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We got the R11s is the red version, so the star screen ID design, in fact, is the top and bottom of the screen glass to add a red dot pattern to echo with the dorsal shell, and indeed can visually give people before and after the coordination Feel Front of the screen design with front 2000W pixel camera, due to the design is too close, the designer also specifically for the top glass 2.5D arc narrowed optimization, while the other three arcs are still larger, resulting in good Visual and touch enhancements. The distance between the screen and the glass border is 2mm. No buttons or logo are designed at the bottom of the screen. The screen proportion of the whole screen reaches 85%. R11s again look at the back of the fuselage design has been well received before the micro-slot antenna design actually canceled in this generation, which is a bit regrettable, after all, has developed to the second generation of micro-slot antenna back shell as a whole red, The surface is still using matte technology, feel smooth, metal accounted for 97.5% .Because the physical buttons were canceled, so the fingerprint window design in the back of the upper position. The curvature of the dorsal shell continues the overall style of the previous generation, but not exactly the same, and the difference with the R11s can be found in the back. This design not only feels good but also makes the corners appear thin. R11s can be seen from the bottom of the back shell curvature, and the previous generation of different bottom design, the generation of the bottom of the cut flat design, the line is more obvious design sense. Our measured body thickness of 7.22mm, the official data is 7.1mm, compared with the competitors can be considered very thin. If you measure from the camera at the thickest position of the body thickness of 8.6mm, the quality of this generation of cameras has improved, so for a while we split down to say more. Let us look at the better portability of the previous generation R11, the thickness of only 6.89mm, 0.33mm thinner than the R11s, but also for this sacrifice of 200mAh battery capacity.If I was a product designer, would prefer thick spots, Let the power more, because even 7.1mm is also thin. Thickest camera position thickness of 8.02mm. Thin 0.58mm. Next to the camera is still using a single LED flash. Raised back camera location has also been redesigned from the original caldera design into a separate ring, more delicate and beautiful. From this comparison chart can be seen R11s (red) at the bottom of the design changes, R11 echo with the dorsal shell in the arc design, while the R11s is cut level, the line is more obvious design sense. In contrast, I prefer the bottom of the R11s design, it looks more delicate feel will only be better. The front screen contrasts with the previous generation. If the previous figure can not see the difference between the screen ratio, it is now more obvious in the settings interface, a full two more than the previous generation shows the project. Top forehead width contrastBottom chin width contrast. Appearance of the end of contrast. Began dismantling. Step 1: shutdownTake sim card, Cato part of all metal, and with the fuselage with the redThen remove the two hexagonal head screws at the bottom of the fuselageBottom screw on both sides of the data interfaceThe next step is to use Alice along the lower end of the screen down the metal back shell, very difficult to Alice, much more difficult than the previous generation. Finally, we opened a sexy red coat R11s, the entire structure of the whole showThis generation of fingerprint design in the back shell, so the back shell also has a fingerprint cable connected to the motherboard. This generation of motherboard has two bare connectors are fingerprint connector and power connector. Separate them one by oneMotherboard regional design is still very compact, shielding, cooling, fixed are done in place. The back shell is surrounded by a circle of sealed foam all around, these foam surface is sticky, when connected with the fuselage they are attached to the fuselage and back shell play a sealing effect between the current use of such buckle plus full bubble Mian sealed models are not many. Machine is still three-stage design. Compared with the previous generation can be found in the area occupied by the previous generation of larger motherboards, a direct result of the battery moved down a certain distance, the motherboard layout has also changed, the front camera to move some of the top, but the overall design is still very nearby. Back shell compared to the previous generation of more rear fingerprint recognition hole, the top of the injection area is reduced.Camera added electrostatic conductive stickers to prevent the camera due to static electricity failure, you can also find the top of the antenna feed point location and the number Changes have taken place, taking into account the antenna area increases, I believe this generation of signals will have a better performance. We measured the back shell weight of both, R11 was 28.8gR11s to 30.6g, more than 1.8g may be thickened the whole, may also be the weight of the fingerprint module, I prefer the former, because it will make the back shell more difficult to dismantle. Thickened corner protection is ultimately essential, using injection thickeningThe difference between the two corners is not thick, are injection molding, if the use of CNC cutting metal, then the cost will be higher. Backshell fingerprint module close-up, it is glued to the back shell by a special seal, you want to remove some force needed. The bottom of the fuselage design has not changed much, still optimize the antenna feed point.It is worth mentioning that all the feeding surface are gold-plated to ensure that the service life. Headphone structure design and the previous generation has changed, the most obvious is that the surface put on a red rubber coat, so have a better seal, and the speaker is indeed as before said for the model, smaller. Let us look at the bottom of the R11 design, headphone jack with independent design, the vibrator is soldered on the secondary board, the speaker is larger .It is noteworthy that, due to the larger R11s motherboard, so the battery down, squeezed The bottom of the module space, so the most direct impact is the speaker's volume is reduced. Careful observation can be found in the design of the camera and the previous generation is not the same, and the overall volume larger. I am more puzzled is that this nude on the motherboard predecessor is a glue, but there is no R11s, is the phone's shell sealing enough confidence? The same location on the previous generation of capacitors also have black dispensing. After analyzing the body and back shell design, then we continue to disassemble, first disconnect the power supply. The bottom connector cover is fixed by two screws, after removal you can see the bottom of the three connectors, respectively, the display cable connector, the bottom of the PCB cable connector, data interface