IC packaging in the industrial chain location
IC manufacturing process includes chip design, wafer manufacturing, packaging and testing of the three links in the industry chain, the package is located in the lower reaches of the wafer manufacturing process in the upper reaches of the module manufacturing package can be considered integrated circuit manufacturing process The last process refers to a process in which a die is laid out on different types of frames or substrates, and the die is fixedly connected, a terminal is pulled out, and the package is fixed by a molding compound (EMC) to form a package with a different shape.
Packaging in the integrated circuit manufacturing industry chain position
The role of integrated circuit package contains four aspects: First, play a role in protecting the chip; Second, the package can play a supporting role in the chip, making the overall strength of the device is not easy to damage; Third, the packaging process is responsible for the chip circuit and the external lead Feet connected; Fourth, the package for the chip to improve the reliability of the environment, protect the chip life.
In the development of China's IC industry, although the packaging and testing industry is not as eye-catching as the rapid development of the chip design and manufacturing industry, it has also maintained a steady growth momentum. Especially in recent years, with the rapid growth of domestic local packaging and testing companies, Growth and foreign semiconductor companies to large-scale transfer of packaging and testing capabilities to China, China's IC packaging and testing industry is full of vitality.
From 2008 to 2016, the sales revenue of China's IC packaging and testing industry showed a volatile growth. In 2016, the industry sales revenue reached 156.43 billion yuan, an increase of 13.03% over the same period of last year.
2009-2016 China's packaging and testing industry sales revenue and growth (Unit: billion,%)
From the domestic market, IC packaging and testing companies in the Yangtze River Delta, the Bohai Rim and the Pearl River Delta region, the western region due to the improvement of investment environment, policy support and cost advantages of the future, will become the future of integrated circuit packaging companies important Investment area.
Distribution of China's IC packaging enterprises (Unit:%)
The future of integrated circuit packaging industry is promising
First, the industrial policy environment continues to improve.In recent years, the state has introduced a series of policies to support the integrated circuit industry, these policies led to the rapid development of the domestic electronic information industry and integrated circuit industry.According to the national development plan, the expected Future countries will also introduce more concessions for the integrated circuit industry, which will effectively promote the healthy and steady development of China's IC industry.
Second, the market demand is growing.China's semiconductor and microelectronics market demand growth led to the development of semiconductor packaging industry, semiconductor and microelectronics industry is in a continuous development cycle, computer, communications, consumer electronics and other electronic information products market demand driven integrated circuit industry Development, the development of the semiconductor and microelectronics industries drove the development of the semiconductor and microelectronic packaging industries.
Thirdly, the technical level of the industry is increasing day by day. In order to meet the needs of electronic products such as versatility, miniaturization and portability, new packaging technologies continue to emerge. Integrated circuit package manufacturers introduce advanced production equipment and improve products by increasing technical input Technology content, develop new products, which can achieve a higher level of profitability and enhance competitive advantage; the same time, improve the technological level also increased the industry to enter the threshold, to avoid the vicious competition within the industry, to protect the healthy development of the industry.
Finally, the international production base is concentrated in China and China still has the cost advantage of primary factors such as labor force, technology research and development, land and capital, and more and more overseas semiconductor companies are expanding their production scale in China. International semiconductor companies and package manufacturers The shift to China not only expands the market scale of integrated circuit packaging, but also brings advanced technology to China and rapidly improves the overall level of China's IC packaging industry, which will surely drive the rapid growth of the industry.