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1. Taiwan's IC packaging and testing plant: Cross-Strait competition is inevitable;
Speaking on the rise of mainland China's semiconductor industry, ASIMCO Chief Operating Officer Wu Tianyu, Li Cheng, General Manager Hong Jiajin Yu, Changhua Group President Huang Jianeng, and Constant Power Chairman and CEO Hu Zhuqing and other big four yesterday (15th) at the Taiwan Semiconductor Industry Association (TSIA At the annual meeting, it was unanimously agreed that the fierce competition in the future between the two sides of the Strait is inevitable, but it should not be overlooked that the cross-Strait cooperation has brought about enormous business opportunities.
Wu Tianyu pointed out that in the next ten years, the electronic terminal products will blossom in full bloom and is expected to be a new opportunity for the semiconductor industry in the future. Taiwan's semiconductor industry chain must have confidence in the mainland but the nature of the business model will change substantially. Taiwan's industries should have more control over the mainland change.
Hong Jia Jin Yu believes that Taiwan's IC packaging and testing should be integrated consolidation, fight gangs and through differentiation, have the opportunity to compete with the mainland manufacturers.
Huang Jianeng urged that Taiwan should attach importance to the important role played by the material factory in building a complete ecological supply chain. Otherwise, it will surely face a serious impact once it is broken.
Hu Ch'u-ching believes that the semiconductor industry across the Taiwan Strait should proceed with the added value of enhancing each other's value and not ignoring the mainland's development of the Belt and Road and nuclear power.
2.MLCC shouted up 30% next month;
The market entered the industry off-season, but passive components ceramic capacitors (MLCC) out of stock the same situation, the Taiwan-based leading plant State Giant yesterday (15) by the channel business interests to the client this year the fourth price increase notice, Specific MLCC products will be on December 1 price increases from two to three into.
According to the legal person, the situation of MLCC being out of stock for the next year is quite established from the moment when the giant giant shouted up, and the selling price of MLCC products has risen steadily, driving the revenue growth of the relevant supply chain. However, for the downstream customers The cost pressure cooker heats up.
Under the guidance of Guoyu State under its guidance to its clients, due to the continuous increase of many raw materials and labor costs, as well as the continuous strong demand of NPO MLCC and the widening gap between supply and demand, a total of 15% of the total demand will be started from December 1 Series NPMLCC to extend delivery, and adjust the price.
According to the notification of price increases issued by China, the delivery will be extended from one to three months to six months and the price will be raised by 20% to 30% or even higher, depending on the actual items. Macro group this year issued the fourth price increase notice.
It is understood that NPO MLCC prices have been poor, resulting in Japan and South Korea out of most markets, the main supplier for the Taiwan factory and land factory.
However, NPO MLCC continued to rise in costs this year and is now ten times higher than the beginning of this year. As MLCCs continue to be out of stock, factories have shifted their production capacity to high-priced, high-margin products, resulting in a more serious NPO MLCC shortage.
Giant giant announced in April this year raised the price of 0603 size MLCCs and chip resistors, MLCC amplitude of about 8% to 10%, chip resistance rose about 5%; the second announced the end of June jump; September is the first Three times the amount of mobile phone MLCC more shout up.
3. Due to the earthquake in South Korea, part of LGD production line shut down Samsung SK Hynix temporarily damaged;
According to Bloomberg, AFP and Yonhap news agency reported that South Korea had a magnitude 5.5 earthquake on the eastern coast at 2:29 p.m. local time today. The epicenter is located about 9.3 kilometers northwest and west of Pohang, 10 km, Seoul and many other places are feeling the shock, even in Japan, Nagasaki also felt, followed by 5.4, 3.6 aftershocks, people panicked escaped outdoors, some buildings damaged, and the collapse of the situation; reported that , South Korea's Atomic Energy Corporation said that the domestic nuclear power plant in normal operation.
The quake has been felt throughout Korea, whether it is Seoul, more than 300 kilometers away, Busan, the second largest city, or Jeju Island, the largest outlying island.
According to Korean media reports, due to the earthquake, LG Display, part of the LG Group, temporarily shut down and restarted immediately after the earthquake. LG Display plans to monitor the situation and prepare for possible future aftershocks .
Samsung Electronics and SK hynix said the semiconductor production line was uninterrupted or damaged due to a magnitude 5.4 earthquake in the Pohang area in Gyeongnam Province Samsung Electronics said that immediately after the earthquake, it was aware of the status of Gyeonggi-do and Hwaseong Semiconductor factories, And shows that no damage has been done so far.However, even if a relatively small earthquake occurs, it is known that a photographic apparatus that prints a semiconductor circuit by applying light to a chip can also be temporarily stopped automatically.
