Winbond believes that in the IoT era, chip security, authentication, privacy, code and modem confidentiality are of paramount importance, with the release of TrustMET secure flash memory based on the architecture of the trusted computing industry consortium (TCG) device identity architecture engine (DICE) product.
Whether consumer electronics, industrial applications, the increasing use of Internet users, the privacy and security of information delivery process has become a very important issue, but also the future of the Internet of Things is the key to universal access, security issues are not resolved, The era of all things is difficult to come.
Therefore, establishing Root of Trust and data confidentiality are important considerations for designers in developing new connectivity devices.TCG DICE Architecture Defining New Security Privacy technologies provide new avenues for systems and components Smallest silicon requirements to enhance security and privacy.
Based on the TCG DICE architecture, Winbond TrustME Secure Flash memory can be implemented in a secure chip (XIP) to ensure mutual authentication between trusted root and IoT cloud services, as well as peace of mind in storing keys, verifying information and certificates.
At Embedded Technology 2017 and IoT Technology, Winbond will showcase another 1.2V SpiFlash low voltage serial flash memory product family for the Internet of Things, wearable devices, voice products and other applications requiring low power consumption and small form factor Package of product applications, covering consumer and industrial applications.
According to research firm WebFeet Research, there will be 50 billion networked devices by 2020, and sensors will need to use ultra-low-power SpiFlash low to extend battery life.