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1, MOS chip out of stock in 2019 is expected to ease the application side to enhance the 8-inch production line into the main force;
In the third quarter, driven by the LTCC as the representative of the passive components by the tight supply and demand, prices rose, some material gains even more than 10 times, and passive components market similar to the MOSFET chip There is also a shortage of goods tide, leading to price increases, even in the premium 20% on the basis of new orders, suppliers are still difficult to pay the ship.More serious is that the MOSFET chip market shortage of goods in the short term will be difficult to ease, conservative It is estimated that the situation will change in 2019.
According to IHS data, the total size of the MOSFET market in 2016 is $ 20.5 billion and is expected to grow to $ 22 billion in 2017. MOSFETs are widely used in consumer electronics, electric vehicles and IIoT, Chen Xiangdong in an interview with micro-network interview, said the reasons for the lack of MOSFET chip is mainly due to the application side of the market up, but the production capacity has not kept up with the current shortage is mainly affected by the application of intelligent terminals, low-voltage MOSFET chip Goods more serious.
Application level to enhance the chip chip to speed up the wave
After entering the third quarter, the mobile terminal market began to accelerate heavy volume, especially in the iPhone8 series driven, including the new wireless charging is becoming the domestic mobile phone and accessories manufacturers to introduce new applications, coupled with rapid application level and factory capacity constraints, Upstream MOS factory brings no small supply pressure.
Which in Shenzhen in September for two consecutive prices of MOS products in early September, Shenzhen, long power technology, said Jiangsu Power Technology Co., Ltd. received a notice, due to the MOS tube raw material prices, the existing price can not The series includes: 2N700 series, 2SK series, BSS series, CJ23 series, CJ31 series, CJ34 series, CJ41 series, CJK series, CJE series, CJM series, CJQ series.
September 19, Shenzhen Chang Technology once again issued a notice, the current market MOS chip in short supply, chip suppliers have repeatedly price increases, while raw materials and labor costs are also significantly larger, the company decided to study the appropriate increase in the price of finished products , The specific price adjustment range of 10% -30% range, from now on the implementation.
Shenzhen long power technology as a representative of the mainland MOSFET manufacturers, after several price hikes, quickly triggered a butterfly effect, including the mainland and Taiwan Dazhong, Nixon, Fu Ding and other Taiwan-based MOSFET suppliers are also fully follow the price increases, Thus benefiting directly.
In fact, since last year, the power device market prices pick up, demand continued strong.There are rumors that the market demand, limited by capacity, the original delivery cycle are stretched to 13 to 18 weeks.
Weir, deputy general manager Ji Gang said in an interview, due to the tight supply chain, in fact, MOS chip is now not talk about the concept of delivery (delivery refers to the large customer orders, are generally planned year) , What is basically what the substrate to do what products, that is, some short-term behavior, there is no long-term plan.
Overall, the MOS chip appears out of stock tide, mainly because the application level of rapid improvement.Chen Xiangdong said, MOSFET chip out of the main reason is due to the application side market, such as mobile fast charge, wireless charging chip, and lithium battery management Chips, etc., basically that the application of the surface to enhance, increasing the stock market, the current shortage is mainly affected by the application of intelligent terminals, low-voltage MOSFET chip out of stock is more serious.
8-inch production line is the main heavy volume, the year is expected to ease
The face of MOS chip shortage tide, expansion is naturally the most effective and most direct solution.Chen Xiangdong said that the upstream manufacturers are expanding production, but now the MOS chip is mainly produced by the 8-inch production line, and now 8-inch production Line of second-hand equipment and can not buy, buy new equipment and do not make money, which will cause some time will be out of stock. MOS chip for the electronic product consumption experience is very important, for example, once the power IC problems lead to failure of the entire product Manufacturers will bring a lot of negative impact, so the whole manufacturers of power devices have a high stability requirements, generally in the product development stage to determine the supplier, while the MOS chip development cycle is longer, R & D production equipment investment amount According to third - party data, a 6 - inch production line needs to invest 500 million yuan, an 8 - inch production line needs to invest about 500 million US dollars, a 12 - inch production line needs to invest about 2.5 billion US dollars.
