The development of manufacturing industry entered the fast lane, and the industry revenue grew rapidly.
The strength of China's IC industry has rapidly risen and the manufacturing industry maintained its rapid growth. Under the dual-wheel drive of the market and policies, according to the statistics of the China Semiconductor Industry Association, in 2016, China's IC industry reached 433.55 billion yuan in sales, an increase of 20.1% over the same period of last year. Industrial structure tended to be balanced with sales of design, manufacturing and packaging and testing of 164.43 billion yuan, 112.69 billion yuan and 156.43 billion yuan respectively, and manufacturing sales continued to rise with a growth rate of 25.1%, the highest among all links in the industry chain.
SMEs continued to increase their sales, leading companies to achieve sustained profitability. SMIC's advanced process shipments increased steadily, Huahong Grace, China Resources Microelectronics and other 8-inch production line at full capacity. SMIC in 2016 in the global pure wafer Foundry ranked No. 4 in revenue, with sales of 2.92 billion US dollars, up 30.3%. Huahong Grace maintained a 24 consecutive quarterly profit, sales hit a record high ($ 712 million), net profit reached 129 million U.S. dollars, up 14.5%, ranking eighth in the world.
(B) Manufacturing technology continues to improve, capacity continued to expand.
Wafer manufacturing technology technology continues to improve. SMIC launched the 28nm process has a number of domestic and foreign enterprises for a stable OEM. 16nm process research and development steadily, 65nm and below the process of sales accounted for 44.6% of total sales. Force microelectronics developed 55nm image sensor technology, is currently the most advanced image sensor technology platform. Benefit from the smart phone camera market demand, Hua Li Microelectronics image processor chip shipments continued steady growth. Has a comprehensive embedded nonvolatile memory technology platform portfolio, covering Flash, EEPROM, MTP, OTP and other technologies, in the CMOS-MEMS sensor manufacturing, the successful realization of the MEMS devices and standard CMOS technology and production line full compatibility.
(C) Manufacturing capacity increased year by year, the proportion of production capacity is becoming more reasonable.
According to IC Insights, domestic wafer monthly production capacity was 1.489 million pieces (8-inch conversion) in 2016, accounting for 10.8% of the global total capacity. According to the changes in production capacity After 2000, the tide of manufacturing capacity in our country has undergone two tides, each one lasting 5 to 7 years, the first from 2002 to 2007 and the second from 2014 onwards, and is expected to continue until 2021 After 2014, China's newly increased production capacity accounted for more than 30% of the global new capacity, which has become a new impetus to the growth of global wafer capacity.
Manufacturing industry to speed up the transformation and upgrading, production and distribution increasingly reasonable.From China's wafer production capacity distribution, 12-inch wafer production capacity in recent years to accelerate the rise in 2016 to reach 1.017 million / month (converted 8 inches, the same below), production accounted for (10% CAGR of 6.2%), reaching 625,000 units / month. 6-inch and below the wafer production capacity of 107,000 / month, the production capacity of 6-inch wafer production capacity of more than 200mm and 150mm and below. And relatively slow growth (CAGR was 0.7% in 10 years) (data from IC insight).
The formation of the country more than the formation of the factory boom, the number of new factories continue to increase the country and the local attaches great importance to the development of integrated circuits in the "national integrated circuit industry development to promote the outline" and other related policies, and the promotion of various funds , According to the International Semiconductor Equipment and Materials Industry Association (SEMI) statistics, the world in 2017 to 2020 will be put into operation of the semiconductor fab 62, of which 26 are located in the Chinese mainland, accounting for Up to 42%, most of which is foundry.
According to Gartner statistics, in 2021 China will have 19 12-inch fabs, the total capacity will reach 2.07 million / month (not converted 8 inches, the same below), domestic crystal The production capacity of the fab will reach 1.155 million / month, accounting for 57.7%, of which the monthly capacity of the memory can reach 1.995 million, the logical foundry reached 775,000.If all the projects on schedule, "Made in China 2025" set The 2020 manufacturing capacity of 700,000, 2025 up to 1 million 12-inch wafer production capacity of the target can be completed.
