Wu Tianyu said the semiconductor industry is a competitive industry in the world, ASE is the only global packaging and testing plant in 18 countries in the world with 18 production sites, and deep plowing Fabless and IDM customers, and with the global economic development and Industry trends change, ASE 10 years began to import intelligent production, the first stop on the Kaohsiung plant to start some of the production lines and factories have reached the level of turn-light production.
ASE to promote intelligent production, packaging and testing industry in the absence of talent to help flexibly human configuration, at the same time, ASE also revealed that, in addition to rely on intelligent production to reduce manpower, on the other hand continue to help employees pay raise, positive Retain talent.
ASE has been actively investing in Taiwan in addition to its global layout in recent years. As China's 12-inch fab mushroomed, many Taiwan-based IC packaging and testing plants have been set up to set up new factories, and ASE is also considered China to increase new investment? In this regard, Wu Tian-yu said there is no plan.
As for the market concern, TSMC continued to expand the high-end packaging process InFO production capacity, whether it will impact ASE, Wutian Yu said that in recent years, copper package, system-in-package technology, the industry competition has always existed, and TSMC The relationship between competition and cooperation has always existed. It is not because the other side develops a certain packaging technology that it does not cooperate. The relationship between the two parties is still very good.
Speaking of the growth of the semiconductor industry in the future, Wu Tia-yu still maintained the tone of slight growth. He said that in the past few years, the growth rate of the semiconductor industry has been around 3 to 5% and the trend of next year is almost the same. Kinetic energy comes from artificial intelligence, Internet of Things, automotive electronics, high-performance computing and other applications.
Industry analysts believe that artificial intelligence will use a lot of semiconductor and packaging capacity, the current terminal device has been used in smart phones above, the future will also be used in automatic driving, game consoles, surveillance systems, robots, unmanned aerial vehicles, intelligent assistant , AR / VR above.