Grid Core and Fudan Microelectronics team to deliver the next generation dual-interface smart card

Chip Grid and Shanghai Fudan Microelectronics Group Co., Ltd. announced today that they have manufactured the next generation dual-interface CPU card chip using the 55-nm Low Power Extended (55LPx) technology platform. The Lattice 55LPx platform enables Integrating multiple functions onto a single chip provides a secure, low-power, and cost-effective solution that is especially well suited for China's bank card market including applications for finance, social security, transportation, healthcare and mobile payments.

Fudan Microelectronics Group Co., Ltd. dual-interface CPU card FM1280, support for contact and contactless communication mode, the use of low-power CPU and through the core silicon verified 55LPx RF IP FM1280 uses SST SuperFlash memory technology based on embedded EEPROM memory to protect user code and data.

'With the growing use of smart card, in order to maintain our leadership in this market, low-power solutions is critical.' Fudan Microelectronics Group, vice president of engineering Shen Lei said, 'Our FM1280 card power consumption is more Low, more reliable, and uses advanced process nodes. Lattice advanced 55LPx platform, with low power logic and highly reliable embedded non-volatile memory, is ideal for our next generation of bank cards. Fudan Microelectronics Group is very pleased to continue to maintain long-term cooperation with the grid core, the industry's leading product. '

The 55nm LPx platform offers solutions for rapid product production, including SST's SuperFlash® memory technology, which is fully compliant with consumer, industrial and automotive applications. The Core 55LPx platform SuperFlash® memory technology enables extremely small form factor Storage unit, fast read speed, superior data retention and rewritable times.

"GridCore is very pleased to collaborate with Fudan Microelectronics Group, a recognized leader in the Chinese smart card industry." Dave Eggleston, Vice President, Core Storage Memory Division, said: "Fudan Microelectronics Group joins the rapidly growing 55LPx Platform that offers superior low-power logic, embedded non-volatile memory and a combination of radio frequency IP for smart cards, wearable Internet of Things, industrial MCUs and the automotive market. '

The Lattice 55LPx technology platform is already mass-produced in the company's Singapore 300-mm fab production line, which Qualcomm Semiconductor and Silicon Mobility are currently implementing respectively for Core Wexel 55LPx platforms in wearable internet of things and automotive products.

Process Design Kit (PDK) is available now, and silicon-proven IP is also available in large quantities For more information on core CMOS solutions, contact your core sales representative or visit www.globalfoundries. com / cn.