The operation prospect of the second-line sealing and Testing Plant | Automotive electronic NOR flash demand thermal contact

2017, the semiconductor sealing and testing industry in Taiwan showed a trend of quarterly heating, the survey industry said that in the largest mobile communications applications, due to the late arrival of the iphone new products, coupled with the Taiwan IC design companies, such as MediaTek's adjustment strategy, as well as integrated panel touch IC (Tddi IC) and other new products in the 4th quarter of the volume can be greatly increased, Capable of stabilizing power components such as MOSFET, PM IC, vehicle MCU, NOR Flash, DRAM, MEMS sensor, CMOS sensor's second-line sealing testing plant such as Xin-Quan, Chemin, east China, silicon lattice, yat Cheong, Ling Sheng, and so on, operating performance compared to the first-line industry more prominent, and TSMC's fine materials, Hon Hai's core, is the market optimistic about the future operation has the potential to turn the industry. Semiconductor industry said that professional IC testing plant in the purchase and RF IC testing Plant Cantico, the comprehensive effect has gradually appeared, with the Shinshin plough the car with electronic spare no effort, currently holding a lot of global IDM manufacturers test orders, including the Japanese Renesas Electronics, Europe, the German instrument, Infineon and so on, in the Automotive electronics field scored bright eyes. Due to the advanced Driving System (ADAS) and the future driving needs of more vehicle sensing components, car MCU demand is also increased synchronously, the 3rd quarter revenue has exceeded NT $2 billion, the market to estimate the first 3 quarters of profit is expected to overtake the 2016 year level. However, the welcoming system does not comment on financial projections. NOR Flash Market Under the Nintendo switch is expected to chase, coupled with OLED panel mobile phone Wei trend-driven, demand continued to see, coupled with the international memory manufacturers fade NOR flash market, so that China State Electric, Macronix operation to add firewood, also makes the group advantage of East China and Hin, in NOR Flash shouted out of stock to benefit. At present, the Taiwan Department of Industry NOR Flash production capacity has been full, the current expansion speed can not be due to demand, NOR flash price effect is unavoidable. In addition, in response to the TSMC to Nanjing to set up a 12-inch wafer factory, Hin-Quan as one of TSMC's partners, the fastest 2017 end of production capacity is completed, 2018 is expected to start to undertake the TSMC wafer test orders. Welcome the main force for the MCU Test, in recent years will be integrated MCU and RF-IC chip testing business, in addition to working with Cantico attack market, also focus on wafer-level packaging (WLCSP) process, holds the 32% stake in the peak semiconductor, is expected to end the wafer-level packaging products into production. The demand for the golden oxygen half-effect transistors (MOSFET) also continued to look up to the top half of the 2018, whether it is the IDM manufacturer or the Taiwan Department of Chip factory have released optimistic Outlook, professional power Component Seal testing factory Chemin bullish MOSFET industry supply and demand is quite healthy, from the IdM factory orders sound, recently received Taiwan urgent orders, The 3rd-quarter profit hit a record high, as for the car with high pressure product sealing capacity will be in place at the end of the year. As for the recent market high concern of TSMC's sealed test plant and Hon Hai Group's core, supply chain outgoing fine material has the opportunity to achieve profit and loss in the 4th quarter, 3D sensing components due to Apple iphone x market acceptance is high, it is expected to help improve the utilization of refined material capacity, the market gave a lot of expectations, But the company's speaking system does not comment on the financial figures. The core aspect of the message will be cut into the next generation Apple Watch SIP system-level packaging orders, but not confirmed.

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