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1. Zhang Ru-Jing and then venture! Corecom integrated circuit manufacturing (SIMC) settled in Guangzhou;
Set micro-mesh news, in September this year, set micro-grid has reported Huangpu District Government, Guangzhou Development Zone CMC and China's chip leader Zhang Rujing Dr. signed a memorandum of cooperation in the project. Zhang Rujing and the team plans to joint chip design company, terminal applications Enterprises and chip manufacturers, a total investment of 6800000000 yuan to build collaborative chip manufacturing (CIDM) project, put into operation is expected to reach output value of 3.16 billion yuan
It is reported that the first phase of the project a total investment of about 6.8 billion yuan, about 200,000 square meters of land area, capacity design for the 8-inch chip 30,000 per month, 12-inch chip 10,000 per month, is expected to reach output value of 3.16 billion yuan The project has now entered the company registration and arrangements for the land phase.
According to Ji Wei network learned that Zhang Rujing originally intended to set up factories in Ningbo, but due to the Ningbo municipal government decision-making is too slow, go to Guangzhou first.Guangzhou company there is not registered, Ningbo side does not rule out the second phase of construction In fact, as early as November last year, Semiconductor Manufacturing International Co., Ltd. 'Lost' Ningbo, because Ningbo is China's imports of semi-chemical specialty chemicals port is also the nearest second-tier cities from SMIC headquarters, based on logistics considerations, plus Ningbo has a mature semiconductor material supply chain and processing base, Ningbo plant will be built the largest semiconductor research and development and manufacturing industry base in the continent.
Zhang Rujing calls on the industry to take the path of the shared collaborative IDM Corporation (CIDM, Commune IDM), in which chip design companies, end application companies and chip manufacturers participate in the project investment, through the formation of a joint venture will be multi-party integration, the chip design company owns Chip manufacturer's proprietary capacity and technical support, while the chip maker to obtain market protection.This lead the collaborative chip (CIDM) project, is nearly 70-year-old Zhang Ru-jing back into the integrated circuit manufacturing, but there is no doubt that CIDM mode Is it suitable for China's development? Will it be a challenge that we must face if we encounter multiple challenges in the process of implementation?
2.Cadence settled in Pukou District of Nanjing, becoming the next leading project after the introduction of TSMC;
Set micro-network reported in Nanjing / Mao Mao
Cadence, a leading provider of electronic design automation (EDA) and semiconductor intellectual property (IP), formally signed a Memorandum of Understanding (MOU) and Investment Agreement with Pukou District People's Government of Nanjing on November 13. It is reported that the Cadence project is Pukou District, Nanjing Following the introduction of TSMC after the introduction of integrated circuit design in the field of another leading project, after two years of negotiations, with the joint efforts of all parties, finally signed the contract today.
Mr. Qu Weimin, executive deputy director of the Management Committee of Jiangbei New Area in Nanjing and Mr. Qu Weimin, secretary of Pukou District Party Committee, said that the signing ceremony marked the strategic investment of Nanjing Pukou District and Cadence entered a substantive stage. The Jiangbei New District of Nanjing is the only one in Jiangsu Province National New District, Pukou Jiangbei New Area is an important carrier, and integrated circuits has become our focus on cultivating new technology industries.In the development of integrated circuit industry practice, high-end chip core IP development and services has been China's IC design and industry Bottleneck of development, Cadence, the world's first electronic design automation tools company IP, is the world's No. 1 provider of EDA program services and design services, will be on the Nanjing IC industry chain development support plays a very important role Therefore, Cadence semiconductor industry base is different from the general investment projects, he can represent the world-class technology level, will play an inspiring strategic role for the national IC industry .We will not hesitate to all expectations, fully coordinated Policies, resources, supervise the project started early, early operation, promoting Pukou set Circuit industry to go abroad, to the world.
Mr. Chen Liwu, Cadence president and chief executive officer, said Cadence has a strong technical support team in China that provides simulation results from system hardware and software, digital front-end and back-end and low-power design, digital-to-analog RF front-end simulation and DFM, Physical verification, SiP package and PCB design and other technical support, and the next 10 years, 20 years Cadence will be towards the system design process, including IP is a very important part of As the design becomes more complex, Cadence at the most sophisticated Of the 7nm, 5nm, 3nm above spent a lot of energy, domestic customers can provide better service and support in the entire system design, the country still needs more progress, so Cadence chose to settle down in Nanjing, ready to build the domestic foundation In terms of IP, system design services to help the more domestic development.C Cadence chose Nanjing, can be described as the right time and place, of which the sky refers to a large fund, the geographical point refers to the Nanjing convenient transportation, people and means Is a talent, Nanjing has many universities, you can train a lot of talent.
