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1 pass Samsung grab 7% of Hisilicon orders, the new plant to start in December;
Set a micro-channel news, Qualcomm back to embrace the TSMC, Samsung, the full attack for new customers Samsung recently came out with the two manufacturers signed a 7-nanometer wafer foundry orders. Not only that, Samsung also plans to mass production of 6-nanometer process , Seize TSMC market share.
Korean media etnews news, industry sources pointed out that Samsung Electronics is working with two major semiconductor vendors to discuss 7-nanometer wafer foundry orders, one is the United States manufacturers, the other is a Chinese manufacturer. US manufacturers agreed to please Samsung trial production, and has begun Relevant preparations.Chinese manufacturers are mobile device system-on-chip (SoC) developers, consider changing Samsung foundry 7-nanometer process.
Earlier, set micro-mesh has been reported Hass seventh choice in the process of choice of second-generation process, the spread of Samsung, Georgia core, Intel have all their own efforts, and now appears to be Samsung more dominant.It is reported that Samsung intends to OLED panel, DRAM and NAND flash memory and other components as a source of incentives, hoping to think of HiSilicon to Samsung 7nm chip manufacturing process.Although the two in the smart phone market is a competitor, but the component tying strategy is a major incentive.
However, Samsung was slightly behind TSMC at a production-time of 7nm, but TSMC used a conventional immersion stepper to produce 7nm and Samsung's lithography process using extreme ultraviolet (EUV) Expected to win two new customers, coupled with Samsung's own Exynos processor orders, Samsung's 7nm and 11 lines will produce 40,000 to 50,000 sets of chips per month.
At the same time, Samsung plans to mass-produce 6-nanometer process as soon as possible and reclaim the old customers who switch to TSMC.Samsung is prepared to send a letter of intent to ASML, a manufacturer of semiconductors, to buy 9 EUV devices. Into the South Korea Hwaseong Plant, the other installed by the end of this year, others will be gradually introduced.
Previously, Samsung, a foundry in Huacheng, kicked off a plate of iron and the city government refused to issue a license. Now that Samsung has bowed its feet and agreed with the requirements of the city government, it is expected to obtain a license in early December.
IC Insights latest release 2017 global semiconductor manufacturers revenue rankings, statistics show that Samsung's revenue forecast this year up to 65.6 billion US dollars, the market share of 15%, will be squeezed out of Intel to become the world's largest semiconductor plant.This will be Intel Samsung has been the champion for the first time in 24 years since 1993. Samsung's capital expenditures in 2017 reached 26 billion U.S. dollars, creating an unprecedented record, of which 5 billion will be spent on foundry parts The dollar is used to boost manufacturing capacity at 10-nanometer manufacturing.
In terms of talent, Samsung desperately hired talents from major companies and quickly narrowed the gap with UMC, TSMC. Industry sources said the head of the core (GlobalFoundries) in charge of Kye Jong-wook, jumped to Samsung last month, will be on behalf of the wafer The engineering department serves as team leader for the design enablement of the research and development office.
2. The world's first end-to-end 5G NR system interoperability debut China Mobile Global Partner Conference;
- China Mobile, ZTE Corporation and Qualcomm to Achieve Significant Milestone in the Development of 5G New Air Interface Technology -
Set micro-grid news, November 24, China Mobile, ZTE and Qualcomm held in Guangzhou, China Mobile Global Partners General Assembly held an end-to-end 5G new air interface (5G NR) system interoperability release ceremony, the first public demonstration in full compliance with 3GPP standard end-to-end 5G new air interface system interoperability, end to end 5G new air interface system uses 5G new air interface ZTE pre-commercial base station and Qualcomm's new 5G air terminal prototype, using 3.5GHz band. China Mobile Research Institute Zhang Tongyue, Huang Yuhong, vice president of China Mobile Research Institute, vice president of ZTE Corporation, and Baiyan Bai, general manager of TDD & 5G products, and Meng Pu, chairman of Qualcomm China, attended the launch ceremony and jointly opened a live demonstration of system interoperability. 5G new air interface technology to large-scale pre-commercial important milestone in the industry, and will promote compliance with 3GPP standards 5G network and terminal industries rapid development.
Zhang Tongsu, dean of China Mobile Research Institute, said: "The successful release of China Mobile, ZTE and Qualcomm systems marks a new phase in the development of the 5G industry. China Mobile will continue to unite its partners to promote the 5G industry The chain as a whole has further developed and matured, and efforts have been made to commercialize 5G in 2020.
ZTE vice president and general manager of TDD & 5G Bai Yanmin said: "ZTE is honored to complete this system interworking demonstration with China Mobile and Qualcomm.Industrial cooperation between all parties is an important measure to achieve 5G commercial, ZTE will continue to promote 5G R & D process in all stages of testing and verification, and promote the 5G in all regions of the world commercial implementation.