SK Hynix also said no damage to the semiconductor plant in Gyeonggi-do and Chungbuk-gu, or interruption of production lines, a company official said: "If damaged, employees should report immediately to the Central Disaster Prevention Office.
In September last year, the largest earthquake in North Korea, Samsung Electronics and SK Hynix Semiconductor production line part of the equipment temporarily closed.
4.UltraSoC weakened SoC design challenges to accelerate the development of China's localized chip;
(Set micro / Wen Deng Wen standard) 'Today's SoC design challenges are growing, the market cycle is shorter, system-level complexity is stronger, the third for the prevention of security is also greater, the cost of a chip to the market also The reason for this phenomenon is mainly due to the fact that the way the chip design has not changed. "Rupert Baines, CEO of UltraSoC, said at the Shenzhen Media Communication Conference that the current design of the chip is still hard to adopt the traditional design method Solve such challenges.
Rupert Baines, CEO of UltraSoC
UltraSoC simplifies SoC development with embedded analytics IP and provides embedded analytics capabilities that speed up new chip design development by lowering barriers such as chip design cost, process, and integration, and is compatible with all infrastructures and provides high performance for different orders of magnitude IC companies, maker and so provide the ability to control the customized chips, and its competitors are directed at the industry overlord Arm.
Support for open source RISC-V architecture, changing SoC design challenges
As an IP vendor, UltraSoC, founded in 2011, is not a veteran but has a large customer base Rupert Baines says our IP is to help customers solve the toughest problems and find out what's going on in chip designs problem.
Currently, customers that have already integrated UltraSoC's IP products include HiSilicon (Huawei), Inter, Microsemi, Imagination, Movidius, PMC-Sierra, etc., and have successfully streamed chips at 40nm, 28nm, 16nm and 7nm process nodes.
The rapid prototyping of UltraSoC's customer base is inextricably linked with its open-source philosophy. "The idea behind the open source move is that instead of engineers having to design every single part of the sketch, UltraSoC delivers its IP with DesignShare, which fundamentally alters the challenges of chip design '
In September, UltraSoC announced that it will provide debug and trace technology for the SiFive Freedom platform based on the RISC-V open-source processor architecture specification, which UltraSoC has already developed and is using by processor vendors. The UltraSoC's debug and trace features will be supported Users of the Freedom platform extensively interface with the tools and interfaces used in their designs while enhancing the open source RISC-V architecture ecosystem.
On November 14, Rupert Baines announced that Microsemi Corporation has purchased Microsemi products for the RISC-V open-source processor architecture licensed for the UltraSoC Universal Analysis and Embedded Intelligence Platform Furthering the two companies' engagement in the RISC-V ecosystem, UltraSoC is currently partnering with six major RISC-V processor vendors, following the company's early promises to support the fast-growing open-source ecosystem The UltraSoC also announced in June this year that it has introduced the industry's first processor tracking solution for RISC-V.
Optimize Performance Reduce Costs and Accelerate Support for Localized Chip Development
UltraSoC's embedded semiconductor IP products enable designers of complex and high performance devices to create an on-chip architecture that can monitor the hardware and software behavior of a chip in a non-intrusive manner, allowing engineers to take advantage of the IP to get the ultimate understanding of the interworking between on-chip processor units, custom logic and system software.
According to Rupert Baines, the benefits of using embedded UltraSoC embedded IP analysis are substantial. For example, when designing a chip, the speed of CPU is not planned so fast. Ultra SOC's IP technology can solve this problem. In addition, CPU Caching, Ultra SOC At the software level, optimizing the cache improves the CPU performance by up to 20% and provides SoC designers with valuable embedded analytics.Otherwise, according to SemiCo Research, Using UltraSoC's IP technology in the development process can double the profitability of many projects while reducing development costs by a quarter.
In addition to its leading customers in North America and Europe, a number of leading Chinese chip design houses have chosen UltraSoC for their related projects, such as Huawei Haas, Inc. These advanced chips are expected to be used in a variety of applications including Generation networks, 5G mobile communications, high performance computing (HPC), artificial intelligence (AI), etc. UltraSoC's technologies are aggressively serving these partners with ARM, RISC-V, MIPS and other architectures.