Chen Xiangdong said that the current 12-inch production line to do the power device is still very small, and now only Infineon 12-inch production line is useful, the market to do low-voltage power devices or 8-inch production line, 4-inch and 6-inch production line also.
'12-inch production line did not rise, this wave of short-selling tide will not soon disappear.' Weir shares Deputy General Manager Jia Yuan said in an interview, because many international manufacturers are adjusting the production line, coupled with domestic simulation of production capacity by Limit, at least to see 2019 is expected to ease the MOS chip shortage of goods tide.
It is worth emphasizing that many international manufacturers are currently adjusting the production line, the MOSFET chip production capacity will be transferred to the field of automotive electronics, and began to take limited supply of MOSFET chips to PC, NB and mobile device products customers, but also This wave of out-of-stock tide triggers and sustained incentives.
The gap is big but the inflection point has arrived
To promote production capacity will take time, and continued demand will be conducive to the development of the domestic MOS chip.Although the domestic 12-inch production line did not rise, but does not rule out the domestic manufacturers such as Silan Micro and other plans to increase the future 12-inch production line to meet market demand The
'In the global 8/12-inch capacity is not improved under the current situation, the mainland factory will certainly benefit from the shortage of goods.' In the mainstream 8-inch analog production line, the mainland manufacturers at least 8, including advanced, new Into, Hua Hong Grace, on China, Silan Micro, China Aviation, SMIC, and ship manufacturers are gradually began to heavy volume.
Ji Gang said that the 8-inch analog production line generally have two models, one is the factory Transfer process to the domestic factory foundry, but can not provide to other customers; the other is Foundry process, so customers can use, this Block in general and the domestic process capacity and level gap is relatively large, so essentially 8-inch factory analog digital technology will exist.
Ji Gang further said that the technical differences are mainly reflected in the device base, process modules, integration capabilities, simulation models, process reliability, process application segmentation, etc., the technical difference of at least 5 years.
However, the current international manufacturers are adjusting the production line, and even weakened the support of the mobile terminal market, MOS chip production capacity will be transferred to a large number of automotive electronics; the same time, for small and medium-sized MOS products company, several major global companies Basic to meet the requirements of strategic customers, other small and medium customers are not available, which to the domestic MOS chip manufacturers to bring the opportunity to overtake the corner.
In addition, with the artificial intelligence, the development of cloud computing will further promote the field of consumer electronics power device market growth, and now in Intel, AMD's new CPU platform to increase 3 to 5 MOSFET chip, market demand growth significantly.
Jia Yuan said, Weir shares MOS chip accounts for about 15% of our self-research system sales, concentrated in the low pressure 40V below, used in mobile terminal products, are signal switch switch, is expected this year, Weir shares MOS chip camp Received in the 1500-2000 million US dollars now the shares of the MOS chip has been made into the Swiss core micro-and all-technology and other end products.
It is understood that Silan 8-inch chip production line has been part of the product into mass production, chip output in September has reached 10,000, many of Shenzhen's fast charge, wireless charging enterprises and other Shilan micro-volume shipments. We will have a lot of 8-inch engineering samples to send samples, we 8-inch chip production line at the end of this year to reach 15,000 / month, the target end of next year To achieve the monthly 30,000 - 4 million of the production capacity.With the advanced, new, Hua Hong Grace, on the China, Silan Micro, Founder, China Aviation, SMIC and other 8-inch production line gradually heavy volume and application level to enhance the mainland The factory will continue to benefit from this wave of outbound tide.
2, Samsung CEO focused CEO successor;
Samsung Electronics is scheduled to release its third quarter (July to September) earnings, and the company is expected to profit a new high, but investors are more concerned about the Samsung CEO Wu Hyun after the successor, and the next will start High level blood transfusion plan.
Samsung is expected to earn 14.5 trillion won ($ 12.9 billion) in the third quarter, surpassing the 14.1 trillion mark in the second quarter, also echoing the glorious earnings from Amazon, Microsoft and Google parent Alphabet in the past week.
Samsung Galaxy Note 7 last year after the incident and bear the cost of $ 6.5 billion recall, this year has finally come to see the clouds, especially the memory chip and panel two career is more heyday, to promote Samsung shares rose 45% since the beginning.
