Beijing, China (November 20, 2017) - Texas Instruments Incorporated (TI) announced the DLP® Next Generation Technology for Automotive Head Up Display (HUD) systems.The new DLP3030-Q1 chipset and its accompanying evaluation module (EVM) Helps automotive manufacturers and Tier 1 suppliers display high-brightness, dynamic-AR content onto windshields, bringing key information to the driver's attention.
Developers can utilize the DLP3030-Q1 chipset certified with a vehicle gauge to develop an AR HUD system that can project virtual image distances (VIDs) of 7.5 meters or more. The unique architecture of DLP technology enables the HUD system to withstand the long- This is achieved by the intense sunlight load, combined with the ability to display images in a wide field of view (FOV), giving designers the flexibility to create an AR HUD system with enhanced depth of field for interactive Rather than a decentralized infotainment and instrumentation suite For more information on the DLP3030-Q1 chipset, visit www.ti.com/DLP3030Q1-pr-cn.
The main features and benefits of the DLP3030-Q1 chipset:
Package Size Reduction: The ceramic pin-grid array package (CPGA) reduces the space occupied by the DMD by 65%, resulting in a smaller picture-generation unit (PGU) design.
Higher operating temperature: -40 to 105 ° C operating temperature, 15,000 cd / m2 brightness with full color gamut (125% 'NTSC') for sharp images regardless of temperature or polarization .
Designed and optimized for AR: Easily manage solar loads generated by VIDs over 7.5 meters in length while supporting large displays up to 12 ° × 5 ° FOV.
For any light source: Supports HUD designs using traditional LEDs and laser-based projection for HUD with holographic film and waveguide enable.
Tools and support
With any of the three new EVMs in the DLP3030-Q1 chipset, the HUD system can be easily evaluated, designed, and mass-produced no matter which design cycle car manufacturers and tier one suppliers are in.
The DLP3030-Q1 electronic EVM allows developers and tier one suppliers to create their own custom PGUs for HUD systems.
DLP3030-Q1 PGU EVM gives designers the tools they need to develop new HUDs based on DLP technology or baseline DLP technology in existing HUD designs.
The DLP3030-Q1 Combiner HUD EVM enables automotive manufacturers and tier one suppliers to use DLP technology to evaluate overall system performance in an easy-to-use desktop demonstration.
Packaging and delivery
The DLP3030-Q1 chipset is available in a 32mm x 22mm CPGA package and is available on request. EVMs are available on TI.com. Technical documentation is available on request.
Learn more about automotive display DLP technology
Learn more about the DLP3030-Q1 chipset
Find out which EVM is right for you
Read TI's white paper on HUD technology
Learn more about the HUD system
Watch the video of the DLP3030-Q1 chipset and related EVMs
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