Semiconductor annealing is not a single means of cooling, but the rapid heating and cooling from heating to cooling process.Diesel semiconductor wafer due to the incorporation of impurities, will lead to dramatic changes in the nature of the material properties of the wafer through the annealing process, can restore the crystalline Structure, eliminate defects.
The annealing process is related to the yield of semiconductor products. Taking the 7-nanometer process as an example, the temperature of the epitaxial heat needs to be lowered to 600 degrees Celsius or less during the annealing process. The smaller the process size is, the lower the required temperature is and the future market trend is reduced to Celsius 450 degrees below.
At present, "rapid thermal annealing" technology due to the high temperature process, easy to have thermal diffusion effect.Industry Institute of Mechanical and Electrical Systems Institute researcher Huang Kunping pointed out that the "semiconductor microwave annealing" directly to the silicon wafer by microwave heating, can be avoided Thermal diffusion effect, to achieve low-temperature annealing effect, batch processing multiple wafers, more than "rapid thermal annealing" can only handle a single wafer more efficient.