In recent months, the outside world has long been expected to earn a new high in the third quarter of Samsung, but the right of five Hyun on October 13 announced the outgoing news shocked the industry, but also to investors worried about the issue of Samsung's rudder, Will delay the company's progress in developing new markets.
Duan Hyuk-hyun has announced that he will resign as vice president and chief executive officer before March next year and will not be a director at the board, saying that Samsung is facing an unprecedented crisis and advises the company that it will introduce the younger generation's leadership To meet the new challenges of the technology industry.
As Samsung vice president Li Zaorong suspected of bribery case is still in the High Court appeal, so Samsung since August has been caught in the dilemma of rudderless.
Samsung in recent years, both in artificial intelligence, intelligent home devices and automatic driving technology and other new areas of research and development progress are behind the Western industry, and now Li Zaorong, right Wu Hyun both absent, the new executive president will be related to the future of Samsung.
Tuesday, in addition to the executive successor, but also includes Samsung scheduled for implementation from next year's three-year shareholder feedback program, including stock repurchase and dividends and other measures.
Macquarie Securities analyst Daniel Kim said that in recent years, Samsung's share price share in the share price has always been hovering at 1%, lower than other Asian electronics manufacturers 2% to 3%, mainly due to Samsung's cross-share structure increase company dividends Cost of taxation. Business Times
3, Intel Q3 net profit by 3 percent increase in financial;
Intel announced third quarter (July to September) revenue, profit better than expected, and the server chip revenue continued to grow, so that the outside world on Intel's road to change the confidence of the company on Thursday and therefore increase the year camp Income, profit expectations.
Intel had expected revenue of $ 61.3 billion in the year, with adjusted earnings per share (EPS) of $ 3.00, up from $ 62 billion on Thursday, with adjusted earnings per share Up to $ 3.25.
"The sound performance and optimism of Intel's third quarter are positive for the market," said Daniel Ives, director of research firm GBH Insights.
Intel's third-quarter revenue rose 2% to $ 16.1 billion, up from Reuters survey analysts expected $ 15.43 billion in the third quarter net profit rose 34% over last year to $ 4.52 billion, equivalent to $ 0.94 per share Intel's third quarter earnings per share of $ 1.01, also higher than analysts expected 0.80 US dollars.
Intel's core business PC chip revenue in the third quarter reached $ 8.9 billion, maintained at the same period last year level in recent years, the positive development of server chip revenue increased by 7% to 4.9 billion US dollars, better than the actual survey analyst Analyst expectations of $ 4.79 billion , Also means that the department's revenue is expected to reach Intel's 5% to 9% annual growth rate.
"Intel is experiencing a large-scale transformation aimed at extending the core business strength to expand to new markets with faster growth." While Intel's current revenue is still more than half, Intel's chief financial officer, Robert Swan, said on Thursday, From the PC chip, but Shiwang expected server chip revenue will continue to expand the proportion.
In the face of peer competition and core business growth stagnation, Intel can only continue to invest in upgrading the chip process, and cross the artificial intelligence, automatic driving and other new markets.
Intel's $ 15.3 billion acquisition of Israeli automaton developer Mobileye's deal was completed in the third quarter, with Intel predicting a new artificial intelligence chip by the end of the year.
4, NXP: from the center to the edge of the change and how to benefit from the enterprise;
Author: NXP Semiconductor executive vice president and general manager, secure connection with the Division Ruediger Stroh
Based on discussions with technical leaders such as Qualcomm and Andreesen Horowitz, I have found that there is growing evidence that new changes are taking place and that the impact will be no less than what we know about computing The cloud is the main framework for data processing, but what happens when cloud computing comes to an end? You might think that cloud computing has not yet reached full potential, and to a certain extent, it is true. However, I believe that the accelerated development of the Internet of Things will actually lead to cloud return to the storage of data for reference functions, rather than the same as the current continued to deal with data.
At present, network applications rely heavily on cloud services, whether it's a Google search or a weather application, we need to enter a request in the mobile device and send it to the cloud for processing and return to our device. Processing is the current mode of operation.However, thanks to the emergence of Internet of things, nodes and sensors for the first time in the environment to collect a large number of real-world information can be understood as the wing of the wing has a data center, manufacturing robot Is the data center with arm.
