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1, Hon Hai Wei state contract will push 8K +5 G ecosystem;
Hon Hai Group in the United States on the 11th (Taipei time on the 12th) signed a contract with the United States Wisconsin government, Hon Hai Group Chairman Terry Gou led the unit, officially finalized within four years of the local $ 10 billion investment contract, the goal of promoting the 8K +5 G Ecosystem development.
Hon Hai Group (12) yesterday released the latest statement stressed that it will promote the local 8K +5 G ecosystem, the park covers an area of 1000 acres, will be combined with local technology, labor, capital-intensive advantage.
According to Hon Hai Group's goal, the locally-produced world's most advanced large-size LCD panels range from the latest generation of TVs, autonomous vehicles, aircraft systems and education, entertainment, healthcare, cutting-edge manufacturing, office automation, interactive retail to secure living Etc. In addition, the park is expected to include LCD module rear segment module, display module precision machine parts processing and molding, final product assembly and other services.
In a statement, Gou also paid tribute to U.S. President Trump Trump, who expressed his gratitude for the leadership of President Trump and the idea of creating employment in the United States. He also thanked Governor Wisconsin Governor Walker and the Wisconsin Economic Development Corporation WEDC) cooperation and support for Hon Hai to build the world's most advanced panel manufacturing park in Wisconsin.
2, 2018 There are two OLED screens iPhone GIS outlook better;
According to foreign reports, in 2018, the iPhone will have two models using an active organic light-emitting diode (AM OLED) screen, which will not only lead to a sharp increase in shipments of touch panels such as the GIS industry, The unit price will be raised again, which can be said that the price will keep rising and will continue to boost GIS's profitability in 2018.
2017 iPhone X because of the first use of OLED panels, resulting in the bonding process increased to 15, with the first adoption of Face ID, making the transition becomes very difficult, but also makes iPhone X posted shipping unit price, compared with the iPhone 8 50% higher than the previous year, driving up the record high of profits made by GIS2017 in Q3.
Foreign media reports that there will be three iPhones in 2018, including the 5.85-inch and 6.46-inch OLED versions of the iPhone, and the 6.05-inch LCD version of the iPhone. As can be seen, OLED version of the iPhone in 2018 will add another paragraph, making the volume Will continue to improve.
In addition, the current 5.85-inch full-screen OLED, laminating process too much, already engage in supply chain people turn horseback, the 2018 6.46-inch OLED, will be more complex paste, which greatly enhance the shipping unit price of GIS and 2018 won Lee, there will be very big help
3, Apple supplier IQE raised nearly 100 million pounds ready to expand their business;
IQE, one of Wales' leading technology companies, raised nearly £ 100 million and will fund the development of the world's first compound semiconductor cluster while also creating 2,000 high-tech jobs. IQE's Headquartered in Cardiff, which will be listed in London, the company successfully raised £ 95 million by placing more than 67 million new shares.
Apple will benefit as the company continues to grow in business as the company's technology is believed to power the new 3D sensors in the latest version of the iPhone so it can better use facial recognition, unlocking and many more Features.
The iPhone's 3D sensors require so-called VSCEL wafers, and IQE owns 80% of the wafer's market share, so Apple naturally benefits from the company getting more money to continue doing business.
It is reported that a new generation of VSCEL wafer production will be concentrated in Newport's former LG Semicon foundry, the first part of the machine is currently in production.The facility is said to be laying 100 machines, with all the machines It also doubles the number of machines IQE currently owns, knowing that each machine is worth more than millions of dollars.
Increasing capacity will enable IQE to address a variety of mass market opportunities while also consolidating its leadership in VCSEL wafers for use in 3D sensors.
Although IQE has never commented on its clients' identities, foreign media have also mentioned that a new contract with Apple will bring them millions of pounds of profit. In addition to Apple's iPhone, IQE predicts Its technology is used in other devices and departments, such as medical and driverless cars.
We all know that the iPhone is made up of a myriad of different sensors and components, and there is a problem at any point, which can have a huge impact on the production of the iPhone. Apple certainly wants to be a partner on every supply chain. To ensure production capacity, after all, no one wants to see the iPhone because of a component production capacity problems that led to the eventual supply shortage of this situation.
I believe this year, iPhone X before the sale of various rumors of inadequate supply, once also let many consumers worried.
4, nano-imprint technology to help roll the volume of soft substrate process can be expected;
Soft electronic process can be broadly divided into two categories, one is to take the flexible substrate with glass, in the existing process equipment manufacturing components, and then to lift (Lift-off) process; one is directly to the roll Roll to roll (R2R) flexible substrate fabrication process.
One can imagine the first process is mounted on the existing process, so the equipment and process development is less, the product is also relatively limited to Unbreakable and Curved products, for the bendable (Bendable) and Foldable products are more difficult to deal with; and directly in the flexible substrate manufacturing components R2R process is the one we expect, with great economic benefits of soft processes and soft components, can really meet the bending and flexing The final demand.
