the Company will continue to improve the market development and customer service end-to-end processes, Technology, quality, delivery of business processes and enhance customer response speed and quality. 2, to expand the international market, develop the market segment In the company will continue to deepen the development of the international market, improve the company's global marketing network, through overseas channels such as integration, Focus on expanding semiconductor, new energy, smart driving, smart manufacturing segments such as high growth, grasp the business growth opportunities in the global market.
It is understood that Shennan circuit focus on the field of electronic interconnection, committed to 'create a world-class integration of electronic circuit technology and solutions', with printed circuit boards, packaging substrates and electronic assembly of three businesses, forming a unique industry '3-In-One' business layout: that is, with the interconnection as the core, while continuing to strengthen its leading position in the printed circuit board business, it will vigorously develop its 'same-technology' packaging substrate business and 'customer's homologous' electronic assembly Business. The company has the ability to provide comprehensive manufacturing capabilities of 'sample → small and medium batches → high volume' and provide customers with professional and efficient one-stop integrated services through full value chain services such as program design, manufacturing, electronic assembly, microassembly and testing solution.