With this huge edge capacity to limit: based on the nature of Internet of Things technology, through the cloud to transmit large amounts of data into a more challenging task.Imagine that today's car about 100 CPU. For unmanned vehicles , This figure will rise to 300 to 400, or even more.If we build a more intelligent transportation system, will be tens of thousands of vehicles and communications centers need to communicate with the car into them, then we will eventually encounter Huge distributed computing problems. Even with 5G through the information transmission to the cloud, processing and return, we will soon fall into the real-time decision-making can not support the situation because the use of the cloud will be delayed, the real-time decision It is too slow to say.
In the near future, the edge of the data, the central model of data processing will be unsustainable. Computing will quickly turn to the edge.In fact, IDC currently predicts that by 2021, 43% of the Internet of Things will occur on the edge.
So what does this mean for your business? Terminal equipment may reach billions of units, around the week is a new application and business model.From the center to the edge of the change, for those in the early to deepen the enterprise Which will be a huge opportunity, for example, how will such a change be made to change the way insurers in autopilot cars? Immediate marginal analysis of how to benefit retailers in micro target targeting? As the calculations shift from the center to The number of new revenue opportunities and business models will grow exponentially.
As trust has always been a limiting factor in cloud service acceptance, the ability to provide security solutions to protect the edge of the Internet of Things system will be a limiting factor in the speed of this new change, for example, smart home appliances are hotspot for private information To determine whether the house is no one; the use of the block chain will contain sensitive financial information; there are automatic driving the car, if invaded, will have a real threat to the community.Therefore, the edge itself is becoming the overall system security of the first line of defense The
The cloud will become the teaching and training center for the Internet of Things, where the edge device can develop its pattern recognition skills and perform advanced machine learning. The cloud will continue to exist and provide a basis for operations that do not require timely action. In the sense that the cloud will survive in another form.
The imminent change and the huge opportunity brought about by the edge of the calculation indicates that a new era of technology is coming. Think of the world as a distributed computing system. To guide this change, we must be prepared to provide Dedicated processing. Since future operations will occur here:
• In many cases, dedicated processing can reduce response time and network congestion. Autopilot will rely on real-time processing to make the right decisions instantaneously • Dedicated processing protects users from privacy because the raw data is not uploaded to the cloud. • It also eliminates the need for a low-efficiency and unresponsive centralized cloud data center to handle significant increases in data collection • Dedicated processing will be more reliable at the device level.
We must also work harder to make distributed computing safer and more trusted. Combined hardware and software security tools for protecting edge data privacy and security are readily available and must now be designed, followed by the principles of security and privacy, Level, so that companies that provide Internet of Things can send trust signals to billions of users to help them enjoy the benefits of edge computing.
The change will take place again.
5, South Asia Branch 20 nm expansion cast film;
DRAM manufacturers in the South Asia Section (2408) 20-nanometer process of angry, and then ahead of the quarter to expand the film, next year will be the total response to 20 nanometer to bring the cost reduction, production increased business benefits. 12 yuan, far better than the original estimate of 9 to 10 yuan; Macquarie optimistic about the prospect of DRAM next year, and the supply is still in the gap, in one fell swoop the target price to 111 yuan, which is the first time foreign investors raised its evaluation to 100 Above the price.
South Asia's 20 nanometer ahead of the quarter in the fourth quarter to reach the monthly volume of 38,000, and the expected fourth quarter DRAM bit increase of about 15%, an increase of 45% next year.
South Asia Branch is currently the only factory in the process will be transferred to 20 nm, Samsung, Micron and SK Hynix is still upgrading the process, as the main strategy to enhance capacity, so that the DRAM has been in short supply in recent years.
DRAM supply and demand for next year, including the state and many other research institutions estimated supply and demand imbalance will remain next year, in particular, Samsung hopes to support the DRAM as a group to support 3D storage type flash memory (NAND Flash) backing, estimated next year's DRAM Prices will continue to maintain high-end does not fall, which is Taiwan factory South Asia Branch excellent profit opportunities.
Although the South Asia Branch recently announced the third quarter earnings per share of 3.12 yuan, slightly lower than market expectations, but legal person stressed that the South Asian sub-season is mainly recognized convertible bonds (ECB) assessment of the loss of up to 6.863 billion yuan, excluding this Factors and the sale of Micron shares to inject the interests of South Asia Branch single quarter earnings per share is still more than 3 yuan, which is only 20 nanometers just enter the gold cross, if all the benefits, the industry profit more impressive.