Satisfy the needs of the patterning process Printed flexible electronic efficiency
Stripping process developed very early in 1999, Seiko Epson that the development of Surface Free Technology by Laser Annealing (SUFTLA) technology (1), the TFT and other components produced in the amorphous silicon release layer film, and then excimer laser The amorphous silicon layer stripped, and then adhered to the plastic substrate, so only need to develop the process of stripping can achieve the purpose of making electronic components in the plastic substrate. Peel layer material is the key to the stripping process, the most important is to be able to withstand subsequent The temperature of the process, with the improvement of PI material's high-temperature characteristics, PI has a certain stability at 400 ℃, so it is a suitable material for the peeling layer. The stripping process is currently developed by Samsung with laser stripping and ITRI Edge Mechanical Peel Multipurpose Flexible Electronic Substrate Technology (FlexUP) Technology (Figure 1).
The biggest manufacturing challenge of fabricating electronic components directly on flexible substrates is the patterning of various functional materials. The traditional process is to fabricate the electronic components by exposure, development, etching and stripping processes. Obviously, Printed to soft substrates are the most efficient processing methods for soft electronics. There are many techniques for printing, but different technologies have different resolutions and requirements for ink properties, Figure 2 (4) Finishing the technology used in the soft electronic patterning process comparison table.
As can be seen from Figure 2, compared with the traditional yellow technology, the printing technology is relatively weak in the resolution part. Taking the Retina (326 ppi) highlighting the high-resolution screen used by the iPhone 4 in 2010 as an example , The sub-pixel color of each color is less than 30μm. The comparison of the above table shows that the resolution of the device will be a challenge of the printing process. For electronic components that require high resolution, Inkjet and micro touch Micro Contact Print and NIL Imprint Lithography (NIL) can achieve high resolution, while components with general resolution of tens of micrometers or even hundreds of micrometers, such as Radio Frequency Identification (RFID), are suitable Gravure Printing or Flexographic Printing that processes very fast.
Jet printing large inkjet printing development speed
Inkjet printing is the most promising application for flexible electronic film forming processes. In addition to the aforementioned high resolution, the use of a Nozzle Array design allows for a large print area to achieve fast, large Area process .Dup Japan Printing (DNP) in 2007 that is the introduction of ten-generation panel color filter production inkjet printer, visible inkjet technology has been industrialized to industrial manufacturing applications, is the current soft Electronic patterning progress faster process.
Film-forming process is a challenge in inkjet printing in the manufacture of soft electronics. Droplet filming involves complex kinetics. When the solution is volatilized, the flatness of solute deposition film is closely related to the type of solvent, volatilization temperature and volatilization rate , The so-called film-forming coffee ring (Coffee Ring) is the ink jet process most likely to encounter problems as shown in Figure 3, through the optimization of film forming process conditions, film forming temperature, printing speed, solvent evaporation rate And drying temperature to find the formation of the film work conditions.
Micro Contact Print (μCP) is a precise patterning method proposed by Professor Whitesides of Harvard University. The concept of the method is as shown in Fig. 4 (6) below. Since the micro-stamp is printed by lithography So its resolution can reach the level of photolithographic etching, the subsequent application is like a seal will be like the pattern transfer, so you can get a very fine pattern, the law for the self-assembly with a monolayer (Self -assembled Monolayers, SAMs). The method of μCP is a fine, high-resolution patterning method, but this method has a high correlation with materials, and the Austrian microelectromechanical (MEMS), nanotechnology, semiconductors Wafer Equipment Factory EV Group (EVG) is a wafer related μCP equipment, but I did not see the micro-touch printing method of roll-to-roll equipment.
Obtaining nano-scale patterns Nanoimprint easily receive attention
Nano imprinting (NIL) was developed by Stephen Chou of Princeton University in 1995. Due to the simple process of the technology, NIL can obtain the nano-scale pattern and is highly valued by all walks of life. Making a corresponding imprint pattern, and then imprinting the pattern onto the photoresist material, and then curing the photoresist to remove the film to obtain a precise pattern The method of photoresist hardening can be heat-hardening or light-hardening or combining light , The way of thermal hardening, the mechanism shown in Figure 5 (7).
Nanometer imprint can be used more printed materials and can produce optical microstructure, so the rapid development, now includes Professor Zhou founded in 1999, Nanonex Corp; University of Texas authorized the creation of Molecular Imprint Inc (MII ); Austria EVG, Germany SUSS MicroTec and Sweden Obducat, ASML and other companies have related processes, materials and equipment; equipment manufacturers in Taiwan have the relevant processes and equipment using nano-imprint technology to produce LED sapphire wafer pattern (Patterned Sapphire Substrate, PSS) to increase the LED light efficiency.
Nano-imprinting requires pressure to be applied to the mold. The roll-to-roll (R2P) and roll-to-roll (R2R) control the applied pressure more precisely. , The process concept is shown in FIG. 6 (a) (8), and printing is performed by using an impression wheel, so that a very fine pattern can be obtained on a flexible substrate as shown in FIG. 6 (b) and (9).