Meng Pu, Qualcomm China chairman, said: 'The three operators, system vendors and chip manufacturers to jointly complete the world's first 5G end-to-end air interface system interoperability is a major milestone in the development of 5G and we are very excited. In the future, Qualcomm will continue to work with Chinese operators, system vendors and terminal manufacturers, as well as the wider vertical industry partners, to devote more resources to the next phase of 5G R & D efforts and fully support the development of China's 5G industry. "
Currently, Qualcomm is working hand in hand with the Chinese industry to actively promote the rapid development of 5G.As the first cooperation partner of China Mobile 5G Co-Innovation Center, Qualcomm will showcase 5G new air interface prototype system jointly with China Mobile in 2016 in order to jointly promote 5G global unified standard, And jointly support the standardization work of 3GPP 5G. Qualcomm started to forward-looking 5G as early as many years ago and devoted itself to making global standards for 5G new air interface and made important contributions to 3GPP standardization activities.
On the product side, Qualcomm has introduced the first 5G modem - the Snapdragon X50 5G modem family that supports 2G / 3G / 4G / 5G multimode with a single chip that supports the world's new 5G air interface standard and Gigabit LTE. Months, Qualcomm Successfully Implements World's First 5G Data Connection Powered by the Snapdragon X50 5G Modem to Achieve Gigabit Rate and Data Connectivity over 28GHz Millimeter-Wave Band Last year, Qualcomm was the first to release a 5G modem chipset The company's ability to release from product to feature chip in just 12 months is a clear indication that Qualcomm's lead in all cellular technologies is currently extending to 5G. In addition, Qualcomm has introduced its first 5G Smartphone Reference Design , Designed to test and optimize 5G technology for cell phone power consumption and size requirements.
3. Semiconductor developed a wearable gas sensor and real-time display system;
Shen Guozhen, State Key Laboratory of Superlattice, Institute of Semiconductors, Chinese Academy of Sciences has recently developed a new type of wearable gas sensor and real-time display system driven by a micro-capacitance array. The related research results have been published in "Nanometer Energy".
Planar miniature capacitors are the best powered devices for flexible wearable electronic devices, but the single capacitor has a small voltage window and low energy density, making it difficult to power the wearable device continuously and without interruption. There are many different types of integrated capacitor array driven detection systems have been developed, but with the light detection, pressure sensor phase Compared with gas sensors, the response time of target gas is long, the corresponding energy consumption is larger, the requirements of energy devices are higher, and the difficulty of integration is increased.Therefore, it is important to study the self-driven gas sensor integrated system significance.
The integrated system consists of a circular capacitor array based on electrodeposited polypyrrole electrode material, a room temperature ethanol gas sensor based on carbon nanotube / polyaniline material and an in-situ gas analysis and display system. The capacitance of the assembled capacitor is 47.42 mF / cm2, the response time of the gas sensor to ethanol gas at normal temperature is 13s and 4.5s, respectively. When gas enters the sensor, the current on both sides of the gas sensor will change. The components in the circuit board will collect this change and proceed Calculated and compared with the pre-stored standard curve to obtain the gas concentration value, and then transmit the signal to the phone via Bluetooth, then the phone APP will show the corresponding gas concentration and draw a real-time It curve, personalized wine drunk driving Testing and other fields have a wide range of applications. Science Network
4. Shenzhen Basic Semiconductor involved in the development of third-generation semiconductor technology roadmap
A few days ago, the 6th Symposium of the Third Generation Semiconductor Technology Roadmap Working Group was held in Hong Kong ASTRI. Shenzhen Basic Semiconductor Co., Ltd. attended the activity as a member of the working group and was involved in the formulation of the technology road map and discussions.
As an innovative enterprise of silicon carbide power devices, basic semiconductors will take full advantage of their own advantages and actively participate in relevant work. The company introduces world-class R & D team from overseas and the core members have dozens of core members Year semiconductor materials and device technology research and development experience, the master of the world's leading silicon carbide core technology, the third generation semiconductor technology has great enthusiasm and insight .This participation in the international technology roadmap, the third generation of China The semiconductor industry will have far-reaching impact on the development of upstream and downstream industry chain also has instructive significance.
Since its establishment in March 2017, the working group has completed the first version of the technology roadmap. More than 40 experts from government, corporations and industry attended the meeting to summarize the group's milestones and set the stage for the next phase. The third generation semiconductor industry technology innovation strategic alliance chairman Wu Ling, chairman of the board, said that everyone together to develop third-generation semiconductor technology roadmap, just caught up with the rare opportunity for industrial development, not only the market has huge demand, the state is also formulating Related policies support the development of the industry.
The third generation semiconductor is one of the new generation of green materials of the next generation. It has a huge application market. Taking the silicon carbide device as an example, its market capacity is growing at a rate of 25-39% per year. It is estimated that by 2020 the entire market of silicon carbide devices Capacity will exceed 1 billion USdollars.China in the first and second generation semiconductor serious lag behind the advanced level in foreign countries, each year 200 billion US dollars of imports of electronic devices, it is difficult to achieve a breakthrough catch up.But in the third generation of semiconductor materials research work As long as we seize the opportunity and increase the development efforts in chip devices, our country is expected to concentrate its superior forces in achieving the turn-over and turn-around corners of next-generation silicon carbide power chips in one fell swoop.
Basic Semiconductor actively respond to the state's call for the development of emerging industries, integration of leading overseas technology and domestic industry resources, is committed to silicon carbide power device research and development and industrialization, the future of products will be widely used in electric vehicles, photovoltaic, PFC, motor drive, photovoltaic , Electric vehicles and other fields for China's third-generation semiconductor industry, the rapid development of fueling.
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