2017 Apple in addition to the iphone X received market attention, the All-in-one computer imac series has both quality, efficiency and product design, especially by the art drawing, design industry favored, supply chain industry, Apple, from September onwards to AMD (AMD) to add high-end graphics processor (GPU) orders, The latter part of the test by the Department of Professional Seal Testing Foundry (OSAT) factory to take down orders, including 2.5D Advanced Packaging process is in the works, full supply of apple, AMD rear fire support. Apple's new imac series uses AMD-supplied GPU, and the super workstation GPU uses 2.5D package, the general imac GPU is covered by a wafer (flip-chip) process package. 2017 imac series high-end GPU-sealed orders were taken by silicon and other industries, in the latter part of the test by the Beijing Yuan Electric assistance, the supply chain industry pointed out that, with the imac new listing plan finalized, the Test factory has fully activated the fire support, including 2.5D, high-end cladding packaging process, will be prosperous until the end of 2017. Amdvega series GPU mainly in GlobalFoundries 14 nm process casting, the next Vega upgrade version still by GlobalFoundries Wafer foundry, however, 7 nm process Navi GPU series from the process of the leading TSMC take orders, Since TSMC is active in the Advanced packaging layout, it will continue to compete with the osat industry at the end of the package. However, stakeholders do not comment on specific customers. At present, the table is sealed by the large-test manufacturers 2.5D IC Packaging Process Market by silicon, day and moon food, and silicon to run the fastest, with TSMC Cowos 2.5D package rival, currently TSMC will cowos locked in AI (AI) core level of supercomputer operation with high-end GPU or FPGA chip. The survey industry believes that TSMC attaches great importance to advanced packaging, 2.5D has become the Osat factory and wafer factory continuous confrontation of the battlefield, TSMC although in the packaging side with the Osat plant competition, but also led the global industry to advanced packaging process technology attention, especially 2.5D is not a new concept, But with the advance of Moore's Law, it is necessary to extend its life by 2.5D and other advanced packaging, and with the heterogeneous integration of high frequency and wide memory, has become a trend. NVIDIA, AMD all hope that the GPU as the future of the operation of the concept of artificial intelligence core, including high-end display card, vehicle platform, cloud computing, and so on, and high frequency wide memory integration packaging technology, will be more favored by the industry. The survey industry said that despite the advanced packaging 2.5D and other products in the capacity can not match the smart phone AP, but advanced packaging can still maintain a good gross profit margin, is also facing the growing scale of the mainland seal testing plant, Taiwan department OSAT Industry must establish the technical threshold. Apple Super Workstation level 27-inch imac Pro, with the Amdvega series Radeon Pro Vega 56, equipped with 8GB HBM2 memory, and can be customized Radeon Pro Vega's GPU, equipped with 16GB HBM2 memory. AMD Radeon Pro Vega operates 3 times times faster than the imac GPU, will provide user virtual reality (VR) higher shadow rate, real-time 3D graph, lifelike effects and high quality gaming experience, can provide 11 megabits per second single-precision floating point operation, 22 trillion times semi precision floating point operation, Equipped with 8GB or 16GB memory, with 400gb/s memory bandwidth.