Legal person stressed that the DRAM price has broken the past the economy to follow the model, the key to the main supply capacity of effective control, estimated short-term will not break the supply increase than demand tacit understanding.
South Asia Branch estimates that next year, DRAM supply growth is still lower than the demand increase, the gap is still estimated to reach 1 to 2%, next year, DRAM prices are still stable support.
Legal estimates, South Asia Branch this year, gross margin can be raised to 44%, next year and then move to 50% to 50% next year, do not rely on the sale of Micron shares, the industry profit can be as high as 11 to 12 yuan, profit back to the peak. Economic Daily
6, soft electronic prospects can be emerging materials from the pack and play;
Modern electronic products are based on silicon wafer technology (Silicon Wafer) as the core technology, and optoelectronic products is built on the glass as the core technology, the two materials of physical and chemical stability is very high, the melting point of silicon The temperature of the Strain Point of the alkali-free glass can be as high as 650 ° C or higher. The high melting point and the high strain point can have enough space to accommodate different reaction temperatures. The silicon thermal expansion coefficient is 2.6 × 10-6 / The coefficient of thermal expansion of the two materials is about 3 × 10-6 / ° C.
Resistance to high temperature and low thermal expansion coefficient of two physical properties plus silicon can be doping (Doping) to change the electrical (semiconductor properties), the glass has high light penetration, high water and oxygen barrier properties, these characteristics of silicon and glass Materials are in the field of electronics and optoelectronics occupy an irreplaceable position, however, silicon wafers and glass are brittle materials, in the soft demand for soft electronic challenges.Following from the soft electronic point of view, Development and Challenges of Soft Substrate and Functional Materials.
Soft Base Material Water / Oxygen Isolation and Temperature Resistance
The silicon wafer and the glass have been established a very complete process, so to consider the established process transferred to the soft substrate, first of all from the physical characteristics of the substrate to view its feasibility.
From a flexible point of view, metal foil (such as stainless steel foil), ultra-thin glass and polymer plastic materials have a certain flexibility, but if the silicon wafer melting point and the glass strain point as the reference temperature , View the flexible stainless steel foil, ultra-thin glass and plastic materials, the operating temperature range shown in Figure 1.
From the process temperature range, stainless steel can withstand a wide temperature range, many can be applied in the silicon wafer process has the opportunity to apply to the stainless steel foil, Uni Solar is the use of stainless steel foil made of soft silicon thin film solar cells, nano Solar Made of aluminum foil CIGS foil solar cells, but the metal foil is a conductive material, in the more complex design of flexible electronic components need to be insulated and other design.
Ultra-thin alkali-free glass and the characteristics of the current process of mature plate near the alkali-free glass, and now applied to the plate E-glass process almost can be transferred to the ultra-thin soft glass, in recent years, including Corning, NEG, Schott and other glass However, the ultra-thin alkali-free glass, although there is a certain degree of softness, but can withstand the limited degree of bending to Corning Willow glass, for example, 100μm thickness of ultra-thin glass in the bending radius of 4mm , The glass bear the bending stress (Bending Stress) reached nearly 100Mpa, therefore, ultra-thin glass in the need for flexible flexible electronic components on the application of space is relatively small.
Polymeric plastic materials have always been high expectations of soft electronic materials, however, the plastic film temperature is not as good as glass, improve the temperature resistance of plastic substrates and reduce the coefficient of thermal expansion, is the application of plastic substrates to the development of flexible electronic processes The macromolecule material can be used to improve the temperature characteristics through molecular design and the addition of nanomaterials.With the glass transition temperature (Tg) of polymer materials as the index, the general process temperature should not exceed Tg , The higher Tg can have a relatively large process temperature space, different polymer materials have different Tg, as shown in Figure 2.