Supply and demand is the industry is facing the core issues
China's integrated circuit manufacturing industry is still facing many problems, restricting the overall development of the integrated circuit industry.Enterprise chain, capital and talent supply and demand contradiction is the most important contradiction.
The problem of "designing and manufacturing two ends" is still going on.China's manufacturing industry is developing rapidly, but mainly for overseas customers. The chip design industry is growing rapidly but mainly relies on overseas manufacturing resources. SMIC's sales from Chinese customers in 2016 are insufficient Half of revenue.In this context, the domestic foundries to expand production capacity may not be able to directly raise the self-sufficiency rate of domestic chips, but some projects will face tremendous risks.
The global shortage of silicon wafer has become the bottleneck of manufacturing capacity.Currently, China's semiconductor equipment and materials accounted for less than 1% of the global market, which seriously constrains the self-sufficiency and healthy development of the domestic chip industry.WSTS estimates that in the next few years, the semiconductor market Will show a warming trend, the mainstream of the 300mm silicon demand surge will lead to the world's six major 300mm silicon wafer manufacturers facing full capacity, the world's silicon wafer in short supply, some small-scale wafer factory fear can not get enough Wafer was forced to cut production.
Manufacturing technology is relatively backward, the technology gap still exists.For wafer foundry, China's most advanced technology and the international mainstream technology difference of nearly three generations.Microchip International is still stuck in the 28-nanometer PoliSiON process.For memory manufacturing, Wuhan Xinxin only achieve 32-layer 3D NAND flash chips have been put into trial production. However, this year's fourth-generation 64-layer 3D NAND chips will put tremendous pressure on the industry competitors such as Micron, Toshiba and Wuhan Xinxin.
The overall capital expenditure of ICs in China is still low, and the total capital expenditures of ICs in China are still low in 2016. The total capital expenditures of ICs in China in 2016 were 63.62 billion U.S. dollars, accounting for only 9% of the global total, not reaching the level of Intel, TSMC, Samsung and other chip giant business investment .Second, capital bias infrastructure construction, technology research and development still need continuous investment.Although the fund investment enthusiasm around, but some funds and capital are more concerned about the land, plant, equipment and other fixed asset investment, the new R & D is still a large number of funding gaps.
According to Ministry of Industry and Information Technology Software and Integrated Circuit Promotion Center data show that China's IC industry needs 700,000 people, and currently employed less than 300,000 people, facing a large number of Talent shortage. Talent shortage is mainly reflected in two aspects: on the one hand is the leading technology research and development of 'generals' scarcity of technical bottlenecks in the short term is difficult to quickly break the other hand, the number of experienced operators and equipment maintenance personnel there is a bigger gap, Directly affect the normal operation of the production line or product yield.
Upgrade development without delay
Strengthen the technology independent research and development, to achieve the core technological breakthrough.One is to strengthen the logic of OEM technology research and development, as soon as possible to break through the 1X nano process node.Two as soon as possible through the multi-layer 3D memory chip manufacturing process, to 64 layers of mainstream technology closer. Technology, around the Moore's Law to increase the intensity of technical layout.
Construction of ecological investment oriented industrial development ideas.One is complying with artificial intelligence, Internet of Things and other emerging applications, from the national strategic level as a whole to promote the application of key areas of investment, layout, including chip, software, machine, information services in The second is to simultaneously support the key chip products and the whole system during the implementation of the major work such as "Made in China 2025", artificial intelligence, intelligent hardware and so on.
Promote the deepening cooperation between the upstream and downstream industries.First, the chip design companies to promote system-level solutions for the needs of self-research, mergers and acquisitions, cooperation and other ways to make up the shortcomings of technology to build the overall technical capacity .Two is to promote the design and manufacturing enterprises , IC packaging and testing companies to speed up advanced manufacturing technology and advanced packaging technology research and development breakthroughs and commercial scale, get rid of 'two heads out' troubled.
Author: Institute of Information and Communications of China Institute of Information Integration and Industrialization Li Ce