In short, the soft electronic patterning process is based on the component resolution needs to select the technology, low-resolution material viscosity, surface tension, rheology and other characteristics can be mastered, the general printing technology to meet the high resolution The process of inkjet, micro-touch printing method must have the corresponding material collocation, the relative application of space is more limited; and nanoimprint has many years of development experience in the wafer process has been an example of the application is Soft electronic patterning has the potential of technology.
Drop landing accuracy is difficult to master EHD-injet will be precision coated sharp weapon
Soft electronic process equipment can be broadly divided into two parts, one with the soft substrate transmission and other mechanical movements related to the roll-to-roll transmission, tension control, correcting edge and guide the correct; the other part of the process-related , Including the vacuum process, patterning process, etc. For the past, the soft substrate transmission part of the optical coating industry in the soft film has been very mature, but the future use of nano-imprint and other high-resolution process, Bit, substrate deformation compensation will face some challenges, basically not a problem.As for the process part will face more challenges, on the inkjet process and nanoimprint process for the challenge of flexible substrate equipment described as follows.
The biggest challenge for soft electronic inkjet printers is the drop landing accuracy when printing, the drop landing accuracy depends on the inkjet head droplet control to eject the smallest droplet volume, and drop landing Of the offset. Inkjet head processing and electronic control technology, is the largest drop around the volume of the key, due to the increasingly mature micro-electromechanical technology, the volume of ink drops from 2000 30pl (pico liter, pico: 10- 12) Development has so far reached 1pl (Konica Minolta) Figure 7 is a relative scale of different drop size and pixel resolution.
The drop diameter of about 30 μm is about 39 μm. When the ink drop landed, it expands to a diameter of about twice the diameter, about 80 μm, regardless of the error of the printing path. The resolution of 80 μm is about 90 ppi when converted into the display resolution. About 350ppi, therefore, the mechanical resolution of inkjet printing is currently about 30μm, if at high resolution will be limited.If the substrate to do some surface treatment or file wall (Rib) to limit the droplet Position, you can improve some resolution.
Offset degree of drop landing is another cause of error. The deviation of landing degree is the deviation caused by the rapid movement of the ink jet head on the one hand, and the drop caused by the influence of the air flow when the ink drop is flying Flight speed will improve the landing deviation.Process actual situation should be based on the characteristics of droplets (such as surface tension), the print head control parameters (voltage, frequency), substrate flatness and other parameters to optimize.
An Electrohydrodynamic Inkjet Printing (EHD-injet), evolved from electrospinning technology, uses a combination of electrostatic and ink-jet characteristics to make the droplets finer and specially designed It also makes drop landing more accurate. The University of Illinois Laboratory uses a 5μm nozzle to print out 2.8μm droplets with only half the droplet (12). This shows that variations through the applied voltage can rely on MEMS Of the inkjet head to relax the accuracy, but also can improve the accuracy of jet printing. EHD-inkjet technology In recent years, many laboratories in foreign countries designed a research and development machine, and try to commercialize, it is estimated that the future of soft electronic precision coating Cutlery.
Flexible Substrate Deformable nano-imprint self-alignment help large
Soft electronic process is a challenge to the precision of the equipment. For the process with the precision of 1 ~ 20μm, the basic machine and substrate must achieve the stability of less than 1μm. At present, the stability of the optical machine can be achieved Sub-micron level, but the soft substrate is not enough rigidity, easily deformed, causing alignment difficulties, this problem can be overcome with the carrier substrate, the other hand, the general thermal coefficient of thermal expansion of the substrate is greater than 10 ppm / oC, due to Large deformation caused by temperature rise, the compensation is more difficult, which makes nanoimprint, the different functional materials between the alignment difficulties.
Nano-imprint can produce three-dimensional structure, through the imprint of the geometric design, can produce self alignment (Self-align) effect, which requires precise alignment of soft electronic components process, it is very useful Advantages. Using its own alignment features, HP developed on the soft substrate to make the first complete conductive layer, the semiconductor layer, the insulating layer of functional materials, and then to 3D nanoimprint production of third-order photoresist structure, the use of this 3 The top down self-aligning method is called Self-aligned imprint lithography (SAIL) method, as shown in FIG. 9 (13, 14) ).
The TNO-Holst Center in the Netherlands also fabricates 3D structures using 2-step 3D nanoimprint lithography on conductive metal / insulation / metal and then manufactures OTFTs using etch and inkjet organic semiconductor materials. TNO-Holst Center and ASML are also collaborating on nano-imprinting elements up to 1 μm resolution (16). 3D self-aligning nanoimprint addresses the headache problem of soft electronic patterning alignment, a method of soft patterning An important method.
Soft Electronics After more than two decades of development finally market-driven products come to the forefront of the mobile phone from Samsung in 2013 to launch the arc to this year Norway NEXT Biometrics ASA launched the world's first LTPS thermal sensing flexible fingerprints are Soft electronic products will eventually be gradually commercialized one by one. Driven by the market demand, the soft electronic related industries will eventually flourish. In terms of soft electronic products, however, soft electronic materials, processes and equipment The more relevant, material, process and equipment in different areas of integration will be the key to success.