Polyimide (Polyimide) Tg through the polymer design, adding nano-inorganic materials for the adjustment of the characteristics of the current Tg to 430 ℃, which is the current thin film transistor (Thin Film Transistor, TFT) process temperature is not far, At present, the Samsung arc of the Glasxy round using the PI substrate, indicating that the PI substrate has been able to withstand more than low-temperature polysilicon (Low Temperature Polysilicon, LTPS) process high temperature. Polyimide material with high temperature, low temperature, good resistance and good The advantages of electrical characteristics are the most promising materials for soft electrons. However, in addition to the high temperature characteristics of soft substrate selection, the light transmittance, surface roughness and material cost of soft substrates are For example, polyethylene glycol (Polyethylene Terephthalate, PET) Although the Tg of about 70 ~ 80 ℃, but PET low prices, good light penetration, is the best transparent conductive film material And Rh Consoles. Decisions.s.s.s.s. compositions.s.s.s.s.s.s.s.s.s.s.s.s.s.s.s.s.s.s.s.s.s.s.s.ithers.ithers.s.s.s.s.s.omenicithers.s.s.s.s.s.omens.ithers. Rhithers.ithers.s.s.ess.s.aints.s.s.s.aints.s.s.s.s.s.s.s.s.s.s.s.omens.s.s.s.s.s.s.s.s.s.s.s.s.s.omens.ithers. Rhithers. Rhithers.s.s.s.s.s.s.s.s.s.s.omens.ithers. Rhithers. Rhithers. and Rh's.s.s.s.s.s.s.s.s.s.s.omens.ithers. Rhithers. and Rh '
Figure 3 shows the demand for water vapor permeability (WVTR) for various electronic components, and for OLED soft display and soft lighting, there are different electronic components for water and oxygen. And Rhithers. Refunds wanted compositions. Refunds wanted wanted Rhithers. Refunds wanted Rhithers. Refunds wanted L. Rhithers. Refunds wanted Rhithers. Refunds wanted Rhithers. Refunds wanted L. Rhithers. Finds.ithers.vaint composition composition composition views Results calling currencies calling rounds.s.
Water in the general plastic substrate WVTR between about 10 to 102, so for the soft electronic components, the need to establish water and oxygen barrier layer. Water, oxygen barrier is generally based on the film process in the plastic substrate An inorganic thin film such as SiOx, SiNx, or an oxide of aluminum, and a single layer of a defective inorganic film such as Amorphous Al2O3 (Super Sapphire) can reach 5 × 10-5 g / m2 / (2), monolayer SiNx is also up to 5 × 10-5 g / m2 / day (3) at 20 ° C / 50% RH of PEN substrate, but 'no defect' is very difficult in film process , So the early Vitex is the development of organic / inorganic multi-pair barrier layer so that water oxygen through the defect infiltration when the diffusion path becomes longer (4), as shown in Figure 4
Organic / inorganic barrier layer to increase the water and oxygen diffusion path method can make the water vapor permeability at 60 ℃, 90% RH conditions up to 5 × 10-6g / m2 / day effect is the best water, oxygen barrier layer But the multi-layer represents the high cost of the process, so many teams currently improve the coating material and process parameters to reduce the coating defects to reduce the number of coating layers and increase the coating rate. Applied Materials developed a plating rate of 500nm / min Plasma Polymerized HMDSO (pp-HMDSO) was used as the organic layer, and PECVD SiNx with a plating rate of 250 nm / min was used as the inorganic layer to achieve the effect of increasing the plating rate The
On the other hand, the atomic density of the Atomic Layer Deposition (ALD) coating is high, and the single layer of Al2O3 has a WVTR of 4.7x10-5 (5). In recent years, the rapid development of OLED packaging, Veeco's flexible package That is, the use of FAST-ALD technology, it is reported that South Korea's Samsung and LG are interested in using Veeco's ALD technology, it is clear that multi-layer stack of water and oxygen barrier in production still have problems to be overcome.Overall, the current Flexible substrate water vapor barrier technology has reached 10-6g / m2 / day component requirements, now under the direction of efforts to improve the process rate and reduce manufacturing costs.