Mr. Ding Wenwu, President of National IC Industry Investment Co., Ltd. said that Cadence's cooperation with Pukou District People's Government of Nanjing was a strategic choice made by Cadence some time ago. Cadence is one of the three largest EDA suppliers in the world, IC industry has made a great contribution to China's IC industry has also made a significant contribution to Nanjing Jiangbei New Area is the only state-level new area in Jiangsu Province, which in the IC industry has done a lot of work, there have been TSMC, And settled in Jiangbei New District, this Cadence settled in Pukou District, is also our Pukou District, Jiangbei New Area People's Government in the development of integrated circuit industry an important work, is also a wise choice Cadence.Nanjing in the development of IC industry, it also requires a large number of IC enterprises settled in Nanjing, China's IC industry is not only involved in the development of Chinese enterprises, but also the participation of overseas companies, capital investment also includes Chinese capital and foreign capital. The Cadence settled in Nanjing, in fact, is also necessary for the development of our industry Tools, IP, we also believe that Cadence settled in Nanjing, Jiangbei Pukou area and we will give them more policy and personnel support, and hope to be able to Cadence good technology, products to Nanjing to.
Mr. Long Xing, director of National ASIC Engineering Center of Southeast University, expressed his warm congratulation on the fact that Cadence finally settled down in Nanjing. Mr. Long Xing said that in the course of the development of integrated circuit industry, the pulling of application and the progress of technology are very important. But more importantly, is designing methodological innovations, and Cadence, the world's leading provider of EDA and IP, is itself at the heart of design methodologies and believes Cadence's arrival in Pukou, Jiangbei New Area, Upgrade, and industrial development play a more active role.
Chen Xiangzhen, Deputy Secretary General of Jiangsu Semiconductor Industry Association, said that under the guidance of the Outline of National Integrated Circuit Industry Development Promotion, Jiangsu Province, especially Nanjing, accelerated the pace of development of the integrated circuit industry. TSMC, Gekema, Huahong, Tsinghua Unisplendour And a number of well-known integrated circuit companies have gathered in the province, one after another will be completed and put into production the same time, integrated circuit design industry is an important part of integrated circuit industry chain, Nanjing, Jiangsu Province, is the IC design industry as IC industry focus on the development of integrated circuit design is inseparable from the EDA software tools and IP modules, and Cadence is a world-renowned EDA and IP leading provider of today, Cadence in Nanjing to establish R & D technical support and services, Provide more timely and efficient technical support and service to design enterprises and wafer manufacturing enterprises in Nanjing City, which will undoubtedly further promote the development of integrated circuit industry in Jiangsu Province.
3.MLCC single material maximum increase nearly 10 times Shortage tide ease in 2018;
Set micro-mesh news, MLCC tight supply and demand by the impact of production capacity, the price soared, has completely exceeded expectations.According to the recent supply chain vendor feedback, Giant has launched this year, three rounds of MLCC price plans; Chaozhou Tricyclic on October 9 MLCC products from the price adjustment and extend delivery, the price increase rate of 15% or more; the domestic MLCC leading Fenghua Hi-Tech has announced price adjustment, 0201, 0402, 0603 and other mainstream models full price increase of 5% -30%.
So MLCC price increases how much, 30% is the highest premium? According to industry sources to set micro-disclosure, MLCC this round of price increases have been completed more than expected, of which Murata MLCC material rose the most NPO, early this year, each piece NPO cost about 2 cents, and now every NPO has risen to 1.85 yuan, or nearly 10 times.
Why does this NPO capacitor price increase so high? According to the insiders said, mainly by the iPhone8 series using wireless charging, Apple wireless charger for its AirPower has purchased a large number of Murata NPO capacitors, leaving the domestic wireless charging manufacturers Shipments are not many, capacity in short supply, coupled with the capacitance of the capacitor material instead of film capacitor performance is poor, resulting in Murata NPO capacitor prices soaring.
And each wireless charger uses more than one NPO capacitor, there are currently domestic manufacturers to launch support for iPhone X wireless charger to use 6 NPO capacitors, according to the current 1.85 / PCS, wireless charger NPO total capacitance to 11.1 Yuan, even more.
