Now the performance of smart phones more and more powerful, one of the problems that must be solved to this end is cooling.As the mobile phone with cooling components require a higher cost, in the past few years, handset manufacturers are mainly for high-end models integrated cooling components Of course, mid and low end models do not actually need heat because they rarely overheat.
Samsung is one of the first to have its flagship handset equipped with a heat pipe-based cooling system, and they will do so in the future, according to sources in the supply chain in Taiwan, who said Samsung will still be equipped with heat pipes for the flagship aircraft in 2018, though Recently there are rumors that Samsung will abandon the program.
Many handset manufacturers in the industry are now exploring another heat-conducting design based on steam cooling, which uses cooling tubes that are much more efficient in terms of heat dissipation but are often more expensive if you want to achieve large-scale cooling High.In addition, another disadvantage of vapor cooling for space also have relatively large requirements, is not conducive to the light weight of the phone.
According to an insider who asked not to be named, steam heat is likely to be used on flagship smartphones by 2019, but that depends very much on the level of development and the cost over a year.
