According to a teleconference record, TSMC founder Zhang Zhongmou said TSMC will build a 3nm wafer fab by 2020, and the plant will not reach the United States or elsewhere but will remain in Taiwan.
Earlier news that TSMC due to higher wafer fabs need a larger area of land and hydropower and other peripheral operations support, it may not be able to build factories in Taiwan, just as the United States to increase the attraction, it is possible to open the United States However, this time, Zhang Zhongmou's response completely ruined this statement, and he said TSMC believes the local government can help them solve the problem.
According to previous projections, 3nm wafer fab construction is expected to spend 200 billion US dollars, is expected to boost economic development in Tainan, but even if the construction started in 2020, I am afraid the earliest put into operation until 2023, which means that within 5 years we I am afraid it is difficult to see TSMC's 3nm process processor.
Of course, do not rule out the other companies to catch up, to know the 10nm process when Samsung has later resided, in advance of TSMC production of new technology.But for the processor, the process is indeed important, but the crystal density and the stability of the entire process Sex is more important, this point of view Intel can not be underestimated, is still the industry leader, so the future winner is still unknown, but the popularity of mobile chips has brought many new opportunities for TSMC is necessary Grasp the opportunity.