In fact, due to the surge in market demand for wireless charging NPO capacitor prices soaring, which is still a case of MLCC this round of price increases, after all, an ordinary smart phone, you need at least 300-400 MLCC, iPhone7 MLCC The amount of more to 700, iPhone8 more.Overall, MLCC products out of stock, the market in short supply, from the Japanese manufacturers release capacity, supply structure adjustment, and the market demand for a substantial increase of 3 for the inspection.
First of all, starting from the second half of 2016, Murata and Taiyo Yuden and other major manufacturers plan to phase out medium- and high-capacity MLCC products for medium and low-end applications due to automotive, industrial and iPhone needs and release standards up to 20% MLCC production capacity, which means that Japanese manufacturers gradually withdraw from the general standard MLCC market.This is mainly because the standard MLCC market after years of bargain-hunting competition, the remaining profit margins, while the automotive and industrial demand is greater , Higher profits.
Second, the MLCC supply structure changes.Passive components industry, high-level financial director pointed out that Japanese MLCC manufacturers and some Taiwan plant expansion niche MLCC products, the lock is the average selling price and higher gross margin automotive, industrial and high-end mobile phones Which led to expansion bottlenecks in MLCC production equipment in the first, middle and last segments after Japan Murata, Kyocera, TDK, Samsung, Taiwan Giant and Huaxingke dominated the majority of MLCC market share. As MLCC leading companies in Japan began to focus To do high-end automotive MLCC market, to give up the low-end MLCC market, so that consumer demand for MLCC production capacity is limited, unable to match the growing market demand.
The third is the rapid expansion of market demand, including mobile phone brand manufacturers such as Apple, Samsung, Huawei, Vivo and Oppo, etc., to increase the strength of MLCC passive components. With fast charging, the function of wireless charging lamp needs high-quality capacitor technology, Demand for MLCC products is high, and the number of MLCCs for automotive electronics continues to increase, exacerbating the overall demand for MLCCs in short supply. The three Japanese passive component manufacturers will fully support Apple's MLCC products with no additional capacity for other handset manufacturers.
Of course, from the raw material point of view, the upstream core raw material palladium metal rose sharply year on year, but also driven the industry prices continue to rise an important factor.At present, giant, Fenghua Hi-Tech has expanded, last year, Fenghua Transtech Services MLCC monthly capacity of 9 billion, is expected Expanded to 13 billion, after the completion of the MLCC production capacity equivalent to 43.73% of the country's giant last year's production capacity. Japan Solar Tekboard also issued expansion plans, plant No. 3 in March 2019 to start production, production capacity will be expanded to the present 1.6 Times. In addition, Huaxinke also started expansion, expansion rate of about 10% to 15%. Fenghua Hi-Tech, South Korea SEMCO MLCC have gradually expanded production capacity, range of about 10% to 15% range, of which half the proportion of standard MLCC expansion, the other Half of the expansion of high-end MLCC products.
However, insiders believe that despite the MLCC manufacturers have gradually expanded across the Taiwan Strait, but the standard MLCC products are still in short supply, the new capacity is still unable to meet the strong market demand, the market price will remain tight, prices are expected to continue until the first In the second quarter, some MLCC out-of stock situation may even continue until the end of next year.
Although the passive component industry into the traditional off-season in the fourth quarter, but due to the second quarter, Apple iPhone8 Series start parts peak season, the three major Japanese passive component manufacturers will fully support Apple's MLCC products, there is no excess capacity to other mobile phone manufacturers , The current supply and demand gap is still as high as 15%, MLCC market in the fourth quarter of this year, the off-season is not short, the market demand will further increase.In addition, due to shortages of MLCC market is difficult to alleviate the MLCC market price increase is not reduced, MLCC Manufacturers will continue to enjoy the out of stock bonus, is expected this wave of MLCC shortage is expected to ease the second quarter of next year.
4. Powerful international manufacturers, China's memory next year, welcome the 'war';
Siu Yi Innovation and Hefei Industrial Investment Holdings (Group) Co., Ltd. recently signed a "cooperation on memory R & D project agreement," agreed in Hefei, Anhui Province Economic and Technological Development Zone, the two sides cooperate to carry out the process 19nm memory 12-inch wafer memory ( Including DRAM, etc.) R & D projects, the project budget of about 18 billion yuan. Previously, the industry has always been easy to innovate Siu Mei Hetian Changxin cooperation in the development of DRAM memory chip news came out.This agreement indicates that Siu Yi innovation officially joined the storage competition pattern.
