"With close collaboration with the Invensas team, we were able to get a grip on the DBI manufacturing process quickly and now have the technology for image sensors, MEMS sensing hubs, power management integrated circuits, and more," said Robert Bez, vice president of technology research and development at Avezzano Plant in SMIC. Area customers have the ability to provide 200mm DBI technology. '
'Invensas' DBI technology can provide high-performance image sensors for mobile communications, automotive electronics and consumer electronics, "said Xu Tianshen, senior vice president of global marketing at SMIC." With this technology, SMIC will further expand its business globally, including 200mm and 300mm, including production capacity.
"SMIC's manufacturing team has successfully completed our mission of integrating our DBI technology into its mass production environment." Craig Mitchell, president of Invensas said, "We are pleased to announce that SMIC has been able to undertake customer orders and apply the DBI process We support the mass production needs of BSI image sensors and we hope that both parties will continue to work together to expand this technology platform to support more products and applications. '
DBI Technology is a low-temperature hybrid wafer bonding solution that enables bondless, non-pressure bonding to achieve exceptional fine-pitch 3D interconnect for heterogeneous wafers. The DBI 3D interconnect eliminates the need for TSV downsizing and cost reduction, Pixel-level interconnect technology for next-generation image sensors.