'The China market is very important for UltraSoC, including many big customers in China, and China has a lot of market incentives in the global semiconductor industry, including startups developing new SoC applications.' 'Rupert Baines said many Chinese customers are using our IP UltraSoC will enable more chip makers to be localized based on this technology, and UltraSoC will be showcased at the 2017 China IC Design Summit and the ICCAD 2017 in Beijing With its on-chip monitoring and analysis IP, Rupert Baines will lead the team at the event and will be presenting a forum entitled "System-Level Complexity Challenges" at Forum 3, November 17: , Security and security architecture needs' presentation.
5 TSMC start 5-nanometer plant construction monthly production capacity is expected to see 9 to 10 million
Semiconductor foundry leader TSMC held a quarterly routine board meeting on the 14th, the meeting decided to pass the capital budget of about 129.8 billion yuan (NT, the same below), including the capital investment will be invested more than 50.5 billion yuan to build a workshop, the official launch of 5 nm The new plant construction plans.
Equipment manufacturers pointed out that TSMC is located in Taiwan's South Branch Park 5-nanometer new plant total investment amount of 200 billion yuan, to catch the first half of 2019 to complete the construction, trial production in the second half, 2020, the official mass production.
TSMC held a board meeting yesterday. During the meeting, it approved a capital budget of about NT $ 129.8 billion, including a capital budget of about 50.5 billion yuan to build a factory building and a capital budget of about 79.3 billion yuan for other projects to expand and upgrade advanced manufacturing capacity and expand advanced packaging processes Capacity, expansion of special process capacity, conversion of logic process capacity to special process throughput, and R & D capital expenditures and recurrent capital budgets for the first quarter of 2018.
In addition, the Board of TSMC also approved within the limit of not more than 2 billion US dollars, the TSMC Global Ltd. TSMC Global Ltd. set up by the TSMC in the British Virgin Islands capital increase to reduce the cost of foreign exchange hedging.
The biggest highlight of TSMC's board resolution lies in TSMC's official launch of a 5-nanometer new factory construction plan. TSMC's 10-nanometer and 7-nanometer production lines are focused on Fab 15, a 12-inch ultra-large foundry of China Electronics Technology Corp. Branch 12-inch super-fab Fab 14 extension is expected to be built from the first 8 to 10, a total of three plants, 5-nanometer total monthly capacity is expected to see 9 to 10 million.
The 5-nanometer TSMC new site was launched in September this year and covers an area of more than 40 hectares. As the cost of construction and equipment is getting higher and higher, the total investment amount of the 3-nanometer 5-nanometer plants will hit a record high and the device industry estimates that it should reach 200 billion yuan .
As a result, TSMC's capital expenditure this year is expected to reach 10.8 billion US dollars has hit a record high, the next two years, capital expenditures appear to be higher than this year.Li Hemei TSMC Finance Minister said in a few days ago that the TSMC years years of capital Spending will be maintained at more than 10 billion US dollars, capital expenditure revenue will remain at 30 to 35%.
TSMC in the fourth quarter has begun trial production of 7-nanometer, is expected to officially mass production in the first quarter of next year, the Ministry of the mask process using extreme ultraviolet (EUV) technology, 7 + nano is expected to mass production in 2019. As for the 5-nanometer Department At present, it plans to start pilot production in the second half of 2019 and mass production in 2020.
In addition, TSMC has decided to build a 3-nanometer wafer fab in Nanke Park, respectively, Fab14's No. 11 and No. 12, due to the current shortage of water shortage in Taiwan is still pending, TSMC also continued with the government and director Organizations to communicate, 3-nanometer new plant will begin construction in 2020. Business Times
6. Samsung NAND Flash IC Insights expansion estimate Fear of excess
Samsung's capital spending this year will double to 260 billion US dollars, of which, in turn will be the largest NAND flash 3D NAND, research institutes IC Insights think, 3D NANDFlash may be oversupplied.
IC Insights estimates that global semiconductor capital spending this year will reach 90.8 billion U.S. dollars, up 35%; of which Samsung's capital spending this year will double to 26 billion U.S. dollars, more than Intel and TSMC.
Samsung Capital spending this year, the main investment in 3D NAND flash memory will reach 14 billion US dollars, IC Insights pointed out that Samsung will spend 7 billion US dollars to promote dynamic random access memory (DRAM) process technology and make up for the process of conversion Caused capacity loss.
In foundry, IC Insights said Samsung will invest 5 billion US dollars to expand 10-nanometer manufacturing capacity.
In addition to Samsung's massive capital expenditures, Samsung's rivals such as Hynix and Micron will also see a significant increase in capital expenditures, which ICInsights believes will threaten the over-supply of the 3D NAND flash market.