In addition to Siu Yi innovation and Hefei Changxin, the major domestic companies investing in memory chips, including the Yangtze River Storage and Fujian Jinhua, the current three major storage chip companies are stepping up the construction of memory chip factory, the fastest is expected to begin later next year Put into production.That is, 2018 is expected to become the first year of mainstream memory development.
Siu Yi innovation officially entered DRAM memory competition
On the evening of October 31, Siu Yi Innovation released a notice of suspension of major issues and said it planned to plan major issues that may involve the issue of shares to buy assets. The industry analysis is related to the signing of a $ 18 billion memory project in Hefei. According to the cooperation agreement, Siu Yi innovation will be in Hefei Economic and Technological Development Zone Airport Economic Demonstration Zone to carry out the process 19nm memory 12-inch wafer memory (including DRAM, etc.) R & D, the goal is to December 31, 2018 R & D success that the product The yield is no less than 10% The project budget reaches 18 billion yuan, Siu Yi Innovation and Hefei Investment will be responsible for raising the proportion of 1: 4, and Siu Yi Innovation is responsible for raising about 3.6 billion yuan.
At present, the leading product of Siu Yi Innovation is special memory NOR Flash, one of the five largest NOR Flash suppliers in the world, as well as the supply of SPI NAND and SLC NAND etc. Siu Yi Innovation has been hoping to enter the mainstream memory DRAM memory market.Moreover, Innovation has planned to acquire Core Semiconductor (ISSI) as DRAM R & D base. Core Semiconductor is one of the major international SRAM suppliers, but also some DRAM products. After the termination of the cooperation, Siu Yi innovation and in turn started with Hefei Cooperation research and development plans.As the main platform for the development of memory in Hefei, Hefei Changxin plans to invest 7.2 billion US dollars building memory chip factory, mainly to DRAM memory chips.
At present, there are mainly three main players in the mainstream memory chips in the country, namely, Changjiang Storage jointly invested by National IC Investment Fund and Ziguang Group, Jinhua of Hefei, and Changxin of Hefei. The initial storage of Yangtze River will be positioned at 3D NAND production and the later DRAM Product development.On September 28, No. 1 production and powerhouse of Yangtze River Storage will be capped in advance and it is estimated that it will be put into operation in 2018. After the completion of the project (Phase I), the total production capacity will reach 300,000 pieces / month and the annual output value Will exceed 100 billion US dollars.Changjiang Storage CEO Yang Shining said that in Wuhan will produce from the world's most recent independent production of China's memory chip products, full supply of domestic memory chips can supply more than 50%.
Fujian Jinhua to DRAM memory chips, with an investment of 37 billion yuan, is expected to put into operation in 2018. Its cooperation with China UMC, one of the major OEM foundries in Taiwan, the latter to assist in the development of DRAM memory chip technology.Recently, UMC said The first phase of technology development will be completed in the fourth quarter of next year.
The expansion of international manufacturers will create price pressure
According to the planning, development and production of the three storage plants, most of the time falls in 2018. Therefore, next year will be a key year for the development of domestic storage, and from the market conditions, the global memory chip prices will continue to rise in 2017, Consulting data show that in 2017 the average global memory unit sales increased 35.2% over last year, the global memory industry revenue growth of 60% to 65% .If this situation continues, the new market for the Chinese storage enterprises will be a big Good, on the opening is a favorable condition.
However, a few days ago it was reported that Samsung and other international memory manufacturers have plans for expansion in 2018. Wu Ya-ting, research associate at DRAMeXchange, pointed out that the contract price of mainstream standard memory modules (DDR4 4GB) is Example, starting from the middle of last year rose from an average price of 13 US dollars pulled up to the contract price of 30.5 US dollars in the fourth quarter of this year, the price of six consecutive quarters of growth, a total increase of more than 130%, driven DRAM maker profitability significantly Upgrade.Kunshi, Micron accumulated a lot of cash in hand, led by rising memory prices for several consecutive quarters.With abundant resources, SK hynix will start the 18nm process at the end of the year, Wuxi Plant will also be built next year, Is expected to output in 2019; Micron announced by the surge in share price cash replenishment, on behalf of the future in the cover new plant expansion capacity and process upgrades ready; Samsung is also intended to Pingze plant on the second floor was originally planned to build NAND Production lines, part of the shift to the production of DRAM, and the full use of 18nm process, together with the original Line17 there is still some room for expansion, the move is expected to Samsung up to 2018 DRAM output increased 80K ~ 100K wafer, Samsung supply of output next year move up from the original estimate of growth of 18-23%.
