Jibbon Consulting China Semiconductor analyst Zhang Ruihua pointed out that to accelerate the development of China's semiconductor industry, the four major impetus for the development of domestic imports of alternative needs, national policy, financial support, and innovative applications from the current development point of view, the Chinese semiconductor in the core processor and IC products such as memory basically rely on imports, the import volume has exceeded 1.4 trillion yuan for four consecutive years, to enhance localization rate is one of the important issues.
In addition, the implementation of the continuous government policy of China also shows that the unprecedented will of the Chinese state will lead to the establishment of a national large-scale fund, declaring that the transformation of government support measures in China has effectively merged from concessional subsidies to substantive financial support industries. According to Statistics show that at present, the first phase of the National Funds has raised fund of RMB138.7 billion and boosted the size of local industry funds to more than RMB500 billion. In the past, smart terminals such as smart phones and tablet computers were the main demand. In the future, Internet of Things, AI Artificial Intelligence , 5G, car networking, etc. will be to lead the development of China's IC industry innovation and application of business opportunities.
Zhang Ruihua further pointed out from various fields that from the perspective of China's semiconductor industry structure, IC design industry in China surpassed IC packaging and testing industry for the first time in 2016. The Internet of Things (Io) and 5G (Internet of Things) headed by the next two years, as well as fingerprint identification, dual cameras, AMOLED , Face recognition and other emerging applications, driven by the expected IC design industry share will continue to grow in 2018 to 38.8%, ranking first place.
Observing China's IC manufacturing industry, there are currently 22 12-inch fabs in China, 11 of which are under construction; 18 are 8-inch fabs and 5 are under construction; more new fabs are expected to be in volume production by 2018 , The overall output value is expected to rise further, driving the proportion of IC manufacturing to 28.48% in 2018 rapidly.
IC packaging and testing industry based on cluster effects, advanced technology driven by evolution, along with the new production line operation, China's local packaging and testing plant higher-end packaging technology more mature, orders and other factors driven by the growth of profit, forecast the next two years, output growth Rate will remain at double digit level.
In addition, it is noteworthy that with the majority of fabs under test and IC packaging and testing plant to be put into mass production in the second half of 2018, it will open up opportunities for the growth of Chinese semiconductor materials and equipment industry in China. It will undoubtedly be a big fund, a local fund And many investment institutions, including the focus of attention.