cable connector. Less button cable connector. Turn off the three connectorsThen continue to remove the screws above, then remove the main camera connector coverThen disconnect the right side of the motherboard coaxial can remove the motherboard. Remove the motherboard, you can see below the roll cage structure, the handset placed vertically, as far as possible for other sensors to leave the top of the valuable space. Let's take a closer look at the motherboard, the vast majority of chips are protected by a metal shield, the shield also affixed to the graphite thermal paste, a foam seal around the connector to prevent even if the machine into the water, nor the connector Short circuit burn out. The back of the motherboard space utilization is also very abundant, basically occupied by the sim card holder and shield. Chip placed in the shield, so we have to unload the other components of the body and then look back, then the bottom of the fuselage to remove the screws. After removing the bottom screw, use the warp lifted the bottom of the data interface, the bottom will find a screw. After removing the screw, the bottom element can be separated one by one. First remove the left connector cover, which protects the four connectors and the vibrator. Remove the speaker module was significantly smaller than the previous generationIt comes from AAC, R series of old friends, and it's sound quality is very good, the sound is very transparentThe white, grainy stuff beneath the back yellow film is AAC's black technology on the speakers, as similar designs have not been seen on other brands of speakers, presumably to increase the sound penetration. Disconnect the secondary board PCB and found that this generation of vibration module is no longer a low-cost way of welding, but through the contact with the secondary board connection. Separated from the board, we can see that it is also very compact design, space utilization is in place. The secondary board is also designed around the connector foam seal, (the leftmost connector foam stuck to the other end) Vice board backVibrator fixed by strong double-sided adhesive designed for its groove, from the thinner point of view, the use of rotor vibrator. Thickness of 2.28mm, linear vibrator can not be so thin. The remaining battery is not removed now.The green handle on the right side of the battery is OPPO designed to facilitate the removal of the battery. Lift the handle, a little harder will be able to separate the battery, or even cause no deformation of the battery, OPPO intends to control the viscosity of the back double-sided adhesive is easy to disassemble, but also to achieve sufficient fixed strength specifications, this design Larger than the use of plastic pull more scientific than those who simply use a strong double-sided adhesive fixed more responsible models. The battery uses a rated capacity of 3120mAh, a typical capacity of 3205mAh lithium battery. Supplier is still an old friend of the R series, ATL. Capacity 12.13Wh, charging voltage 3.85V, support 5V4A VOOC flash chargeBattery thickness 3.81mmFinally forgot to separate the handset. The handset is still from the AAC, the appearance and the previous generations of the same as the installation direction has become vertical, so I am not on the map. The final dismantling of the machine the number of screws 21. However, our dismantling is not over yet. Because the motherboard has not moved, then next the camera first removed from the motherboard. R11s rear dual camera is one of the best selling point of the machine, its hardware upgrade mainly lies in both the primary and secondary cameras, the lens aperture has reached F1.7, and 1600W pixels plus 2000W pixels is also a powerful combination, so that the aircraft Whether it is day or night, can play an excellent standard. Camera back close-up. Open the surface of the graphite heat paste. Found below there is a layer of metal heat pasteOpened her and can not immediately see all the chips, because the top of the core chip is covered with a layer of thermal silica gel, if it is grease better. Open the thermal silica gel will be able to see the following chip, the figure for the Qualcomm Snapdragon 660 mobile platform PM660 power management chip design. Front overall close-up, you can see, compared to the previous generation to cancel a layer of shield. R11s motherboard back also need to open the metal heatsinkOpen the cooling grease after seeing the two protagonists, one is Xiaolong 660 mobile platform, clocked at 2.2GHz, OPPO joint Qualcomm for a variety of games specifically for this processor has been optimized, so the performance is not a problem, in addition to Samsung's 4GB LPDDR4X memory chip presumably 64GB flash memory chip stack package below. Motherboard back features, there is still no second layer shield. To the contrast time, the left is the front camera R11s, the right is R11, no change in the mirror group are 5P lens, if the sensor is not changed, then it should be to improve the packaging process to make the volume smaller. R11s motherboard front (left) contrast R11 motherboard, you can obviously feel the larger size and found that the recent launch of the full screen mobile phone motherboards than the previous generation of non-full screen models larger, and can not find the increase The reason, but the machine is stronger than other full screen is that the battery not only did not shrink, but increased. Good job, OPPO! Sure enough, the family is very understanding of the needs of users of the company. Two motherboard back contrastTwo motherboards to remove the shield comparison, left: R11, right: R11sLeft R11, Right R11sIn order to compare R11s, I again demolished the R11. R11 battery thickness 3.62mm, thinner than the R11s 0.19mm, although less than the thickness of the machine 0.33mm, but also can be described as R11s thickening of the biggest culprit . Two battery connector exactly the same, suddenly there is a wicked idea ........R11 battery weight 42.0gR11s battery thickness 45.4g, it really is more expectedCompare the top design and see how the OPPO squeezes two rows of objects in a row (with a positive, symmetrical look). Two generations of the camera contrast left R11s, right R11R11s dual photo thickness of 5.34mmR11 dual camera thickness of 5.39mm, the thickness of the two almost no difference, so R11s thickness can be exempt from its responsibility. The left R11 speaker contrast R11s right speaker, the magic is almost no difference between the two sound quality, in theory, the left bass will be better. Back features, both AAC availabilityThe speaker surface on the R11 does not have the red 'poncho' on R11s At this point, is the OPPO R11s all the dismantling content.Through this dismantling, we found that this generation of models thicker, but the thick of the very "weight", not only in the case of almost no change in size brought Larger AMOLED full screen, better camera effects, a larger battery and more practical camera system, it can be said OPPO product manager is very user-friendly.
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