Samsung and other international manufacturers expansion is bound to suppress the rate of increase in memory prices, but also enhance the access threshold for Chinese enterprises.
Industry chain closely cooperate to promote the storage industry
The market demand for memory chips is on the rise. According to IC Insights, the largest segment of the market in 2016 was logic with a capacity of $ 88.3 billion and the memory chip market was the second largest with a market capitalization of $ 74.3 billion, both of which The gap has been reduced to less than 20% .China is the world's largest server, PC and smart phone market, the demand for storage chips is also extremely large.However, in the face of the international giants capacity technology market and other leading-edge, China's development of memory chips It is bound to face great challenges.
In this regard, Siu Yi innovation Chairman and General Manager Zhu Yiming pointed out that at present Chinese enterprises in the special memory market has formed a certain basis, but in mainstream memory such as NAND Flash, DRAM, there is a gap between the rise of the domestic semiconductor industry needs upstream and downstream industry chain In close cooperation and mutual assistance to form a synergies.More Previously, Siu Yi innovation in NOR Flash in cooperation with SMIC to play the advantages of virtual IDM in DRAM, Siu Yi innovation may also take the same strategy, and He Xin Chang Xin similar cooperation mode.
Industry expert Mo Taikang also pointed out that China's development of the storage industry is a long-term process that can not be accomplished overnight. For a long time to come, China's semiconductor industry must be a down-to-earth follower and a learner, It is also a "contributor" that makes common progress with the industry. Unlike other parts of the world, China is making every effort to develop the semiconductor industry and is therefore quite powerful. It is unmatched by other parts of the world and the country. Even if the temporary roads are somewhat Circuitous, there is nothing terrible. China Electronics News
5. Xi'an Jiaotong University Science breakthrough phase change memory speed limit
Set micro-network news, according to Xi'an Jiaotong University News reported recently, the United States Science magazine published in the form of First Release Xi'an Jiaotong University and Shanghai Institute of Microsystem and Information Technology cooperation paper - Reducing the stochasticity of the crystal nucleation to enable sub -nanosecond memory writing (to reduce the randomness of crystal nuclei for sub-nanosecond data storage), the work was released online only 10 days after it was received.
In today's digital globalization, the explosive growth of information poses a tremendous challenge to the storage and transmission of data, and the storage components in the current commercial computing architecture, namely SRAM, DRAM and NAND Flash) between the increasing performance gap, during which the efficiency of data exchange has become the bottleneck of the development of electronic equipment.Therefore, research and development with large storage density, read and write speed, low energy consumption, non-volatile Not lost), etc. PCMAM is the closest commercialized general-purpose memory, and the first commercially available semiconductor chip jointly launched by the international semiconductor giant Intel and Mircon Phase change memory 'Proton' has been put into the market this year.China's scientific research personnel with the strong support of the state, after more than 10 years of development, has also been able to initially achieve the industrialization of phase-change memory.But all the current phase-change memory read Write speed is still not comparable to high-speed memory, such as memory (nanoseconds) and cache (sub-nanoseconds.) Remove the level of industrial processes, the core problem is the most important The phase change material (GST) randomness of nucleation, the crystallization process usually requires several tens to several hundreds of nanoseconds, and the crystallization speed directly corresponding writing speed.
In order to solve the bottleneck of writing speed, Prof. Zhang Wei from CAMP-Nano School of Materials Science and Engineering, School of Materials Science and Engineering, Xi'an Jiaotong University, Prof. Ma En from Thousand Talents Program and Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences Associate researcher Rao Feng worked together to screen novel antimony and tellurium alloy materials by means of material calculation and design, which can accelerate the nucleus inoculation process with structurally adapted and more stable scandium-tellurium chemical bonds The randomness of the nucleation process drastically speeds up the crystallization, ie, the speed of the writing operation. Compared with the best performing phase change devices in the industry, the operating speed of the scandium-antimony-tellurium device has been increased by more than 10 times to 0.7 ns fast reversible Operation, and reduce operating power nearly 10 times through material simulation calculations, the researchers clearly revealed the ultra-fast crystallization and ultra-low power micro-mechanism.The results of this study to understand and control the shape of amorphous materials Nuclear and growth mechanisms have important guiding significance, and laid the foundation for our country's independent universal memory technology.