Emerging soft transparent conductive film
Soft transparent conductive film can be regarded as the substrate of soft optoelectronic products, because most of the optoelectronic products need both conductive and through the light of the substrate, so the soft transparent conductive film can be said that the soft power of the lifeline and strategic substances The current transparent conductive film is mainly indium tin oxide (ITO), however, ITO itself is a brittle ceramic oxide, so after the crack will produce cracks and failure, so the development of soft transparent conductive film Is based on the Touch Display Research report in 2015 that non-ITO transparent conductive film market will gradually rise, the trend shown in Figure 5 (6) is expected to replace ITO in 2018 Of the transparent conductive film market up to 4 billion US dollars in size; when by 2022, it will be more than ten billion US dollars, this huge market size mainly from soft touch, soft display, soft solar cells and other soft electronic Components in the next few years the trend of vigorous development.
The results show that there are several techniques for replacing ITO transparent conductive film, including transparent conductive polymer, carbon nanotube, graphene, metal mesh and nano-silver thin film.To explore the relationship between light transmittance and resistance of the above-mentioned five kinds of ITO transparent conductive films, It can be seen that when the resistance of the transparent conductive film is lower, the penetration of light decreases.
Figure 6 for a variety of non-ITO transparent conductive film at different resistivities, the light transmittance changes from Figure 6 can be learned that when the lower resistance, will lead to light penetration decreases, in the future many (Such as: large-size touch panel), the resistance value of 100Ω / □ below; light penetration requirements of more than 80%, in this specification, nano-silver transparent conductive film is the most potential Technology, nano-silver transparent conductive film low resistance, high light penetration characteristics, to meet the current ITO transparent conductive film difficult to open up the soft electronic market applications.
Although the nano-silver transparent conductive film is the most potential soft transparent conductive film, but the nano-silver film forming a high degree of difficulty, nano-silver wire coating needs to consider the characteristics of nano-silver ink to develop special coating equipment can only Production resistance uniformity, high light penetration, low resistance of the flexible transparent conductive film.
Soft functional materials are associated with the development of organic semiconductors
Modern electrons can be said to be built under the structure of the transistor. The basic material of the transistor is Dielectric Layer, Conductor Layer and Semiconductor Layer, inorganic dielectric materials such as SiO2, Al2O3, or other oxides are relatively brittle and unsuitable for use in soft electronic components. Fortunately, organic materials are generally more insulating, such as poly (4-vinylphenol) (PVP), poly (methyl methacrylate, PMMA), Polyethylene Terephthalate (PET), Polyimide (PI), Polyvinyl alcohol (PVA) and Polystyrene (PS) can be used for dielectric layer.
Because only the material itself is flexible, so the soft electrons can choose metal as the conductive layer material, but the soft substrate can generally bear the processing temperature is low, so the metal can be deposited is limited, generally the most silver (6.30 × 107S / m.), Easy to deposit and pattern.If the nano-silver particles into a slurry, whether it is inkjet (Inkjet) or Screen Printing (Screen Printing) processing Methods are applicable to soft electrons.
As for organic conductive polymers, such as oly (p-phenylene vinylene) (PPV), polythiophene, polyaniline (PAN), PEDOT: PSS and other organic materials, the conductivity of up to 300S / cm, although much lower than the metal conductivity, However, the characteristics of these conductive polymer liquids are suitable for printing processing, especially for soft electrons.
Soft semiconductors are the most challenging materials for soft electrons. Inorganic semiconductor materials such as silicon, ZnO, etc. In addition to brittleness, the general process temperature is higher, the soft substrate is more difficult to bear. Organic semiconductor materials is the direction of development, Poly (3-tetradecyllthiophen-2-yl) and thieno'3 (3-hexylthiophene), poly (3-hexylthiophene) , 2-b'thiophene, PBTTT) and other materials have the characteristics of the semiconductor, in addition the use of graphene (Graphene), carbon nanotubes (Carbon nano tube, CNT) or fullerenes (Fullerenes) to modify the organic semiconductor also has many research and development The
Carrier mobility in semiconductor materials is an important factor in the assessment of electronic components response. Figure 7 shows the development of organic semiconductors based on mobility (8). 7 can be seen, the current organic semiconductor carrier mobility is about more than amorphous silicon (amorphous Si, a-Si) level, for applications, has reached the LCD and RFID application specifications, the United Kingdom SmartKem, Germany Plastic Logic are Committed to the organic thin film transistor (Organic Thin Film Transistor, OTFT) research and development, in the material part has some results, equipped with OTFT soft electronic paper has been commercialized, is the main product of Plastic Logic.
