2016 global MEMS packaging market size of 2.56 billion US dollars, is expected to 2062 will increase to 6.46 billion US dollars, 2016 to 2022 compound annual growth rate as high as 16.7%. With the advent of the 5G era, for 4G and 5G (RF) MEMS (bulk acoustic wave filter BAW) packaging market is the largest contributor to the growth of the MEMS packaging market, the compound annual growth rate of up to 35.1%. Optical MEMS packaging market (including micro Mirror and Microbolometer) is driven by consumer, automotive and safety applications, with a compound annual growth rate of 28.5% at the second place in the MEMS packaging market growth contributors. Acoustics MEMS (with MEMS microphones) and ultrasound The MEMS packaging market is the third largest contributor to growth, and smartphones, cars, smart homes, and smart homes require multiple MEMS microphones to provide continuous sound monitoring, resulting in a gradual increase in the number of MEMS microphones in advanced applications The demand is particularly strong.
MEMS packaging market growth is more than the MEMS device market: 2016 to 2022, MEMS packaging market compound annual growth rate of 16.7%, while the MEMS device is 14.1%. The primary reason is that outsourcing semiconductor packaging test (OSAT) is facing Intense competition, the profits of the package has been reduced to a very low, and then further reduce the cost is difficult to do; the second reason comes from the importance of testing, each MEMS device testing requirements are different, the test method needs to be customized according to MEMS devices, The third reason is that the cost of materials from the package (such as gold and copper), with the global material prices will increase the cost; the fourth reason is from the strong growth of some MEMS devices to RF MEMS for the representative.
IDM and OSAT, who can share the largest 'cake'?
Whether it is IDMs or OSATs will be involved in the packaging of MEMS devices.NASTs now have 55% of the market share of the MEMS packaging market, and the remaining 45% share is occupied by IDMs. Specific precision analysis is based on the MEMS device type. In general, IDMs Test programs in their own plants are customized and confidential according to the characteristics of MEMS devices, and OSATs can not develop the same test solution for different customers.
RF Electronics market leader Broadcom has its own packaging plant. Fabless and fab-light oscillators and antenna tuners are all shipped in OSATs and have a BAW filter. Microfilm is a complex sensor, so packaging and testing are generally done at the internal plant of the MEMS manufacturer, and their own test program is developed by IDMs (eg ULIS, FLIR). Optical MEMS is usually designed with optical windows , The package is special, the test is also very complex, and therefore by IDMs (such as Texas Instruments) to complete their own packaging and testing.In fact, a small number of supplier cases is not enough to prove the choice of OSATs suppliers.
MEMS packaging is cost-driven for large shipments (such as consumer electronics and automotive electronics). Inertial MEMS supply chains are fairly fragmented: some IDMs are internally tested and calibrated, but outsource packaging and assembly operations; and IDMs OSATs are primarily involved in the packaging, assembly and testing of gas sensors, pressure sensors and multifunctional sensors, and for acoustic MEMS, many microphone manufacturers outsource packaging and testing to OSATs for environmental MEMS.
In the field of MEMS packaging, ASE and Amkor occupy the top two in the market with 27% and 23% of the market, respectively, followed by long / Star, and other small companies 10% of the 'cake' on the market.
MEMS packaging industry is steadily developing
A number of new methods, such as silicon through-holes (TSV), open-cavity packages exposed to external environments (suitable for tire pressure monitoring systems TPMS, humidity sensors, temperature sensors and gas sensors) have been developed on the road to MEMS packaging technology innovation. Long-term considerations, fan-out technology can also be used for some inertial sensors and pressure sensors.
MEMS packaging technology platform is steadily developing, with the demand for sensor integration increases, the complexity of the existing platform will also change.There are several inertial sensors or several environmental sensors packaged together has become a reality, the next step is The inertial and environmental sensors are packaged together, and similar situations have been found in the integration of light-emitting diodes and photodiodes, so the MEMS packaging roadmap will shift from single-chip packaging to multi-chip integrated packaging.
For automotive electronics applications, packaging and assembly is even more important, but also for the OSATs provide an opportunity for automotive electronics testing using special equipment, so automated test equipment suppliers have a good opportunity.Test equipment suppliers are To reduce the cost of packaging and testing by increasing the number of test devices per unit time by adding a parallel test method, adding new features (such as wafer level testing to filter out good or bad chips).