SK hynix applied for the highest number of memory patents in the United States, Q4 into the production of 72-layer 3D-NAND

According to Korean media reports, South Korea Patent Office statistics show that from 2011 to 2015, the United States filed for memory design, manufacturing, packaging technology patents a total of 58,838, of which SK hynix to 2,594, Samsung Electronics ranked the top two with 2,566, making up 8.8% of the total, followed by Toshiba (2,289), Micron (2,120), IBM (1,977), Witten (1,289), Intel (1,008 ).

South Korea Patent Office said that South Korean manufacturers to apply for the first stack of 3D DRAM and 3D NAND Flash patents, thus driving the global memory market changes.

It is reported that in 2011, the above-mentioned 7 manufacturers filed 417 memory applications in the United States and then grew steadily each year to 4,151 in 2015. The main reason is that with the gradual replacement of the hard disk drive (HDD) by the solid-state drive (SSD), the industry Manufacturers are beginning to focus on NAND Flash applications for a large number of patents.According to the latest report from DRAMeXchange Research Center pointed out that the third quarter benefited from the traditional peak season effect, iPhone 8 / X new machine and the Chinese brand mobile phone demand and other major energy-led , SK hynix revenue in the third quarter reached 1.5 billion US dollars, up 15.4% compared with the previous quarter to observe the future capacity planning, SK hynix continues to focus on the 48/72 layer 3D-NAND capacity expansion among them, and in the fourth Quarter of the 72-layer 3D-NAND mass production, as the main force of growth in 2018.

In addition, Samsung benefited from the server and smart phone manufacturers in the third quarter of the new flagship machine, revenue growth of 19.5% over the previous quarter, came to 56.2 billion US dollars.From the process and capacity analysis, Samsung 64-layer NAND Flash since Since the beginning of mass production in the third quarter, it has already begun to be applied to the demand of mobile terminals and SSDs, and the application products will be gradually expanded. It is expected that the overall proportion of 3D-NAND chips will exceed 50% by the end of the year.

It is worth observing that Samsung is reviewing the need for continued expansion of NAND Flash and the distribution of DRAM capacity and is considering relocating part of the second floor of Pyeongtaek Plant for DRAM production which will likely make it easier for NAND Flash to return to supply in the future The market conditions, is conducive to Samsung's future market strategy.

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